Novel diode-triggered silicon-controlled rectifier (DTSCR) for high-temperature low-voltage electrostatic discharge (ESD) applications

2016 ◽  
Author(s):  
Guo Junxiong ◽  
Liu JiZhi ◽  
Tian Rui ◽  
Zhao Liu ◽  
Liu Zhiwei
Keyword(s):  
High Temperature ◽  
Low Voltage ◽  
Electrostatic Discharge

The Low Voltage Electrostatic Discharge on the Contacting Point

2009 ◽  
Author(s):  
Tetsuji Oda ◽  
Hiraku Miyasaka ◽  
Yuto Ono ◽  
Ryo Ono
Keyword(s):  
Low Voltage ◽  
Electrostatic Discharge

scholarly journals Thin-film chemical expansion of ceria based solid solutions: laser vibrometry study

2021 ◽  
Vol 0 (0) ◽  
Author(s):  
Hendrik Wulfmeier ◽  
Dhyan Kohlmann ◽  
Thomas Defferriere ◽  
Carsten Steiner ◽  
Ralf Moos ◽  
...  
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
High Temperature ◽  
Film Thickness ◽  
Solid Solutions ◽  
Low Voltage ◽  
Excitation Frequency ◽  
Dimensional Change ◽  
Potential Core ◽  
Chemical Expansion

Abstract The chemical expansion of Pr0.1Ce0.9O2–δ (PCO) and CeO2–δ thin films is investigated in the temperature range between 600 °C and 800 °C by laser Doppler vibrometry (LDV). It enables non-contact determination of nanometer scale changes in film thickness at high temperatures. The present study is the first systematic and detailed investigation of chemical expansion of doped and undoped ceria thin films at temperatures above 650 °C. The thin films were deposited on yttria stabilized zirconia substrates (YSZ), operated as an electrochemical oxygen pump, to periodically adjust the oxygen activity in the films, leading to reversible expansion and contraction of the film. This further leads to stresses in the underlying YSZ substrates, accompanied by bending of the overall devices. Film thickness changes and sample bending are found to reach up to 10 and several hundred nanometers, respectively, at excitation frequencies from 0.1 to 10 Hz and applied voltages from 0–0.75 V for PCO and 0–1 V for ceria. At low frequencies, equilibrium conditions are approached. As a consequence maximum thin-film expansion of PCO is expected due to full reduction of the Pr ions. The lower detection limit for displacements is found to be in the subnanometer range. At 800 °C and an excitation frequency of 1 Hz, the LDV shows a remarkable resolution of 0.3 nm which allows, for example, the characterization of materials with small levels of expansion, such as undoped ceria at high oxygen partial pressure. As the correlation between film expansion and sample bending is obtained through this study, a dimensional change of a free body consisting of the same material can be calculated using the high resolution characteristics of this system. A minimum detectable dimensional change of 5 pm is estimated even under challenging high-temperature conditions at 800 °C opening up opportunities to investigate electro-chemo-mechanical phenomena heretofore impossible to investigate. The expansion data are correlated with previous results on the oxygen nonstoichiometry of PCO thin films, and a defect model for bulk ceria solid solutions is adopted to calculate the cation and anion radii changes in the constrained films during chemical expansion. The constrained films exhibit anisotropic volume expansion with displacements perpendicular to the substrate plane nearly double that of bulk samples. The PCO films used here generate high total displacements of several 100 nm’s with high reproducibility. Consequently, PCO films are identified to be a potential core component of high-temperature actuators. They benefit not only from high displacements at temperatures where most piezoelectric materials no longer operate while exhibiting, low voltage operation and low energy consumption.

