Optical IMEMS/sup /spl reg//-a fabrication process for MEMS optical switches with integrated on-chip electronics

2004 ◽  
Author(s):  
T.J. Brosnihan ◽  
S.A. Brown ◽  
A. Brogan ◽  
C.S. Gormley ◽  
D.J. Collins ◽  
...  
Keyword(s):  
Optical Switches ◽  
Fabrication Process ◽  
On Chip

Integration of lateral porous silicon membranes into planar microfluidics

Lab on a Chip ◽  
2015 ◽  
Vol 15 (3) ◽  
pp. 833-838 ◽  
Author(s):  
Thierry Leïchlé ◽  
David Bourrier
Keyword(s):  
Porous Silicon ◽  
Fabrication Process ◽  
Microfluidic Channels ◽  
Dead End ◽  
Silicon Membranes ◽  
On Chip ◽  
Mesoporous Membranes

A unique fabrication process was developed to integrate lateral porous silicon membranes into planar microfluidic channels. These mesoporous membranes were demonstrated to be suitable for on-chip dead-end microfiltration.

A Novel Scheme for Wide Bandwidth Chip-to-Chip Communications

2007 ◽  
Vol 4 (1) ◽  
pp. 1-7 ◽  
Author(s):  
Qing Liu ◽  
Patrick Fay ◽  
Gary H. Bernstein
Keyword(s):  
Integrated Circuits ◽  
Coplanar Waveguide ◽  
Impedance Matching ◽  
Three Dimensional ◽  
Fabrication Process ◽  
Silicon Substrates ◽  
Electromagnetic Simulations ◽  
Communication Paradigm ◽  
On Chip ◽  
Test Chips

Quilt Packaging (QP), a novel chip-to-chip communication paradigm for system-in-package integration, is presented. By forming protruding metal nodules along the edges of the chips and interconnecting integrated circuits (ICs) through them, QP offers an approach to ameliorate the I/O speed bottleneck. A fabrication process that includes deep reactive ion etching, electroplating, and chemical-mechanical polishing is demonstrated. As a low-temperature process, it can be easily integrated into a standard IC fabrication process. Three-dimensional electromagnetic simulations of coplanar waveguide QP structures have been performed, and geometries intended to improve impedance matching at the interface between the on-chip interconnects and the chip-to-chip nodule structures were evaluated. Test chips with 100 μm wide nodules were fabricated on silicon substrates, and s-parameters of chip-to-chip interconnects were measured. The insertion loss of the chip-to-chip interconnects was as low as 0.2 dB at 40 GHz. Simulations of 20 μm wide QP structures suggest that the bandwidth of the inter-chip nodules is expected to be above 200 GHz.

scholarly journals Versatile and Automated 3D Polydimethylsiloxane (PDMS) Patterning for Large-Scale Fabrication of Organ-on-Chip (OOC) Components

Proceedings ◽  
2018 ◽  
Vol 2 (13) ◽  
pp. 873
Author(s):  
Nikolas Gaio ◽  
Sebastiaan Kersjes ◽  
William Quiros Solano ◽  
Pasqualina Sarro ◽  
Ronald Dekker
Keyword(s):  
Large Scale ◽  
Silicon Wafers ◽  
Fabrication Process ◽  
Microfluidic Channels ◽  
3D Structures ◽  
3 Dimensional ◽  
Ic Packaging ◽  
Thin Membranes ◽  
On Chip

We present a reproducible process to directly pattern 3-Dimensional (3D) polydimethylsiloxane (PDMS) structures for Organ-on-Chips (OOC) via automated molding. The presented process employs a commercially available system from IC packaging improving the fabrication process for microfluidic channels and thin membranes, which are components frequently used in OOCs. The process removes the manual steps used previously in the fabrication of microfluidic channels and improves the control over the thickness of the PDMS layers. The process was also employed to fabricate and pattern thin PDMS membranes on silicon wafers, without the use of lithography and etching steps and in combination with 3D structures. The use of foil assisted molding techniques presented in this work is an important step toward the large-scale manufacturing of OOCs.

scholarly journals Controllable Polarization of Lasing Emission From a Polymer Microfiber Laser

2019 ◽  
Vol 9 (1) ◽  
Author(s):  
Van Duong Ta ◽  
Rui Chen ◽  
Handong Sun
Keyword(s):  
Optical Sensors ◽  
Transverse Magnetic ◽  
Optical Switches ◽  
Pulse Excitation ◽  
Whispering Gallery ◽  
Low Threshold ◽  
Output Laser ◽  
On Chip ◽  
Doped Polymer ◽  
Lasing Modes

