Copper wire based electrical contacts for direct interfacing of stretchable sensors

2020 ◽  
Author(s):  
Leonardo A. Garcia-Garcia ◽  
Julio C. Costa ◽  
Pasindu Lugoda ◽  
Daniel Roggen ◽  
Niko Munzenrieder
Keyword(s):  
Copper Wire ◽  
Electrical Contacts ◽  
Stretchable Sensors

scholarly journals Effect of Applied Pressure on the Electrical Resistance of Carbon Nanotube Fibers

Materials ◽  
2021 ◽  
Vol 14 (9) ◽  
pp. 2106
Author(s):  
Chris J. Barnett ◽  
James D. McGettrick ◽  
Varun Shenoy Gangoli ◽  
Ewa Kazimierska ◽  
Alvin Orbaek White ◽  
...  
Keyword(s):  
Photoelectron Spectroscopy ◽  
Electrical Resistance ◽  
Copper Wire ◽  
Applied Pressure ◽  
Radial Strain ◽  
Electrical Current ◽  
Electrical Contacts ◽  
Electrical Performance ◽  
Macro Scale ◽  
Carbon Nanotube Fibers

Carbon nanotubes (CNTs) can be spun into fibers as potential lightweight replacements for copper in electrical current transmission since lightweight CNT fibers weigh <1/6th that of an equivalently dimensioned copper wire. Experimentally, it has been shown that the electrical resistance of CNT fibers increases with longitudinal strain; however, although fibers may be under radial strain when they are compressed during crimping at contacts for use in electrical current transport, there has been no study of this relationship. Herein, we apply radial stress at the contact to a CNT fiber on both the nano- and macro-scale and measure the changes in fiber and contact resistance. We observed an increase in resistance with increasing pressure on the nanoscale as well as initially on the macro scale, which we attribute to the decreasing of axial CNT…CNT contacts. On the macro scale, the resistance then decreases with increased pressure, which we attribute to improved radial contact due to the closing of voids within the fiber bundle. X-ray photoelectron spectroscopy (XPS) and UV photoelectron spectroscopy (UPS) show that applied pressure on the fiber can damage the π–π bonding, which could also contribute to the increased resistance. As such, care must be taken when applying radial strain on CNT fibers in applications, including crimping for electrical contacts, lest they operate in an unfavorable regime with worse electrical performance.

Effect of Current Polarity on Tribological Behavior of Copper-Aluminum Electrical Interface

2007 ◽  
Author(s):  
Dinesh Bansal ◽  
Andriy Kovalchenko ◽  
Jeffrey Streator ◽  
Steven Danyluk
Keyword(s):  
Large Scale ◽  
Copper Wire ◽  
Electrical Contacts ◽  
Material Transfer ◽  
Surface Design ◽  
Wear And Friction ◽  
Sliding Electrical Contacts ◽  
Copper Aluminum ◽  
Current Polarity ◽  
Sliding Distance

Wear and friction in sliding electrical contacts is affected by a multitude of factors such as contact load, current density, sliding speed, sliding distance and materials in contact [1], [2]. Very limited studies have been done to investigate the effect of current polarity on wear and coefficient of friction. In the present study, the authors investigate the effect of current polarity on the frictional response and wear of copper-aluminum interface. Copper wire mounted on a fixture is slid on aluminum flat under different current levels. Large scale melting at the interface was observed when slider (copper) was maintained as anode. Observations of the slider and flat surface made under microscope reveal material transfer of aluminum on copper even at low current levels of 60 Amperes. The results of the study can be used in the light of applying different coatings or surface design for anode and cathode in order to minimize their wear or degradation.

Numerical Study on Stress Distribution in Ultrasonically Welded Electrical Contacts used in Automotives

2018 ◽  
Vol 10 (4) ◽  
Author(s):  
J. Pradeep Kumar ◽  
M.S. Arun Kumar ◽  
N. Gowsalya Devi ◽  
M. Naveen Kumar ◽  
S.M. Pavith Raja
Keyword(s):  
Numerical Study ◽  
Theoretical Calculations ◽  
Copper Wire ◽  
Electrical Contact ◽  
Welding Process ◽  
Electrical Contacts ◽  
Copper Sheet ◽  
Element Analysis ◽  
Ultrasonic Metal Welding ◽  
Metal Welding

Numerical stress analysis while joining an electrical contact comprising of copper wire and copper sheet using ultrasonic metal welding process is vital in many of the automotive applications. During ultrasonic metal welding, shear and normal force act at the interface between the welded specimens. These forces are the result of ultrasonic vibrations transmitted by Sonotrode onto the welded specimens. In this work, the distribution of the stress developed at the interface and the correlation of the developed stress with strength of joint are studied. The theoretical stress values are determined using various levels of ultrasonic metal welding process parameters such as clamping force, vibration amplitude and weld time to validate the results of stress obtained from finite element analysis. The results of stress from numerical analysis are found to be in good agreement with that of results obtained from the theoretical calculations.