Robust True LDO Linear Voltage Regulator and Digitally Trimmable Buffered Precision Voltage Reference for High-Temperature, Low-Voltage Applications

2013 ◽  
Vol 2013 (HITEN) ◽  
pp. 000096-000103
Author(s):  
Yoann Dusé ◽  
Fabien Laplace ◽  
Nicolas Joubert ◽  
Xavier Montmayeur ◽  
Noureddine Zitouni ◽  
...  
Keyword(s):  
High Temperature ◽  
Temperature Coefficient ◽  
Low Voltage ◽  
Short Circuit ◽  
Silicon On Insulator ◽  
Voltage Regulator ◽  
Voltage Reference ◽  
Soft Start ◽  
Wide Range ◽  
Latch Up

We present in this paper two new products for high-temperature, low-voltage (2.8V to 5.5V) power management applications. The first product is an original implementation of a monolithic low dropout regulator (XTR70010), able to deliver up to 1A at 230°C with less than 1V of dropout. This new voltage regulator can source an output current level up to 1.5A. The regulated output voltage can be selected among 32 preset values from 0.5V to 3.6V in steps of 100mV, or it can be obtained with a pair of external resistors. The circuit integrates complex analog and digital control blocks providing state of the art features such as UVLO protection, chip enable control, soft start-up and soft shut-down, hiccup short-circuit protection, customer selectable thermal shut-down, input power supply protection, output overshoot remover and stability over an extremely wide range of load capacitances. The circuit offers a fair ±2% absolute accuracy and is guaranteed latch-up free. The second product is an advanced high-temperature, low-power, digitally trimmable voltage reference (XTR75020). Thanks to a custom, 1-wire serial interface, the absolute precision and the temperature coefficient can be adjusted in order to obtain an accuracy better than 0.5% with a temperature coefficient bellow ±20ppm/°C. On-chip OTP memory for trimming of absolute value and temperature coefficient makes the circuit extremely accurate and almost insensitive to drifts over time and temperature. The circuit features a class AB output buffer able to source or sink up to 5mA and remains stable with any load capacitance up to 50μF. The XTR75020 has nine preset possible output voltages. The source and sink short circuit current always remains bellow 25mA. The quiescent current consumption is 300μA typical at 230°C while the standby current is, in all cases, under 20μA. Both devices are designed on a latch-up free silicon-on-insulator process.

A fast and low-voltage Cu complementary-atom-switch 1Mb array with high-temperature retention

2014 ◽  
Author(s):  
N. Banno ◽  
M. Tada ◽  
T. Sakamoto ◽  
M. Miyamura ◽  
K. Okamoto ◽  
...  
Keyword(s):  
High Temperature ◽  
Low Voltage

A 4H-SiC Bipolar Technology for High-Temperature Integrated Circuits

2013 ◽  
Vol 10 (4) ◽  
pp. 155-162 ◽  
Author(s):  
L. Lanni ◽  
B. G. Malm ◽  
C.-M. Zetterling ◽  
M. Östling
Keyword(s):  
High Temperature ◽  
Integrated Circuits ◽  
Low Voltage ◽  
Supply Voltage ◽  
Bipolar Transistors ◽  
Digital Integrated Circuits ◽  
Successful Operation ◽  
Bipolar Technology ◽  
Propagation Delays ◽  
Interconnect Systems

A 4H-SiC bipolar technology suitable for high-temperature integrated circuits is tested with two interconnect systems based on aluminum and platinum. Successful operation of low-voltage bipolar transistors and digital integrated circuits based on emitter coupled logic (ECL) is reported from 27°C up to 500°C for both the metallization systems. When operated on −15 V supply voltage, aluminum and platinum interconnect OR-NOR gates showed stable noise margins of about 1 V and asymmetric propagation delays of about 200 and 700 ns in the whole temperature range for both OR and NOR output. The performance of aluminum and platinum interconnects was evaluated by performing accelerated electromigration tests at 300°C with current density of about 1 MA/cm2 on contact chains consisting of 10 integrated resistors. Although in both cases the contact chains failed after less than one hour, different failure mechanisms were observed for the two metallization systems: electromigration for the aluminum system and poor step coverage and via filling for the platinum system.

