Bonding mechanism in the Velcro concept Si-Si low temperature direct bonding technique

Author(s):  
Shervin Keshavarzi ◽  
Ulrich Mescheder ◽  
Holger Reinecke
2010 ◽  
Vol 2010 (DPC) ◽  
pp. 001221-001252 ◽  
Author(s):  
Kei Murayama ◽  
Mitsuhiro Aizawa ◽  
Mitsutoshi Higashi

The bonding technique for High density Flip Chip(F.C.) packages requires a low temperature and a low stress process to have high reliability of the micro joining ,especially that for sensor MEMS packages requires hermetic sealing so as to ensure their performance. The Transient Liquid Phase (TLP) bonding, that is a kind of diffusion bonding is a technique that connects the low melting point material such as Indium to the higher melting point metal such as Gold by the isothermal solidification and high-melting-point intermetallic compounds are formed. Therefore, it is a unique joining technique that can achieve not only the low temperature bonding and also the high temperature reliability. The Gold-Indium TLP bonding technique can join parts at 180 degree C and after bonding the melting point of the junction is shifted to more than 495 degree C, therefore itfs possible to apply the low temperature bonding lower than the general use as a lead free material such as a SAC and raise the melting point more than AuSn solder which is used for the high temperature reliability usage. Therefore, the heat stress caused by bonding process can be expected to be lowered. We examined wafer bonding and F.C bonding plus annealing technique by using electroplated Indium and Gold as a joint material. We confirmed that the shear strength obtained at the F.C. bonding plus anneal technique was equal with that of the wafer bonding process. Moreover, it was confirmed to ensure sufficient hermetic sealing in silicon cavity packages that had been bonded at 180 degree C. And the difference of the thermal stress that affect to the device by the bonding process was confirmed. In this paper, we report on various possible application of the TLP bonding.


2012 ◽  
Vol 2012 (DPC) ◽  
pp. 002543-002566
Author(s):  
Daniel Harris ◽  
Robert Dean ◽  
Ashish Palkar ◽  
Mike Palmer ◽  
Charles Ellis ◽  
...  

Low–temperature bonding techniques are of great importance in fabricating MEMS devices, and especially for sealing microfluidic MEMS devices that require encapsulation of a liquid. Although fusion, thermocompression, anodic and eutectic bonding have been successfully used in fabricating MEMS devices, they require temperatures higher than the boiling point of commonly used fluids in MEMS devices such as water, alcohols and ammonia. Although adhesives and glues have been successfully used in this application, they may contaminate the fluid in the MEMS device or the fluid may prevent suitable bonding. Indium (In) possesses the unusual property of being cold weldable. At room temperature, two sufficiently clean In surfaces can be cold welded by bringing them into contact with sufficient force. The bonding technique developed here consists of coating and patterning one Si wafer with 500A Ti, 300A Ni and 1 μm In through electron beam evaporation. A second wafer is metallized and patterned with a 500A Ti and 1 μm Cu by electron beam evaporation and then electroplated with 10 μm of In. Before the In coated sections are brought into contact, the In surfaces are chemically cleaned to remove indium-oxide. Then the sections are brought into contact and held under sufficient pressure to cold weld the sections together. Using this technique, MEMS water-filled and mercury-filled microheatpipes were successfully fabricated and tested. Additionally, this microfabrication technique is useful for fabricating other types of MEMS devices that are limited to low-temperature microfabrication processes.


2015 ◽  
Vol 69 (6) ◽  
pp. 79-88 ◽  
Author(s):  
R. He ◽  
M. Fujino ◽  
A. Yamauchi ◽  
T. Suga

2012 ◽  
Vol 34 (8) ◽  
pp. 1327-1329 ◽  
Author(s):  
Wen-Jie Liu ◽  
Xiao-Long Hu ◽  
Jiang-Yong Zhang ◽  
Guo-En Weng ◽  
Xue-Qin Lv ◽  
...  

2016 ◽  
Vol 5 (7) ◽  
pp. P419-P424 ◽  
Author(s):  
Ran He ◽  
Masahisa Fujino ◽  
Akira Yamauchi ◽  
Yinghui Wang ◽  
Tadatomo Suga

Effectiveness of Recycling of steel plant waste is very much dependent on agglomeration technique. Sintering, pelletization and briquetting are some of the techniques which are frequently used for waste utilization. Aim of this study is to prepare composite briquettes by cold bonding technique, by which phsico-chemical changesoccurred at room temperature or low temperature. Two binders are mixed in proportion to achieve the required properties specifically strength and shatter index. The design of experiments is used to find the proper combination of binders to get the optimum value of properties. Experimental work for the same is carried out in such a way that minimum number of experiment can give output as desired. For this ‘Design of Experiment’ methodology is applied to select the runs of experiment. After the selection of orthogonal array and experiment combinations, Taguchi technique is used with two variable (starch and molasses) and three levels (2.5%, 5% and 7.5% of each) i.e. L9 Array to analyze the results. Minitab15 software is used. Conclusion and comments are based on the same.


2014 ◽  
Vol 53 (4S) ◽  
pp. 04EB04 ◽  
Author(s):  
Bui Thanh Tung ◽  
Fumiki Kato ◽  
Naoya Watanabe ◽  
Shunsuke Nemoto ◽  
Katsuya Kikuchi ◽  
...  

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