Scanning and Transmission Electron Microscopy of Endomentrium in Women Wearing TCu-380-A IUD 's

1977 ◽  
Vol 35 ◽  
pp. 666-667
Author(s):  
A. Gonzalez Angulo ◽  
R. Berlioz ◽  
R. Aznar
Keyword(s):  
Copper Wire ◽  
Uterine Cavity ◽  
Morphological Evidence ◽  
Secretory Phase ◽  
Ultrastructural Studies ◽  
Proliferative Phase ◽  
Contraceptive Devices ◽  
Transmission Electron ◽  
Intrauterine Contraceptive ◽  
Myelin Figure

Recent ultrastructural studies on endometrial tissues from women wearing copper, wire intrauterine devices have disclosed morphological evidence of impaired glycogen degradation and secretion resulting in interference with the viability of blastocysts. Reduced microapocrine secretion observed with the scanning electron microscope supports this (1). In addition, organelle modifications have been observed in the epithelial cells of these women. The changes are seen in biopsies taken in the proliferative phase of the cycle and consist of mitochondrial vacuolation and myelin figure formation. These modifications disappear in the secretory phase and therefore have been regarded as reversible (2).The aim of the present studies was to investigate surface epithelial changes as well as organelle modifications in relation to the site of contact with an IUD that releases greater amounts of copper. Endometrial tissue was obtained from the uterine cavity of four young women wearing TCu-380-A intrauterine contraceptive devices for 4-6 weeks.

TEM characterization of Au/Polysilicon interactions

1990 ◽  
Vol 48 (4) ◽  
pp. 650-651
Author(s):  
N. David Theodore ◽  
Leslie H. Allen ◽  
C. Barry Carter ◽  
James W. Mayer
Keyword(s):  
Solid Phase ◽  
Single Crystal Silicon ◽  
Chemical Vapor ◽  
Electrical Contacts ◽  
Silicon Substrates ◽  
Crystal Silicon ◽  
Transmission Electron ◽  
Polysilicon Films ◽  
The Stability

Metal/polysilicon investigations contribute to an understanding of issues relevant to the stability of electrical contacts in semiconductor devices. These investigations also contribute to an understanding of Si lateral solid-phase epitactic growth. Metals such as Au, Al and Ag form eutectics with Si. reactions in these metal/polysilicon systems lead to the formation of large-grain silicon. Of these systems, the Al/polysilicon system has been most extensively studied. In this study, the behavior upon thermal annealing of Au/polysilicon bilayers is investigated using cross-section transmission electron microscopy (XTEM). The unique feature of this system is that silicon grain-growth occurs at particularly low temperatures ∽300°C).Gold/polysilicon bilayers were fabricated on thermally oxidized single-crystal silicon substrates. Lowpressure chemical vapor deposition (LPCVD) at 620°C was used to obtain 100 to 400 nm polysilicon films. The surface of the polysilicon was cleaned with a buffered hydrofluoric acid solution. Gold was then thermally evaporated onto the samples.

Reduction of AC Copper Loss in Rectangular Copper Wire using Magnetic Path Control Technology

2020 ◽  
Vol 140 (7) ◽  
pp. 364-371
Author(s):  
Kenta Torishima ◽  
Kazuhiro Shimura ◽  
Mitsuhide Sato ◽  
Tsutomu Mizuno
Keyword(s):  
Copper Wire ◽  
Control Technology ◽  
Copper Loss ◽  
Path Control

CRM MOLYBDENUM-50 RHENIUM

Alloy Digest ◽  
1970 ◽  
Vol 19 (12) ◽  
Keyword(s):  
Corrosion Resistance ◽  
High Temperature ◽  
Powder Metallurgy ◽  
Melting Point ◽  
Physical Properties ◽  
Heat Treating ◽  
Electrical Contacts ◽  
High Melting ◽  
High Melting Point ◽  
Temperature Performance

Abstract CRM MOLYBDENUM-50 RHENIUM is a high-melting-point alloy for applications such as electronics tube components, electrical contacts, thermionic converters, thermocouples, heating elements and rocket thrusters. All products are produced by powder metallurgy. This datasheet provides information on composition, physical properties, hardness, elasticity, and tensile properties as well as creep. It also includes information on high temperature performance and corrosion resistance as well as forming, heat treating, machining, joining, and surface treatment. Filing Code: Mo-11. Producer or source: Chase Brass & Copper Company Inc..

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