2.45 GHz Energy Harvesting On-chip Rectenna in $0.18\ \mu \mathrm{m}$ RF CMOS Process

Author(s):  
Arup Ray ◽  
Arijit De ◽  
Tarun Kanti Bhattacharyya
Electronics ◽  
2020 ◽  
Vol 9 (6) ◽  
pp. 1042
Author(s):  
Peiqing Han ◽  
Zhaofeng Zhang ◽  
Yajun Xia ◽  
Niansong Mei

A low-power dual-mode receiver is presented for ultra-high-frequency (UHF) radio frequency identification (RFID) systems. The reconfigurable architecture of the tag is proposed to be compatible with low-power and high-sensitivity operating modes. The read range of RFID system and the lifetime of the tag are increased by photovoltaic, thermoelectric and RF energy-harvesting topology. The receiver is implemented in a 0.18-μm standard CMOS process and occupies an active area of 0.65 mm × 0.7 mm. For low-power mode, the tag is powered by the rectifier and the sensitivity is −18 dBm. For high-sensitivity mode, the maximum PCE of the fully on-chip energy harvester is 46.5% with over 1-μW output power and the sensitivity is −40 dBm with 880 nW power consumption under the supply voltage of 0.8 V.


Circuit World ◽  
2019 ◽  
Vol 46 (1) ◽  
pp. 32-41
Author(s):  
Deepak Balodi ◽  
Arunima Verma ◽  
Ananta Govindacharyulu Paravastu

Purpose The paper aims to present the novel design approach for a low power LC-voltage-controlled oscillators (VCO) design with low phase noise that too targeted at the most sought band of Bluetooth applications. Owing to their crucial role in a wide variety of modern applications, VCO and phase-locked loop (PLL) frequency synthesizers have been the subject of extensive research in recent years. In fact, VCO is one of the key components being used in a modern PLL to provide local frequency signal since a few decades. The complicated synthesizer requirements imposed by cellular phone applications have been a key driver for PLL research. Design/methodology/approach This paper first opted to present the recent developments on implemented techniques of LC-VCO designs in popular RF bands. An LC-VCO with a differential (cross-coupled) MOS structure is then presented which has aimed to compensate the losses of an on-chip inductor implemented in UMC’s 130 nm RF-CMOS process. The LC-VCO is finally targeted to embed onto the synthesizer chip, to address the narrowband (S-Band) applications where Bluetooth has been the most sought one. The stacked inductor topology has been adopted to get the benefit of its on-chip compatibility and low noise. The active differential architecture, which basically is a cross-coupled NMOS structure, has been then envisaged for the gain which counters the losses completely. Three major areas of LC-VCO design are considered and worked upon for the optimum design parameters, which includes Bluetooth coverage range of 2.410 GHz to 2.490 GHz, better linearity and high sensitivity and finally the most sought phase noise performance for an LC-VCO. Findings The work provides the complete design aspect of a novel LC-VCO design for low phase noise narrowband applications such as Bluetooth. Using tuned MOS varactor, in 130 nm-RF CMOS process, a high gain sensitivity of 194 MHz/Volt was obtained. Thus, the entire frequency range of 2415-2500 MHz for Bluetooth applications, supporting multiple standards from 3G to 5G, was covered by voltage tuning of 0.7-1.0 V. To achieve the low power dissipation, low bias (1.2 V) cross-coupled differential structure was adopted, which completely paid for the losses occurred in the LC resonator. The power dissipation comes out to be 8.56 mW which is a remarkably small value for such a high gain and low noise VCO. For the VCO frequencies in the presented LO-plan, the tank inductor was allowed to have a moderate value of inductance (8 nH), while maintaining a very high Q factor. The LC-VCO of the proposed LO-generator achieved extremely low phase noise of −140 dBc/Hz @ 1 MHz, as compared to the contemporary designs. Research limitations/implications Though a professional tool for inductor and circuit design (ADS-by Keysight Technologies) has been chosen, actual inductor and circuit implementation on silicon may still lead to various parasitic evolutions; therefore, one must have that margin pre-considered while finalizing the design and testing it. Practical implications The proposed LC-VCO architecture presented in this work shows low phase noise and wide tuning range with high gain sensitivity in S-Band, low power dissipation and narrowband nature of wireless applications. Originality/value The on-chip stacked inductor has uniquely been designed with the provided dimensions and other parameters. Though active design is in a conventional manner, its sizing and bias current selection are unique. The pool of results obtained completely preserves the originally to the full extent.


2013 ◽  
Vol 543 ◽  
pp. 176-179 ◽  
Author(s):  
D.Q. Zhao ◽  
Xia Zhang ◽  
P. Liu ◽  
F. Yang ◽  
C. Lin ◽  
...  

In this work we studied the fabrication of a monolithic bimaterial micro-cantilever resonant IR sensor with on-chip drive circuits. The effects of high temperature process and stress induced performance degradation were investigated. The post-CMOS MEMS (micro electro mechanical system) fabrication process of this IR sensor is the focus of this paper, starting from theoretical analysis and simulation, and then moving to experimental verification. The capacitive cantilever structure was fabricated by surface micromachining method, and drive circuits were prepared by standard CMOS process. While the stress introduced by MEMS films, such as the tensile silicon nitride which works as a contact etch stopper layer for MOSFETs and releasing stop layer for the MEMS structure, increases the electron mobility of NMOS, PMOS hole mobility decreases. Moreover, the NMOS threshold voltage (Vth) shifts, and transconductance (Gm) degrades. An additional step of selective removing silicon nitride capping layer and polysilicon layer upon IC area were inserted into the standard CMOS process to lower the stress in MOSFET channel regions. Selective removing silicon nitride and polysilicon before annealing can void 77% Vth shift and 86% Gm loss.


Electronics ◽  
2021 ◽  
Vol 10 (1) ◽  
pp. 68
Author(s):  
Woorham Bae ◽  
Sung-Yong Cho ◽  
Deog-Kyoon Jeong

This paper presents a fully integrated Peripheral Component Interconnect (PCI) Express (PCIe) Gen4 physical layer (PHY) transmitter. The prototype chip is fabricated in a 28 nm low-power CMOS process, and the active area of the proposed transmitter is 0.23 mm2. To enable voltage scaling across wide operating rates from 2.5 Gb/s to 16 Gb/s, two on-chip supply regulators are included in the transmitter. At the same time, the regulators maintain the output impedance of the transmitter to meet the return loss specification of the PCIe, by including replica segments of the output driver and reference resistance in the regulator loop. A three-tap finite-impulse-response (FIR) equalization is implemented and, therefore, the transmitter provides more than 9.5 dB equalization which is required in the PCIe specification. At 16 Gb/s, the prototype chip achieves energy efficiency of 1.93 pJ/bit including all the interface, bias, and built-in self-test circuits.


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