Parametric Studies for Thermal Design of Surface Mounted Components of Standard Electronic Modules

1992 ◽  
Vol 114 (3) ◽  
pp. 300-304 ◽  
Author(s):  
A. Hadim ◽  
N. J. Nagurny
Keyword(s):  
Software Package ◽  
Network Models ◽  
Thermal Design ◽  
Design Parameters ◽  
Network Analyzer ◽  
Thermal Network ◽  
Carrier Materials ◽  
Parametric Studies ◽  
Carrier Size ◽  
Cavity Floor

Parametric studies are performed on heat transfer in surface-mounted components of conduction cooled Standard Electronic Modules (SEMs). Thermal network models are developed for the various components that are used in the SEMs. The models are validated by comparing the results with available experimental results from various test modules. An interfacing software package for thermal analysis (IN-STAN) is used to generate the thermal network representations of the models and a thermal network analyzer is used to perform the analysis. Several studies are performed to analyze the effects of important thermal design parameters including: chip and carrier size, cavity floor thickness, air gap thickness, die and carrier materials, and solder material.

scholarly journals Parameter estimation for externally simulated thermal network models

2019 ◽  
Vol 191 ◽  
pp. 200-210 ◽  
Author(s):  
O.M. Brastein ◽  
B. Lie ◽  
R. Sharma ◽  
N.-O. Skeie
Keyword(s):  
Parameter Estimation ◽  
Network Models ◽  
Thermal Network

Microprocessor Silicon Die Temperature Prediction by Simplified Boundary Conditions

2015 ◽  
Author(s):  
Koji Nishi ◽  
Tomoyuki Hatakeyama ◽  
Shinji Nakagawa ◽  
Masaru Ishizuka
Keyword(s):  
Heat Transfer ◽  
Heat Conduction ◽  
Boundary Conditions ◽  
Thermal Resistance ◽  
Hot Spot ◽  
Three Dimensional ◽  
Thermal Design ◽  
Target Temperature ◽  
One Dimensional ◽  
Thermal Network

The thermal network method has a long history with thermal design of electronic equipment. In particular, a one-dimensional thermal network is useful to know the temperature and heat transfer rate along each heat transfer path. It also saves computation time and/or computation resources to obtain target temperature. However, unlike three-dimensional thermal simulation with fine pitch grids and a three-dimensional thermal network with sufficient numbers of nodes, a traditional one-dimensional thermal network cannot predict the temperature of a microprocessor silicon die hot spot with sufficient accuracy in a three-dimensional domain analysis. Therefore, this paper introduces a one-dimensional thermal network with average temperature nodes. Thermal resistance values need to be obtained to calculate target temperature in a thermal network. For this purpose, thermal resistance calculation methodology with simplified boundary conditions, which calculates thermal resistance values from an analytical solution, is also introduced in this paper. The effectiveness of the methodology is explored with a simple model of the microprocessor system. The calculated result by the methodology is compared to a three-dimensional heat conduction simulation result. It is found that the introduced technique matches the three-dimensional heat conduction simulation result well.

Sensitivity of thermal design parameters for space spectral imaging apparatus

2012 ◽  
Vol 20 (6) ◽  
pp. 1208-1217
Author(s):  
郭亮 GUO Liang ◽  
吴清文 WU Qing-wen ◽  
颜昌翔 YAN Chang-xiang
Keyword(s):  
Spectral Imaging ◽  
Thermal Design ◽  
Design Parameters

Application of Thermal Network Models for Analysis and Design of Superconducting Cable Components

2017 ◽  
Vol 27 (4) ◽  
pp. 1-5 ◽  
Author(s):  
Shiva Charan Indrakanti ◽  
Jin-Geun Kim ◽  
Chul H. Kim ◽  
Sastry V. Pamidi
Keyword(s):  
Network Models ◽  
Analysis And Design ◽  
Thermal Network

Practical Study of Application of Thermal Network Method to Thermal Design of Electronic Equipment: An Example for the Thermal Design of a Compact Self-Ballasted Fluorescent Lamp

2006 ◽  
Author(s):  
Masaru Ishizuka ◽  
Shinji Nakagawa ◽  
Katsuhiro Koizumi
Keyword(s):  
Network Model ◽  
Simulation Method ◽  
Thermal Design ◽  
Fluorescent Lamp ◽  
Simulated Model ◽  
Thermal Network ◽  
Fluorescent Lamps ◽  
Network Method ◽  
Thermal Network Method ◽  
Good Agreement

Thermal design is one of the most important issues in the development of compact self—ballasted fluorescent lamps as the demand for small yet powerful lamps is mounting. This paper proposes a simulation method that is based on a thermal network model for which a set of equations are developed. Some of the coefficients of the thermal network equations were determined experimentally using a simulated model lamp. The calculated temperatures are in good agreement with the measured temperatures. The work illustrates the usefulness of the proposed methodology in the design of compact self—ballasted fluorescent lamps.

Thermal Analysis of MEMS Actuator Performance

2007 ◽  
Author(s):  
Harita Machiraju ◽  
Bill Infantolino ◽  
Bahgat Sammakia ◽  
Michael Deeds
Keyword(s):  
Power Reduction ◽  
Silicon On Insulator ◽  
Design Parameters ◽  
Experimental Measurements ◽  
Device Layer ◽  
Conduction Path ◽  
Element Analysis ◽  
Parametric Studies ◽  
Actuator Performance ◽  
Good Agreement

A MEMS based device consisting of microactuators was modeled using finite element analysis. The temperature profile of the complete package was obtained and compared to experimental measurements. Good agreement was found between the modeling and measurements. Parametric studies of potential design parameters of the chip package to decrease the power requirements to the actuators have been studied. Increasing the gap between the handle layer and the device layer of the SOI (silicon on insulator) chip from 2 to 3 microns resulted in a reduction of 10% (0.2 Watts) per beam of the actuator. A glass top chip proved to be better at reducing the power requirements for the actuators when compared to a silicon top chip. Modeling shows that relief cuts in the substrate had a larger effect on the power reduction compared to those on the top chip since the heat conduction path to the substrate is a lower resistance path. The power reduction was as high as 50% (1.1 Watts) per beam of the actuator, when the relief cut in the substrate was 50 microns.

Maximizing the Performance of Cased Munitions Under Realistic Constraints

2010 ◽  
Author(s):  
Kenneth C. Walls ◽  
David L. Littlefield ◽  
David E. Lambert
Keyword(s):  
Titanium Alloy ◽  
Software Package ◽  
Test Problem ◽  
Energetic Material ◽  
Design Parameters ◽  
Design Constraints ◽  
Optimization Software ◽  
Optimal Values ◽  
Explosive Detonation ◽  
Case Design

In order to make the process of fragmentation of warhead cases more systematic, we have developed a procedure that makes use of nonlinear optimization to derive optimal values for case design parameters subject to various design constraints. A framework has been developed that makes use of the optimization software package LS-OPT driving the hydrocode CTH (CTH is developed and maintained at Sandia National Laboratories, LS-OPT is commercially available from Livermore Software Technology Corp.). CTH was used to model the explosive detonation and determine the resultant kinetic energy delivered to the case by the energetic material. As an example of application of the framework, a test problem was run using a case configuration consisting alternating titanium alloy and polymer layers.

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