A Study on Fabricating Microdeep Recessed Part on Copper Foil Using Laser Indirect Shock Forming

2013 ◽  
Vol 135 (4) ◽  
Author(s):  
Huixia Liu ◽  
Zongbao Shen ◽  
Xiao Wang ◽  
Pin Li ◽  
Yang Hu ◽  
...  
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Strain Distribution ◽  
Copper Foil ◽  
Laser Energy ◽  
Sample Thickness ◽  
Metallic Thin Films ◽  
Target Plate ◽  
Microfabrication Technique ◽  
Good Agreement

Laser indirect shock forming is a novel microfabrication technique to introduce 3D profiles in metallic thin films. Experiments were performed by allowing the laser-driven flyer to impact the thin film, which is placed above a micromould. The effects of laser energy and sample thickness on deformation mechanism were investigated experimentally. The experimental results show that increasing the laser energy could increase the deformation depth, but may induce fracture along the edges of the micromould when the laser energy is too high. Moreover, the target plate was completely sheared off for 10 μm copper when the pulse energy is 1200 mJ. So it can be found that the technique can also realize micro punching of metallic thin films. The transient deformation of copper foil impacted by laser-driven flyer is simulated in this paper. Experimental data obtained were then used to validate the corresponding simulation model. Good agreement has been obtained between the numerical simulation and the experiments under different laser energy. The rising temperature due to the adiabatic conditions is taken into account. And the strain distribution has been also calculated numerically.

Surfactant-Mediated Epitaxial Growth of Metallic Thin Films

2010 ◽  
Vol 117 ◽  
pp. 55-61
Author(s):  
Masao Kamiko ◽  
Ryoichi Yamamoto
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Epitaxial Growth ◽  
Film Growth ◽  
Thin Film Growth ◽  
Growth Mode ◽  
Metallic Thin Films ◽  
Layer By Layer ◽  
Metallic Films ◽  
Heteroepitaxial Growth

The effects of several surfactants on the homoepitaxial and heteroepitaxial growth of metallic films and multilayers have been studied and compared. Our measurements clearly revealed that pre-deposition of a small amount of surfactant prior to the adatom deposition changed thin film growth mode and structure. The pre-deposited surfactant enhanced layer-by-layer (LBL) growth of the homoepitaxial and heteroepitaxial growth of metallic films. The surfactant also enhanced the epitaxial growth of metallic multilayer.

CRITICAL BEHAVIOUR OF FERROELECTRIC THIN FILMS

2002 ◽  
Vol 16 (03) ◽  
pp. 473-480 ◽  
Author(s):  
JULIA M. WESSELINOWA ◽  
STEFFEN TRIMPER
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Scaling Laws ◽  
Transverse Field ◽  
Ferroelectric Thin Film ◽  
Ferroelectric Thin Films ◽  
Number Of Layers ◽  
Ising Systems ◽  
2D And 3D ◽  
Good Agreement

Based on an Ising model in a transverse field (TIM) and using a Green's function formalism the critical exponents of the polarization β and of the longitudinal susceptibility γ are calculated for a ferroelectric thin film consisting of N layers. The exponents depends on the number of layers in a significant manner. Whereas for N=3 layers the exponents are β=0.131 and γ=1.739 there is a change over to β=0.315 and γ=1.239 in case of N=30. The datas are in a good agreement with predictions for 2D and 3D Ising systems. Using scaling laws other exponents like α, δ, η and ν are obtained, too.

A SIMPLE MODEL FOR OBTAINING OPTICAL CONSTANTS OF POROUS SILICON

2001 ◽  
Vol 15 (17n19) ◽  
pp. 745-748
Author(s):  
JAIME TORRES ◽  
JAIRO GIRALDO
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Simple Model ◽  
Porous Silicon ◽  
Optical Constants ◽  
Normal Incidence ◽  
Sample Thickness ◽  
Infinite Dimensions ◽  
Simple Method ◽  
Harmonic Oscillator Model

A simple method is proposed to calculate optical constants from porous silicon (PS) thin films, out of the simulation of normal incidence reflection spectrums. In the optical system used in this model, PS one considers as a homogeneous uniform thin film when deposited upon a substrate with semi-infinite dimensions. The PS and Substrate refractive indexes are obtained using the Simple Harmonic Oscillator Model, proposed by Wemple and DiDomenico. In addition, the absorption coefficient and sample thickness are also be obtained. The model to calculate the optical constants of some samples prepared at different anodisation times is used.

scholarly journals Experimental and Theoretical Characterization of Thick and Thin Films for Microwave Uses on 99.6% Alumina Substrates

1983 ◽  
Vol 10 (2-3) ◽  
pp. 157-162 ◽  
Author(s):  
J. P. Ramy ◽  
R. Schnitzler ◽  
C. Thebault
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Copper Oxide ◽  
Ground Plane ◽  
Resistivity Measurement ◽  
Adhesive Layer ◽  
X Band ◽  
Quality Factor Q ◽  
Good Agreement

In a previous paper,1we showed, with a microwave quality factor (Q) measurement, that in the X band and with alumina substrates, thick film losses are not worse than thin film losses when the inks are screened then etched, and when they have copper oxide as adhesive layer and gold or copper as metal powder.Here, we extend this study to show that, our experimental results being in good agreement with theory, a simple D.C. resistivity measurement is sufficient to characterize these MIC'S metallizations and is as suitable as a microwave Q measurement. We also show that the nature of the ground plane cannot be neglected.

