Self-Cooling Cavity Burs for Surgical Drills

2007 ◽  
Vol 1 (4) ◽  
pp. 293-296 ◽  
Author(s):  
Calvin C. Silverstein

In a self-cooled drill, an especially designed bur is used to transport heat generated at the cutting edge into the handpiece, where it is dissipated into an air heat sink. The bur contains a sealed cavity partially filled with water, which transports heat via the principle of rotating heat pipe technology. The heat transport capability of burs fitted out as rotating heat pipes was established. A conceptual design for a representative bur was prepared, based on surgical drill sculpting criteria. It appears that a self-cooled surgical drill for sculpting can limit bone temperatures below levels for the initiation of thermal damage in bone, nerve, and brain tissue, without the need to employ an externally applied coolant.

Author(s):  
Z. R. Lin ◽  
Z. Y. Lee ◽  
L. W. Zhang ◽  
S. F. Wang ◽  
A. A. Merrikh ◽  
...  

Loop heat pipe (LHP) is a highly efficient cooling device. It has gained great attention in the electronics cooling industry due to its superior heat transport capability — that is, its ability to carry heat over long distances. For this article, a miniature flat loop heat pipe (MFLHP) with rectangular-shaped evaporator was developed. The LHP’s evaporator was combined with the compensation chamber. MFLHPs with different diameters and lengths for the connecting pipeline were selected for a series of experimental studies on their heat transfer characteristics. In these experiments, pure water was used as the working fluid. The studies showed that the heat transport capability of a MFLHP with 4 mm diameter was better than that a MFLHP with 3 mm diameter. At a low thermal resistance of 0.04°C /W (at 200W), an optimal length for the connecting pipeline for a particular MFLHP with 4 mm diameter was identified. Finally, a heat sink attached to a MFLHP was developed for cooling a graphics processing unit (GPU), the thermal design power (TDP) of which was 200 W. The results showed the GPU heat sink with MFLHP had good performance and satisfied GPU cooling requirements. Compared to the conventional heat pipe solutions, only one MFLHP was able to cope with high power dissipation, offering the potential to make a lighter heat sink.


Author(s):  
K. Fumoto ◽  
M. Kawaji

New experimental results have been obtained on the enhancement of heat transport by a pulsating heat pipe (PHP) using a self-rewetting fluid. Self-rewetting fluids have a property that the surface tension increases with temperature unlike other common liquids. The increasing surface tension at a higher temperature could cause the liquid to be drawn towards a heated surface if a dry spot appears, and improving boiling heat transfer. In the present experiments, 1-butanol was added to water at a concentration of less than 1 wt% to make the self-rewetting fluid. A pulsating heat pipe made from an extruded multi-port tube was partially filled with the butanol-water mixture and tested for its heat transport capability at different input power levels. The experiments showed that the maximum heat transport capability was enhanced by a factor of four when the maximum heater temperature was limited to 120 °C. Thus, the use of a self-rewetting fluid in a PHP has been shown to be highly effective in improving the heat transport capability of pulsating heat pipes.


Author(s):  
H. Peter J. de Bock ◽  
Kripa Varanasi ◽  
Pramod Chamarthy ◽  
Tao Deng ◽  
Ambarish Kulkarni ◽  
...  

The performance of electronic devices is limited by the capability to remove heat from these devices. A heat pipe is a device to facilitate heat transport that has seen increased usage to address this challenge. A heat pipe is a two-phase heat transfer device capable of transporting heat with minimal temperature gradient. An important component of a heat pipe is the wick structure, which transports the condensate from the condenser to the evaporator. The requirements for high heat transport capability and high resilience to external accelerations leads to the necessity of a design trade off in the wick geometry. This makes the wick performance a critical parameter in the design of heat pipes. The present study investigates experimental methods of testing capillary performance of wick structures ranging from micro- to nano-scales. These techniques will facilitate a pathway to the development of nano-engineered wick structures for high performance heat pipes.


1998 ◽  
Vol 120 (4) ◽  
pp. 1064-1071 ◽  
Author(s):  
J. M. Ha ◽  
G. P. Peterson

The original analytical model for predicting the maximum heat transport capacity in micro heat pipes, as developed by Cotter, has been re-evaluated in light of the currently available experimental data. As is the case for most models, the original model assumed a fixed evaporator region and while it yields trends that are consistent with the experimental results, it significantly overpredicts the maximum heat transport capacity. In an effort to provide a more accurate predictive tool, a semi-empirical correlation has been developed. This modified model incorporates the effects of the temporal intrusion of the evaporating region into the adiabatic section of the heat pipe, which occurs as the heat pipe approaches dryout conditions. In so doing, the current model provides a more realistic picture of the actual physical situation. In addition to incorporating these effects, Cotter’s original expression for the liquid flow shape factor has been modified. These modifications are then incorporated into the original model and the results compared with the available experimental data. The results of this comparison indicate that the new semiempirical model significantly improves the correlation between the experimental and predicted results and more accurately represents the actual physical behavior of these devices.


Author(s):  
Nannan Zhao ◽  
Benwei Fu ◽  
Hongbin Ma ◽  
Fengmin Su

The heat transport capability in an oscillating heat pipe (OHP) significantly depends on the oscillating frequency. An external frequency directly affects the natural frequency in the system. In this investigation, the ultrasound sound effect on the heat transport capability in an OHP was conducted with focus on the ultrasonic frequency effect on the oscillating motion and heat transfer capacity in an OHP. The ultrasonic sound was applied to the evaporating section of the OHP by using the electrically-controlled piezoelectric ceramics. The heat pipe was tested with or without the ultrasonic sound with different frequencies. In addition, the effects of operating temperature, heat load from 25 W to 150 W were investigated. The experimental results demonstrate that the heat transfer capacity enhancement of the OHP depends on the frequency of the ultrasound field, and there exists an optimum combination of the frequencies which will lead to the largest enhancement of the heat transfer capacity of the OHP.