A Case for High Temperature, High Voltage SiC Bipolar Devices

2007 ◽  
Vol 556-557 ◽  
pp. 687-692 ◽  
Author(s):  
Anant K. Agarwal
Keyword(s):  
High Temperature ◽  
High Voltage ◽  
Low Voltage ◽  
Schottky Diodes ◽  
Life Time ◽  
Extreme Environment ◽  
Junction Temperature ◽  
Current Gain ◽  
Pin Diodes ◽  
Bipolar Devices

The last three years have seen a rapid growth of 600 V and 1200 V SiC Schottky diodes primarily in the Power Factor Correction (PFC) circuits. The next logical step is introduction of a SiC MOSFET to not only further improve the power density and efficiency of the PFC circuits but also to enable the entry of all SiC power modules in Pulse Width Modulated (PWM) based power converters such as motor control in 600-1200 V range. The combination of SiC MOSFET and Schottky diodes will offer 60-80% lower losses in most low voltage applications at normal operating temperatures (< 200°C) where no significant improvements in packaging are required. This will cover most commercial applications with the exception of those having to function under extreme environment (>200°C) such as applications in automotive, aerospace and oil/gas exploration. For these high temperature applications, a case can be made for 600 - 2000 V Bipolar Junction Transistors (BJTs) and PiN diodes provided we do our homework on high temperature packaging. A number of interesting device related problems persist in bipolar devices such as forward voltage increase in PiN diodes and current gain degradation in BJTs. For very high voltage (>10 kV) applications such as those found in utilities (Transmission and Distribution), Large Drives and Traction, a case can be made for >10 kV PiN diodes, IGBTs, Thyristors and GTOs. While IGBTs will be restricted to <200°C junction temperature, the PiN diodes, Thyristors and GTOs may be operated at >250°C junction temperature provided that the high temperature, high voltage packaging issues are also addressed. Significant progress has been made in the development of the p-channel IGBTs and GTOs. The main issues seem to be the VF degradation due to stacking fault formation and improvement of minority carrier life-time.

scholarly journals Ac loss modelling and measurement of superconducting transformers with coated-conductor Roebel-cable in low-voltage winding

2021 ◽  
Author(s):  
E Pardo ◽  
M Staines ◽  
Zhenan Jiang ◽  
N Glasson
Keyword(s):  
High Temperature ◽  
High Voltage ◽  
High Temperature Superconductor ◽  
Low Voltage ◽  
Ac Loss ◽  
Power Transformers ◽  
Coated Conductor ◽  
Real Power ◽  
Transformer Design ◽  
Loss Modelling

Power transformers using a high temperature superconductor (HTS) ReBCO coated conductor and liquid nitrogen dielectric have many potential advantages over conventional transformers. The ac loss in the windings complicates the cryogenics and reduces the efficiency, and hence it needs to be predicted in its design, usually by numerical calculations. This article presents detailed modelling of superconducting transformers with Roebel cable in the low-voltage (LV) winding and a high-voltage (HV) winding with more than 1000 turns. First, we model a 1 MVA 11 kV/415 V 3-phase transformer. The Roebel cable solenoid forming the LV winding is also analyzed as a stand-alone coil. Agreement between calculations and experiments of the 1 MVA transformer supports the model validity for a larger tentative 40 MVA 110 kV/11 kV 3-phase transformer design. We found that the ac loss in each winding is much lower when it is inserted in the transformer than as a stand-alone coil. The ac loss in the 1 and 40 MVA transformers is dominated by the LV and HV windings, respectively. Finally, the ratio of total loss over rated power of the 40 MVA transformer is reduced below 40% of that of the 1 MVA transformer. In conclusion, the modelling tool in this work can reliably predict the ac loss in real power applications. This is the Accepted Manuscript version of an article accepted for publication in 'Superconductor Science and Technology'. IOP Publishing Ltd is not responsible for any errors or omissions in this version of the manuscript or any version derived from it. The Version of Record is available online at https://doi.org/10.1088/0953-2048/28/11/114008.

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