A novel graphene nanoribbon field effect transistor for integrated circuit design

Author(s):  
Yaser Mohammadi Banadaki ◽  
Ashok Srivastava
2021 ◽  
Vol 2021 (HiTEC) ◽  
pp. 000118-000122
Author(s):  
S. Perez ◽  
A.M. Francis ◽  
J. Holmes ◽  
T. Vrotsos

Abstract Presented is a temperature and geometry scalable 800°C Silicon Carbide (SiC) Junction Field Effect Transistor (JFET) compact device model designed to simulate the small signal effects of the SiC JFET-R process developed by NASA Glenn Research Center. With the JFET-R process pushing the temperature limits of integrated circuits, a high-fidelity device model capable of predicting the performance over temperature and geometry is required to realize the thermal ruggedness this process provides. A high temperature (HT) packaging system was utilized to characterize a SiC JFET device up to 800°C with a dwell time of 9 hours during a single test. Invaluable device characterization data was obtained and utilized to extend the device model presented to simulate SiC JFET performance continuously over 800°C.


2020 ◽  
Vol 2020 ◽  
pp. 1-7
Author(s):  
Mathan Natarajamoorthy ◽  
Jayashri Subbiah ◽  
Nurul Ezaila Alias ◽  
Michael Loong Peng Tan

The development of the nanoelectronics semiconductor devices leads to the shrinking of transistors channel into nanometer dimension. However, there are obstacles that appear with downscaling of the transistors primarily various short-channel effects. Graphene nanoribbon field-effect transistor (GNRFET) is an emerging technology that can potentially solve the issues of the conventional planar MOSFET imposed by quantum mechanical (QM) effects. GNRFET can also be used as static random-access memory (SRAM) circuit design due to its remarkable electronic properties. For high-speed operation, SRAM cells are more reliable and faster to be effectively utilized as memory cache. The transistor sizing constraint affects conventional 6T SRAM in a trade-off in access and write stability. This paper investigates on the stability performance in retention, access, and write mode of 15 nm GNRFET-based 6T and 8T SRAM cells with that of 16 nm FinFET and 16 nm MOSFET. The design and simulation of the SRAM model are simulated in synopsys HSPICE. GNRFET, FinFET, and MOSFET 8T SRAM cells give better performance in static noise margin (SNM) and power consumption than 6T SRAM cells. The simulation results reveal that the GNRFET, FinFET, and MOSFET-based 8T SRAM cells improved access static noise margin considerably by 58.1%, 28%, and 20.5%, respectively, as well as average power consumption significantly by 97.27%, 99.05%, and 83.3%, respectively, to the GNRFET, FinFET, and MOSFET-based 6T SRAM design.


2020 ◽  
Vol 9 (12) ◽  
pp. 121006
Author(s):  
Md. Azizul Hasan ◽  
Sadiq Shahriyar Nishat ◽  
Mainul Hossain ◽  
Sharnali Islam

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