Thermal Contact Resistance and Thermal Conductivity of a Carbon Nanofiber

2005 ◽  
Vol 128 (3) ◽  
pp. 234-239 ◽  
Author(s):  
Choongho Yu ◽  
Sanjoy Saha ◽  
Jianhua Zhou ◽  
Li Shi ◽  
Alan M. Cassell ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Resistance ◽  
Contact Resistance ◽  
Carbon Nanofiber ◽  
Thermal Contact ◽  
Mean Free Path ◽  
Total Thermal Resistance ◽  
Temperature Range ◽  
High Temperature Heat Treatment ◽  
Platinum Coating

We have measured the thermal resistance of a 152‐nm-diameter carbon nanofiber before and after a platinum layer was deposited on the contacts between the nanofiber and the measurement device. The contact resistance was reduced by the platinum coating for about 9–13% of the total thermal resistance of the nanofiber sample before the platinum coating. At a temperature of 300K, the axial thermal conductivity of the carbon nanofiber is about three times smaller than that of graphite fibers grown by pyrolysis of natural gas prior to high-temperature heat treatment, and increases with temperature in the temperature range between 150K and 310K. The phonon mean free path was found to be about 1.5nm and approximately temperature-independent. This feature and the absence of a peak in the thermal conductivity curve indicate that phonon-boundary and phonon-defect scattering dominate over phonon-phonon Umklapp scattering for the temperature range.

Thermal Contact Resistance and Thermal Conductivity of a Carbon Nanofiber

2005 ◽  
Author(s):  
Choongho Yu ◽  
Li Shi ◽  
Alan M. Cassell ◽  
Brett A. Cruden ◽  
Quoc Ngo ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Contact Resistance ◽  
Thermal Contact Resistance ◽  
Carbon Nanofiber ◽  
Thermal Contact ◽  
Chemical Vapor ◽  
Chemical Vapor Deposition Method ◽  
High Temperature Heat Treatment ◽  
Graphite Fibers ◽  
Platinum Layer

We have used a microfabricated device to measure the thermal contact resistance between a 152-nm-diameter carbon nanofiber and the measurement device, and found that heat conduction models based on Fourier’s law can underestimate the thermal contact resistance at the nanoscale constriction if a large reduction in the effective thermal conductivity of the constriction is not taken into account. With the thermal contact resistance reduced by the deposition of a platinum layer on the contact, we observed that the thermal conductivity of the carbon nanofiber grown by using a plasma enhanced chemical vapor deposition method is comparable to that of graphite fibers grown by pyrolysis of natural gas prior to high-temperature heat treatment.

scholarly journals Measurement of the Thermophysical Properties of Anisotropic Insulation Materials with Consideration of the Effect of Thermal Contact Resistance

Materials ◽  
2020 ◽  
Vol 13 (6) ◽  
pp. 1353 ◽  
Author(s):  
Dongxu Han ◽  
Kai Yue ◽  
Liang Cheng ◽  
Xuri Yang ◽  
Xinxin Zhang
Keyword(s):  
Thermal Conductivity ◽  
Thermal Resistance ◽  
Contact Resistance ◽  
Thermal Contact Resistance ◽  
Thermal Contact ◽  
Thermal Contact Conductance ◽  
Maximum Deviation ◽  
Insulation Materials ◽  
Steady State Method ◽  
Different Temperatures

A novel method involving the effect of thermal contact resistance (TCR) was proposed using a plane heat source smaller than the measured samples for improving measurement accuracy of the simultaneous determination of in-plane and cross-plane thermal conductivities and the volumetric heat capacity of anisotropic materials. The heat transfer during the measurement process was mathematically modeled in a 3D Cartesian coordinate system. The temperature distribution inside the sample was analytically derived by applying Laplace transform and the variables separation method. A multiparameter estimation algorithm was developed on the basis of the sensitivity analysis of the parameters to simultaneously estimate the measured parameters. The correctness of the algorithm was verified by performing simulation experiments. The thermophysical parameters of insulating materials were experimentally measured using the proposed method at different temperatures and pressures. Fiber glass and ceramic insulation materials were tested at room temperature. The measured results showed that the relative error was 1.6% less than the standard value and proved the accuracy of the proposed method. The TCRs measured at different pressures were compared with those obtained using the steady-state method, and the maximum deviation was 8.5%. The thermal conductivity obtained with the contact thermal resistance was smaller than that without the thermal resistance. The measurement results for the anisotropic silica aerogels at different temperatures and pressures revealed that the thermal conductivity and thermal contact conductance increased as temperature and pressure increased.

