Modeling of temperature frequency-compensation of doped silicon MEMS resonator

The purpose of image reconstruction is to determine the mass densities within molecules by analysis of the intensities within images. Cryo-EM offers this possibility by virtue of the excellent preservation of internal structure without heavy atom staining. Cryo-EM images, however, have low contrast because of the similarity between the density of biological material and the density of vitreous ice. The images also contain a high background of inelastic scattering. To overcome the low signal and high background, cryo-images are typically recorded 1-3 μm underfocus to maximize phase contrast. Under those conditions the image intensities bear little resemblance to the object, due to the dependence of the contrast transfer function (CTF) upon spatial frequency. Compensation (i.e., correction) for the CTF is theoretically possible, but implementation has been rare. Despite numerous studies of molecules in ice, there has never been a quantitative evaluation of compensated images of biological molecules of known structure.

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High-resolution transmission electron microscopic study of highly oxygen doped silicon layer

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100155438 ◽

1989 ◽

Vol 47 ◽

pp. 692-693

Author(s):

H. Takaoka ◽

M. Tomita ◽

T. Hayashi

Keyword(s):

High Resolution ◽

Oxygen Concentration ◽

Silicon Layer ◽

Detailed Structure ◽

Electron Microscopic ◽

Cross Sectional ◽

Transmission Electron ◽

Doped Silicon ◽

Argon Ion

High resolution transmission electron microscopy (HRTEM) is the effective technique for characterization of detailed structure of semiconductor materials. Oxygen is one of the important impurities in semiconductors. Detailed structure of highly oxygen doped silicon has not clearly investigated yet. This report describes detailed structure of highly oxygen doped silicon observed by HRTEM. Both samples prepared by Molecular beam epitaxy (MBE) and ion implantation were observed to investigate effects of oxygen concentration and doping methods to the crystal structure.The observed oxygen doped samples were prepared by MBE method in oxygen environment on (111) substrates. Oxygen concentration was about 1021 atoms/cm3. Another sample was silicon of (100) orientation implanted with oxygen ions at an energy of 180 keV. Oxygen concentration of this sample was about 1020 atoms/cm3 Cross-sectional specimens of (011) orientation were prepared by argon ion thinning and were observed by TEM at an accelerating voltage of 400 kV.

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Determination of arsenic atom distribution arsenic doped silicon using HOLZ-line analysis

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100167342 ◽

1996 ◽

Vol 54 ◽

pp. 976-977

Author(s):

Y. Kikuchi ◽

N. Hashikawa ◽

F. Uesugi ◽

E. Wakai ◽

K. Watanabe ◽

...

Keyword(s):

Inelastic Scattering ◽

Zone Axis ◽

Experimental Result ◽

Background Intensity ◽

Crystal Thickness ◽

Arsenic Atom ◽

Doped Silicon ◽

P Type ◽

Line Analysis

In order to measure the concentration of arsenic atoms in nanometer regions of arsenic doped silicon, the HOLZ analysis is carried out underthe exact [011] zone axis observation. In previous papers, it is revealed that the position of two bright lines in the outer SOLZ structures on the[011] zone axis is little influenced by the crystal thickness and the background intensity caused by inelastic scattering electrons, but is sensitive to the concentration of As atoms substitutbnal for Siatomic site.As the result, it becomes possible to determine the concentration of electrically activated As atoms in silicon within an observed area by means of the simple fitting between experimental result and dynamical simulatioan. In the present work, in order to investigate the distribution of electrically activated As in silicon, the outer HOLZ analysis is applied using a nanometer sized probe of TEM equipped with a FEG.Czodiralsld-gown<100>orientated p-type Si wafers with a resistivity of 10 Ώ cm are used for the experiments.TheAs+ implantation is performed at a dose of 5.0X1015cm-2at 25keV.

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Preparation of integrated circuits for TEM electromigration in situ studies

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100145753 ◽

1986 ◽

Vol 44 ◽

pp. 882-883

Author(s):

J. V. Maskowitz ◽

W. E. Rhoden ◽

D. R. Kitchen ◽

R. E. Omlor ◽

P. F. Lloyd

Keyword(s):

Integrated Circuits ◽

Crystallographic Orientation ◽

Silicon Wafers ◽

Minimum Size ◽

Test Vehicle ◽

In Situ Studies ◽

Boron Doped ◽

Doped Silicon ◽

Drill Holes

The fabrication of the aluminum bridge test vehicle for use in the crystallographic studies of electromigration involves several photolithographic processes, some common, while others quite unique. It is most important to start with a clean wafer of known orientation. The wafers used are 7 mil thick boron doped silicon. The diameter of the wafer is 1.5 inches with a resistivity of 10-20 ohm-cm. The crystallographic orientation is (111).Initial attempts were made to both drill and laser holes in the silicon wafers then back fill with photoresist or mounting wax. A diamond tipped dentist burr was used to successfully drill holes in the wafer. This proved unacceptable in that the perimeter of the hole was cracked and chipped. Additionally, the minimum size hole realizable was > 300 μm. The drilled holes could not be arrayed on the wafer to any extent because the wafer would not stand up to the stress of multiple drilling.

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