Development of Mold Compounds With Ultralow Coefficient of Thermal Expansion and High Glass Transition Temperature for Fan-Out Wafer-Level Packaging

2015 ◽  
Vol 5 (7) ◽  
pp. 921-929 ◽  
Author(s):  
Vinicio Carias ◽  
Jeffrey Thompson ◽  
Philip D. Myers ◽  
Prashant Kumar ◽  
Livia M. Racz ◽  
...  
Keyword(s):  
Thermal Expansion ◽  
Glass Transition ◽  
Transition Temperature ◽  
Glass Transition Temperature ◽  
Coefficient Of Thermal Expansion ◽  
High Glass Transition Temperature ◽  
Wafer Level ◽  
Wafer Level Packaging

Highly transparent polyhydroxyimide/TiO2 and ZrO2 hybrid films with high glass transition temperature (Tg) and low coefficient of thermal expansion (CTE) for optoelectronic application

2017 ◽  
Vol 5 (33) ◽  
pp. 8444-8453 ◽  
Author(s):  
Shun-Wen Cheng ◽  
Tzu-Tien Huang ◽  
Chia-Liang Tsai ◽  
Guey-Sheng Liou
Keyword(s):  
Thermal Expansion ◽  
Glass Transition ◽  
Transition Temperature ◽  
Glass Transition Temperature ◽  
Thermal Expansion Coefficient ◽  
Coefficient Of Thermal Expansion ◽  
High Glass Transition Temperature ◽  
Hybrid Films ◽  
Optoelectronic Application ◽  
Low Thermal Expansion

Highly transparent polyhydroxyimide/TiO2 and ZrO2 hybrids films with high glass transition temperature and low thermal expansion coefficient for optoelectronic application.

Thermal Relaxations of Polymers Revealed by Reversing and Non-Reversing Coefficient of Thermal Expansion

2010 ◽  
Vol 123-125 ◽  
pp. 451-454
Author(s):  
Robert A. Shanks
Keyword(s):  
Thermal Expansion ◽  
Glass Transition ◽  
Transition Temperature ◽  
Glass Transition Temperature ◽  
Thermal Expansion Coefficient ◽  
Structural Changes ◽  
Coefficient Of Thermal Expansion ◽  
Modulated Temperature ◽  
Heating And Cooling ◽  
Modulated Temperature Dsc

Reversible and irreversible events can be resolved) using modulated temperature DSC and TMA. Each technique has advantages, those for TMA include longer times and slower scan rates that allow greater approach to material equilibrium. The thermal expansion coefficient and glass transition temperature can be isolated from relaxations and structural changes. Modulated temperature thermomechanometry (mT-TM) is used to characterize amorphous thermoplastics including PS, PMMA, PC and PPO, and the results including annealing, heating and cooling.

The Effect of Li2O and B2O3 on Thermal Properties and Chemical Solubility of Low-Fusing Dental Porcelain

2005 ◽  
Vol 284-286 ◽  
pp. 917-920
Author(s):  
Dae Jin Ko ◽  
Kyoung Nam Kim ◽  
Yong Keun Lee ◽  
B.H. Kim ◽  
Kwang Mahn Kim
Keyword(s):  
Thermal Expansion ◽  
Glass Transition ◽  
Thermal Properties ◽  
Transition Temperature ◽  
Glass Transition Temperature ◽  
Coefficient Of Thermal Expansion ◽  
Softening Temperature ◽  
Glass Frit ◽  
Dental Porcelain ◽  
Alkali Oxides

Alkali oxides were added to glass frit in order to lower the firing temperature of dental porcelain, and the effects of Li2O and B2O3 on the thermal properties and chemical solubility of low-fusing dental porcelain were investigated. The glass transition temperature(Tg) and softening temperature(Ts) of glass frits were decreased remarkably by adding Li2O, but the coefficient of thermal expansion(CTE) was increased with Li2O. In the case of adding B2O3, the thermal properties were unchanged. Tg of B0L4, B2L4 and B4L4 specimens were lower than 500°C and Ts were lower than 550°C. The chemical solubility of prepared low-fusing dental porcelain with these glass frits were 37.3, 43.9, and 49.2µg·cm-2 respectively. The chemical solubility was increased by adding Li2O and B2O3, but all the results were below 100µg·cm-2 and satisfactory to ISO Standards. Further, the chemical solubility of the commercial low-fusing dental porcelains were 52.6µg·cm-2 for Ceramco Finesse(Clear), 70.8µg·cm-2 for Duceram-LFC(TC) and that of conventional dental porcelain, CeraMax(T-C), was 34.8µg·cm-2.