Large Surface Area of HMDS Plasma Polymerized Thin Film Used for Production of Miniaturized Structures

2010 ◽  
Vol 636-637 ◽  
pp. 1065-1072 ◽  
Author(s):  
Lilian Marques Silva ◽  
Roberto R. Lima ◽  
E.R. Fachini ◽  
E.W. Simões ◽  
E. Pecoraro ◽  
...  
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Surface Area ◽  
Preliminary Analysis ◽  
Low Cost ◽  
Large Surface Area ◽  
Polar Organic Compounds ◽  
Organic Mixtures ◽  
Surface Areas ◽  
Good Agreement

The aim of this work was the production of a large surface area of hexamethyldisilazane (HMDS) plasma-deposited thin films and their applicability in a miniaturized structure useful for preliminary analysis of organic mixtures. The HMDS plasma films were produced with different surface areas and morphologies, and all films adsorbed polar and non-polar organic compounds. A low cost miniaturized structure was manufactured in glass using a Milling cutter and covered with HMDS plasma films. Good agreement was observed between simulation and experimental results on those microstructures. The observed different performance between pure and mixtures of organic compound samples suggests that the proposed system is a simple setup that could be useful for rough analysis of a fuel.

Fabrication of oxide superconductors from multilayered metallic thin films

1987 ◽  
Vol 2 (6) ◽  
pp. 726-731 ◽  
Author(s):  
M. Nastasi ◽  
P. N. Arendt ◽  
R. Tesmer ◽  
C. J. Maggiore ◽  
R. C. Cordi ◽  
...  
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Electron Beam ◽  
Thermal Reaction ◽  
Superconducting Phase ◽  
Heat Of Mixing ◽  
Oxide Superconductors ◽  
Second Phase ◽  
Metallic Thin Films ◽  
Superconducting Transition

Thin-film GdBa2Cu3Ox superconductors with an onset Tc > 90 K have been produced. The films were fabricated by thermal reaction in an oxidizing atmosphere of electron-beam deposited Ba/Gd/Cu multilayers. Attempts to produce the superconducting phase YBa2Cu3Ox by multilayer reaction were unsuccessful due to a positive heat of mixing between Y and Ba. The appearance of a wide superconducting transition in GdBa2Cu3Ox films may be the result of tunneling through a nonsuperconducting second phase.

Anisotropic electrical properties of sculptured thin films

2013 ◽  
Vol 91 (8) ◽  
pp. 658-661 ◽  
Author(s):  
C.B. Nelson ◽  
T.H. Gilani
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Electrical Resistivity ◽  
Electrical Properties ◽  
Electrical Conduction ◽  
Glass Substrate ◽  
Dc Electrical Resistivity ◽  
Sculptured Thin Films ◽  
Dielectric Model ◽  
Good Agreement

The anisotropy in DC electrical resistivity of a chromium (Cr) sculptured thin film (STF) prepared on a glass substrate is measured and explained using a simple linear dielectric model for electrical conduction in metallic STFs. The experimental anisotropy as a function of growth angle of Cr columns on a glass substrate is in good agreement with the model.

Characterization of Bulk and Thin Film Fracture in Electronic Packaging

2016 ◽  
Author(s):  
Vijay Subramanian ◽  
Tsgereda Alazar ◽  
Kyle Yazzie ◽  
Bharat Penmecha ◽  
Pilin Liu ◽  
...  
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Fracture Toughness ◽  
Sample Preparation ◽  
Electronic Packaging ◽  
Low Cost ◽  
Test Methods ◽  
Thin Layers ◽  
Wide Range ◽  
Good Agreement

As semiconductor packaging technologies continues to scale, it drives the use of existing and new materials in thin layer form factors. Additionally, packaging technologies continue to increase in complexity such as multi-chip packages, 3D packaging, embedded dies/passives, and system in package. This increasing packaging complexity implies that materials in thin layers are subject to non-trivial loading conditions, which may exceed the toughness of the material, leading to cracks. Furthermore, the continued focus on cost leads to a growing interest in novel, low-cost materials. It is important to ensure that the reliability of these low-cost materials is at par or better than currently used materials. This in turn, leads to significant efforts in the area of material characterization at the lab level to speed up the development process. The chosen test methods must not only provide accurate and consistent data, but they must also be applicable across a suitably wide range of materials to aid in the optimization process. Methods for testing and characterizing fracture induced failures in various material systems in electronic packaging are investigated in this paper. The learnings from the different tests methods are compared and discussed here. More specifically, different fracture characterization techniques on (a) freestanding ‘thin’ solder resist films, and (b) filled ‘bulk’ epoxy materials like underfills and epoxy mold compounds are investigated. For thin films, learnings from different test methods for measuring fracture toughness, namely, uniaxial tension (with and without an edge pre-crack) and membrane penetration tests, are discussed. The test methods are compared by characterizing several different thin films, to gauge how well each method could distinguish differences in material (and thickness). Reasonably good agreement was found between the various thin film toughness test methods; however, ease of sample preparation, fixture, and adaptability to environmental testing will be discussed. In the case of filled epoxy resin systems, the single-edge-notch bending (SENB) technique is utilized to obtain the fracture toughness of underfills and mold compounds with filler materials. Learnings on different methods of creating pre-cracks in SENB samples are also investigated and presented. Two methods are explored in this study, namely, razor blade and laser milling. Good agreement in fracture toughness values was obtained with the two precracking methods, along with considerations about ease of sample preparation and consistency of pre-crack dimensions also examined. Morphology of the pre-cracks obtained by these methods, and their effects on fracture toughness measurements, are also discussed.

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