2010 ◽  
Vol 132 (3) ◽  
Author(s):  
Koji Fumoto ◽  
Masahiro Kawaji ◽  
Tsuyoshi Kawanami

This paper discusses a pulsating heat pipe (PHP) using a self-rewetting fluid. Unlike other common liquids, self-rewetting fluids have the property that the surface tension increases with temperature. The increasing surface tension at a higher temperature can cause the liquid to be drawn toward a heated surface if a dry spot appears and thus to improve boiling heat transfer. In experiments, 1-butanol and 1-pentanol were added to water at a concentration of less than 1 wt % to make self-rewetting fluid. A pulsating heat pipe made from an extruded multiport tube was partially filled with the self-rewetting fluid water mixture and tested for its heat transport capability at different input power levels. The experiments showed that the maximum heat transport capability was enhanced by a factor of 4 when the maximum heater temperature was limited to 110°C. Thus, the use of a self-rewetting fluid in a PHP was shown to be highly effective in improving the heat transport capability of pulsating heat pipes.


Volume 3 ◽  
2004 ◽  
Author(s):  
R. Kempers ◽  
A. Robinson ◽  
C. Ching ◽  
D. Ewing

A study was performed to experimentally characterize the effect of fluid loading on the heat transport performance of wicked heat pipes. In particular, experiments were performed to characterize the performance of heat pipes with insufficient fluid to saturate the wick and excess fluid for a variety of orientations. It was found that excess working fluid in the heat pipe increased the thermal resistance of the heat pipe, but increased maximum heat flux through the pipe in a horizontal orientation. The thermal performance of the heat pipe was reduced when the amount of working fluid was less than required to saturate the wick, but the maximum heat flux through the heat pipe was significantly reduced at all orientations. It was also found in this case the performance of this heat pipe deteriorated once dry-out occurred.


Author(s):  
Garrett A. Glover ◽  
Yongguo Chen ◽  
Annie Luo ◽  
Herman Chu

The current work is a survey of applied applications of passive 2-phase technologies, such as heat pipe and vapor chamber, in heat sink designs with thin base for electronic cooling. The latest improvements of the technologies and manufacturing processes allow achievable heat sink base thickness of 3 mm as compared to around 5 mm previously. The key technical challenge has been on maintaining structural integrity for adequate hollow space for the working fluid vapor in order to retain high performance while reducing the thickness of the overall vapor chamber or flattened heat pipe. Several designs of thin vapor chamber base heat sink and embedded heat pipe heat sink from different vendors are presented for a moderate power density application of a 60 W, 13.2 mm square heat source. Numerous works have been published by both academia and commercial applications in studying the fundamental science of passive 2-phase flow technologies; their performance has been compared to solid materials, like aluminum and copper. These works have established the merits of using heat pipes and vapor chambers in electronic cooling. The intent of this paper is to provide a methodical approach to help to accelerate the process in evaluating the arrays of different commercial designs of these devices in our product design cycle. In this paper, the trade-offs between the different types of technologies are discussed for parameters such as performance advantages, physical attributes, and some cost considerations. This is a bake-off evaluation of the complete heat sink solutions from the various vendors and not a fundamental research of vapor chambers and heat pipes — for that, it is best left to the vendors and universities.


Author(s):  
Victor Adrian Chiriac

The transient thermal behavior of a complex testing system including multiple fans, a mixing enclosure, Cu inserts and a leaded package dissipating large amounts of power over short time durations is evaluated via numerical simulations. The system performance is optimized with heat sink/fan structure for device efficient operation under constant powering. The study provides meaningful understanding and prediction of a transient powering scenario at high powering levels, evaluating the impact of alternative cooling fan/heat pipe configurations on the thermal performance of the system. One design is chosen due to its effective thermal performance and assembly simplicity, with the package embedded in heat sink base with multiple (5) heat pipes. The peak temperature reached by the modified design with 4 cooling fans is ∼95°C, with the corresponding Rja thermal resistance ∼0.58°C/W. For the transient study (with embedded heat pipes and 4 fans), after one cycle, both peak temperature (at 45 s) and the end temperature (at 49 s) decrease as compared to the previous no heat pipe/single fan case (especially the end temperature reduces by ∼16%). The temperature drop between peak and end for each cycle is ∼80.2°C, while the average power per transient cycle is ∼31.27W. With this power, the design with 5 perpendicular heat pipes, 4 fans and insert reaches a steady state peak temperature of ∼98°C. Applying the superposition principle, the maximum transient temperature after a large number of operating cycles will not exceed ∼138.1°C, satisfying the thermal budget under the current operating conditions. The benefit of the study is related to the possibility to extract the maximum/minimum temperatures for a real test involving a large number of heating-cooling cycles, yet maintaining the initial and peak temperatures within a certain range for the optimal operation of the device. The flow and heat transfer fields are thoroughly investigated: using a combination of numerical and analytical study, the thermal performance of the device undergoing large number of periodic thermal cycles is predicted. Further comparison between measurement and simulation results reveals good agreement.


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