Translation-rotation coupling and heat transfer in orientationally-disordered phase of CCl4

Open Physics ◽  
2006 ◽  
Vol 4 (2) ◽  
Author(s):  
Oleg Pursky ◽  
Vyacheslav Konstantinov
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Thermal Resistance ◽  
Free Path ◽  
Phonon Scattering ◽  
Mean Free Path ◽  
Mobility Edge ◽  
Total Thermal Resistance ◽  
Disordered Phase ◽  
Diffusive Modes

AbstractThe isochoric thermal conductivity of an orientationally-disordered phase of CCl4 is analysed within a model in which heat is transferred by phonons and above the phonon mobility edge by ”diffusive” modes migrating randomly from site to site. The mobility edge ω0 is found from the condition that the phonon mean-free path cannot become smaller than half the phonon wavelength. The contributions of phonon-phonon, one-, and two-phonon scattering to the total thermal resistance of solid CCl4 are calcualted under the assumption that the different scattering mechanisms contribute additively. An increase in the isochoric thermal conductivity with temperature is explained by suppression of phonon scattering at rotational excitations due to a decrease in correlation in the rotation of neighbouring molecules.

Study on Thermal Contact Resistance for Heat Transfer of High Power LED Packaging

2011 ◽  
Vol 199-200 ◽  
pp. 1477-1481
Author(s):  
Guo Tao Ren ◽  
Kai Lin Pan ◽  
Wei Tao Zhu ◽  
Jiao Pin Wang ◽  
Jing Huang
Keyword(s):  
Heat Transfer ◽  
Thermal Resistance ◽  
Contact Resistance ◽  
High Power ◽  
Thermal Contact Resistance ◽  
Thermal Contact ◽  
Fem Simulation ◽  
Total Thermal Resistance ◽  
Simulation And Experiment ◽  
Thermal Transient

Thermal contact resistance is one of key technologies for heat transfer of high power light emitting diodes (LED) packaging. In this paper, based on the resistance network model of LED packaging, a 3-D finite element simulation model (FEM) is established and thermal transient testing experiments are also performed by Thermal Transient tester (T3Ster). Experiment date indicates thermal contact resistance for 48% of the total thermal resistance. The thermal interface material (TIM) layer of high power LED packaging is studied to analysis thermal contact resistance which impacts on thermal performance of LED packaging. The total thermal resistance and the thermal resistance of TIM layer are separately calculated from simulation and experiment. To the resistance of TIM layer, the result of experiment is only a 1% error compared to the result of FEM simulation. Therefore, The FEM simulation and experiment are mutually validated. In order to thoroughly study on thermal contact resistance, based on the principle of structure function, thermal resistance of three different types of TIM layer between metal core printed circuit board (MCPCB) and aluminum heat sink are measured and compared. Experiment results indicate that the quality of interface affects the thermal contact resistance to a great extent.

High‐Temperature Skin Softening Materials Overcoming the Trade‐Off between Thermal Conductivity and Thermal Contact Resistance

Small ◽  
2021 ◽  
pp. 2102128
Author(s):  
Taehun Kim ◽  
Seongkyun Kim ◽  
Eungchul Kim ◽  
Taesung Kim ◽  
Jungwan Cho ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
High Temperature ◽  
Contact Resistance ◽  
Thermal Contact Resistance ◽  
Thermal Contact ◽  
Trade Off

scholarly journals Noncured Graphene Thermal Interface Materials for High-Power Electronics: Minimizing the Thermal Contact Resistance

Nanomaterials ◽  
2021 ◽  
Vol 11 (7) ◽  
pp. 1699
Author(s):  
Sriharsha Sudhindra ◽  
Fariborz Kargar ◽  
Alexander A. Balandin
Keyword(s):  
Contact Resistance ◽  
High Power ◽  
Thermal Contact Resistance ◽  
Thermal Contact ◽  
Wide Band ◽  
Thermal Interface Material ◽  
Thermal Interface Materials ◽  
Total Thermal Resistance ◽  
Thermal Interface ◽  
Interface Materials

We report on experimental investigation of thermal contact resistance, RC, of the noncuring graphene thermal interface materials with the surfaces characterized by different degree of roughness, Sq. It is found that the thermal contact resistance depends on the graphene loading, ξ, non-monotonically, achieving its minimum at the loading fraction of ξ ~15 wt %. Decreasing the surface roughness by Sq~1 μm results in approximately the factor of ×2 decrease in the thermal contact resistance for this graphene loading. The obtained dependences of the thermal conductivity, KTIM, thermal contact resistance, RC, and the total thermal resistance of the thermal interface material layer on ξ and Sq can be utilized for optimization of the loading fraction of graphene for specific materials and roughness of the connecting surfaces. Our results are important for the thermal management of high-power-density electronics implemented with diamond and other wide-band-gap semiconductors.