AbstractMicrolasers with controllable polarization of output emission are vital for on-chip optical communications, optical sensors and optical switches. In this work, we report a high quality (Q) factor, low-threshold polymer microfiber laser and the possibility of achieving laser emission with a desired polarization. The microfiber is fabricated by direct drawing from a dye-doped polymer solution and it can generate whispering gallery mode (WGM) lasing under optical pulse excitation. When the microfiber is pumped from the side with pumping direction perpendicular to the microfiber’s axis, the polarization direction of the output laser is found to be the same as that of the pump laser. Lasing emission with either transverse electric (TE) or transverse magnetic (TM) modes can be obtained and these two polarization states can be switched over by tuning the pumping laser. Furthermore, emission with both TE and TM modes can also be observed by changing the orientation of the microfiber relatively to pumping direction. Our finding provides an effective approach for achieving microlasers that have high Q lasing modes with anticipated polarization.

On-Chip RF Pulse Power Detector Using FIB as a Post-CMOS Fabrication Process

2006 ◽  
Vol 26 (1) ◽  
pp. 103-109
Author(s):  
Woochul Jeon ◽  
Todd M. Firestone ◽  
John C. Rodgers ◽  
John Melngailis
Keyword(s):  
Pulse Power ◽  
Fabrication Process ◽  
Power Detector ◽  
Rf Pulse ◽  
On Chip

scholarly journals Actively Tunable Terahertz Switches Based on Subwavelength Graphene Waveguide

Nanomaterials ◽  
2018 ◽  
Vol 8 (9) ◽  
pp. 665 ◽  
Author(s):  
Zhongyi Guo ◽  
Xiaoru Nie ◽  
Fei Shen ◽  
Hongping Zhou ◽  
Qingfeng Zhou ◽  
...  
Keyword(s):  
Communication Technology ◽  
Optical Communication ◽  
Methacrylic Acid ◽  
Optical Switching ◽  
Optical Switches ◽  
Graphene Monolayer ◽  
Single Input ◽  
Graphene Devices ◽  
On Chip ◽  
Transmission Direction

As a new field of optical communication technology, on-chip graphene devices are of great interest due to their active tunability and subwavelength scale. In this paper, we systematically investigate optical switches at frequency of 30 THz, including Y-branch (1 × 2), X-branch (2 × 2), single-input three-output (1 × 3), two-input three-output (2 × 3), and two-input four-output (2 × 4) switches. In these devices, a graphene monolayer is stacked on the top of a PMMA (poly methyl methacrylate methacrylic acid) dielectric layer. The optical response of graphene can be electrically manipulated; therefore, the state of each channel can be switched ON and OFF. Numerical simulations demonstrate that the transmission direction can be well manipulated in these devices. In addition, the proposed devices possess advantages of appropriate ON/OFF ratios, indicating the good performance of graphene in terahertz switching. These devices provide a new route toward terahertz optical switching.

Electro-Fluidic Packaging for CMOS Based Laboratory-on-Chips

2006 ◽  
Author(s):  
Ebrahim Ghafar-Zadeh ◽  
Mohamad Sawan ◽  
Daniel Therriault
Keyword(s):  
Epoxy Resin ◽  
High Precision ◽  
Three Dimensional ◽  
Fabrication Process ◽  
Moderate Temperature ◽  
Direct Write ◽  
Deposition Technique ◽  
Experimental Section ◽  
Cmos Chip ◽  
On Chip

Direct-write fabrication process (DWFP) is a robotic deposition technique used to produce planar or three-dimensional (3D) microscale structures. These structures consist of paste-like filaments which are extruded through a micronozzle and deposited on a substrate [1]. These filaments are encapsulated inside an epoxy resin and then melted and removed by applying a moderate temperature for the creation of microfluidic components (e.g., microchannels, reservoirs). Following our previous reports [2–3] on the fabrication of microchannels by DWFP and high precision CMOS capacitive sensors [4], we present in this paper a microfluidic packaging procedure to realize microchannel and fluidic connections on top of CMOS chip. The compatibility of this fluidic packaging procedure with conventional electrical packaging techniques (e.g. wire bonding) is an important advantage of DWFP for CMOS based Laboratory-On-Chip applications. The fabrication challenges are discussed in the experimental section.

Highly flexible all-solid-state microsupercapacitors for on chip applications using a transfer-free fabrication process

2022 ◽  
Vol 520 ◽  
pp. 230779
Author(s):  
B. Dousti ◽  
S. Babu ◽  
N. Geramifard ◽  
M.Y. Choi ◽  
J.B. Lee ◽  
...  
Keyword(s):  
Solid State ◽  
Fabrication Process ◽  
On Chip
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