scholarly journals Thermal expansion and structural properties of some (PbO)x(ZnO)35−x(TeO2)65 glasses

2021 ◽  
Vol 3 (4) ◽  
Author(s):  
Jiri Schwarz ◽  
Helena Ticha
Keyword(s):  
Thermal Expansion ◽  
Glass Transition ◽  
Transition Temperature ◽  
Glass Transition Temperature ◽  
Coefficient Of Thermal Expansion ◽  
Prediction Methods ◽  
Structural Units ◽  
Linear Coefficient ◽  
Melting Method ◽  
Experimental Values

AbstractThe glasses (PbO)x(ZnO)35−x(TeO2)65 with 0 < x < 25 were prepared by conventional melting method. The substitution of ZnO by PbO leads to a decrease in the glass transition temperature (Tg) from 338 to 280 °C and an increase in the linear coefficient of thermal expansion (α) from 15.8 to 19.2 ppm K−1. A correlation between α and Tg has been confirmed by the Lindemann rule. The two prediction methods of the coefficient of thermal expansion (α) were compared with experimental values: the simple additivity model and the Mackenzie method. From Raman spectra, it is evident that the substitution of ZnO by PbO leads mainly to the conversion of TeO4 structural units to TeO3 structural units. This conversion leads to network depolymerization.

High-temperature carbon plastics based on thermoreactive polyimide binder

2020 ◽  
pp. 89-102
Author(s):  
M. I. Valueva ◽  
I. V. Zelenina ◽  
M. A. Zharinov ◽  
M. A. Khaskov
Keyword(s):  
Glass Transition ◽  
High Temperature ◽  
Transition Temperature ◽  
Glass Transition Temperature ◽  
Strength Properties ◽  
High Glass Transition Temperature ◽  
Reinforced Plastics ◽  
Carbon Plastics ◽  
Fundamental Possibility ◽  
Fiber Reinforced Plastics

The article presents results of studies of experimental carbon plastics based on thermosetting PMRpolyimide binder. Сarbon fiber reinforced plastics (CFRPs) are made from prepregs prepared by melt and mortar technologies, so the rheological properties of the polyimide binder were investigated. The heat resistance of carbon plastics was researched and its elastic-strength characteristics were determined at temperatures up to 320°С. The fundamental possibility of manufacturing carbon fiber from prepregs based on polyimide binder, obtained both by melt and mortar technologies, is shown. CFRPs made from two types of prepregs have a high glass transition temperature: 364°C (melt) and 367°C (solution), with this temperature remaining at the 97% level after boiling, and also at approximately the same (86–97%) level of conservation of elastic strength properties at temperature 300°С.

scholarly journals Cure Kinetics Modeling of a High Glass Transition Temperature Epoxy Molding Compound (EMC) Based on Inline Dielectric Analysis

Polymers ◽  
2021 ◽  
Vol 13 (11) ◽  
pp. 1734
Author(s):  
Erick Franieck ◽  
Martin Fleischmann ◽  
Ole Hölck ◽  
Larysa Kutuzova ◽  
Andreas Kandelbauer
Keyword(s):  
Glass Transition ◽  
Transition Temperature ◽  
Glass Transition Temperature ◽  
Kinetic Parameters ◽  
Measurement Techniques ◽  
Process Conditions ◽  
Dielectric Analysis ◽  
High Glass Transition Temperature ◽  
General Process ◽  
Molding Compound

We report on the cure characterization, based on inline monitoring of the dielectric parameters, of a commercially available epoxy phenol resin molding compound with a high glass transition temperature (>195 °C), which is suitable for the direct packaging of electronic components. The resin was cured under isothermal temperatures close to general process conditions (165–185 °C). The material conversion was determined by measuring the ion viscosity. The change of the ion viscosity as a function of time and temperature was used to characterize the cross-linking behavior, following two separate approaches (model based and isoconversional). The determined kinetic parameters are in good agreement with those reported in the literature for EMCs and lead to accurate cure predictions under process-near conditions. Furthermore, the kinetic models based on dielectric analysis (DEA) were compared with standard offline differential scanning calorimetry (DSC) models, which were based on dynamic measurements. Many of the determined kinetic parameters had similar values for the different approaches. Major deviations were found for the parameters linked to the end of the reaction where vitrification phenomena occur under process-related conditions. The glass transition temperature of the inline molded parts was determined via thermomechanical analysis (TMA) to confirm the vitrification effect. The similarities and differences between the resulting kinetics models of the two different measurement techniques are presented and it is shown how dielectric analysis can be of high relevance for the characterization of the curing reaction under conditions close to series production.

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