Through-Plane Thermal Conductivity of PEMFC Porous Transport Layers

2010 ◽  
Vol 8 (2) ◽  
Author(s):  
Odne S. Burheim ◽  
Jon G. Pharoah ◽  
Hannah Lampert ◽  
Preben J. S. Vie ◽  
Signe Kjelstrup
Keyword(s):  
Thermal Conductivity ◽  
Contact Resistance ◽  
Thermal Contact Resistance ◽  
Thermal Contact ◽  
Residual Water ◽  
Order Of Magnitude ◽  
Thermal Conductivities

We report the through-plane thermal conductivities of the several widely used carbon porous transport layers (PTLs) and their thermal contact resistance to an aluminum polarization plate. We report these values both for wet and dry samples and at different compaction pressures. We show that depending on the type of PTL and the existence of residual water, the thermal conductivity of the materials varies from 0.15 W K−1 m−1 to 1.6 W K−1 m−1, one order of magnitude. This behavior is the same for the contact resistance varying from 0.8 m2 K W−1 to 11×10−4 m2 K W−1. For dry PTLs, the thermal conductivity decreases with increasing polytetrafluorethylene (PTFE) content and increases with residual water. These effects are explained by the behavior of air, water, and PTFE in between the PTL fibers. It is also found that Toray papers of differing thickness exhibit different thermal conductivities.

Characterizing Bulk Thermal Conductivity and Interface Contact Resistance Effects of Thermal Interface Materials in Electronic Cooling Applications

2003 ◽  
Author(s):  
Vadim Gektin ◽  
Sai Ankireddi ◽  
Jim Jones ◽  
Stan Pecavar ◽  
Paul Hundt
Keyword(s):  
Thermal Conductivity ◽  
Thermal Resistance ◽  
Contact Resistance ◽  
Thermal Performance ◽  
Electronic Cooling ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Interface Contact ◽  
Interface Materials ◽  
Bulk Thermal Conductivity

Thermal Interface Materials (TIMs) are used as thermally conducting media to carry away the heat dissipated by an energy source (e.g. active circuitry on a silicon die). Thermal properties of these interface materials, specified on vendor datasheets, are obtained under conditions that rarely, if at all, represent real life environment. As such, they do not accurately portray the material thermal performance during a field operation. Furthermore, a thermal engineer has no a priori knowledge of how large, in addition to the bulk thermal resistance, the interface contact resistances are, and, hence, how much each influences the cooling strategy. In view of these issues, there exists a need for these materials/interfaces to be characterized experimentally through a series of controlled tests before starting on a thermal design. In this study we present one such characterization for a candidate thermal interface material used in an electronic cooling application. In a controlled test environment, package junction-to-case, Rjc, resistance measurements were obtained for various bondline thicknesses (BLTs) of an interface material over a range of die sizes. These measurements were then curve-fitted to obtain numerical models for the measured thermal resistance for a given die size. Based on the BLT and the associated thermal resistance, the bulk thermal conductivity of the TIM and the interface contact resistance were determined, using the approach described in the paper. The results of this study permit sensitivity analyses of BLT and its effect on thermal performance for future applications, and provide the ability to extrapolate the results obtained for the given die size to a different die size. The suggested methodology presents a readily adaptable approach for the characterization of TIMs and interface/contact resistances in the industry.

scholarly journals Effects of pressure and temperature on thermal contact resistance between different materials

2015 ◽  
Vol 19 (4) ◽  
pp. 1369-1372 ◽  
Author(s):  
Zhe Zhao ◽  
Hai-Ming Huang ◽  
Qing Wang ◽  
Song Ji
Keyword(s):  
Thermal Conductivity ◽  
Contact Resistance ◽  
Thermal Contact Resistance ◽  
Experimental Approach ◽  
Phenolic Resin ◽  
Thermal Conductivity Coefficient ◽  
Thermal Contact ◽  
Carbon Composites ◽  
Interfacial Temperature ◽  
Temperature And Pressure

To explore whether pressure and temperature can affect thermal contact resistance, we have proposed a new experimental approach for measurement of the thermal contact resistance. Taking the thermal contact resistance between phenolic resin and carbon-carbon composites, cuprum, and aluminum as the examples, the influence of the thermal contact resistance between specimens under pressure is tested by experiment. Two groups of experiments are performed and then an analysis on influencing factors of the thermal contact resistance is presented in this paper. The experimental results reveal that the thermal contact resistance depends not only on the thermal conductivity coefficient of materials, but on the interfacial temperature and pressure. Furthermore, the thermal contact resistance between cuprum and aluminum is more sensitive to pressure and temperature than that between phenolic resin and carbon-carbon composites.

Thermal Conductivity Measurements of Nylon 11-Carbon Nanofiber Nanocomposites

2005 ◽  
Author(s):  
Antonette T. Cummings ◽  
Li Shi ◽  
Joseph H. Koo
Keyword(s):  
Thermal Conductivity ◽  
Thermal Contact Resistance ◽  
Carbon Nanofiber ◽  
Thermal Contact ◽  
Conductivity Measurements ◽  
Fire Retardancy ◽  
Commercial Use ◽  
Transmission Electron ◽  
Nylon 11 ◽  
Microscopy Images

Nylon 11, a popular material for commercial use, has been combined with low-percent loads of carbon nanofibers (CNFs) to tailor mechanical, fire retardancy, and thermal properties. Transmission electron microscopy images show that the CNFs are randomly aligned in the polymer matrix. We show that the thermal conductivity is minimized at a certain percent loading of CNFs due to a large thermal contact resistance between the CNFs and the medium.

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