A High Performance Voice Coil Actuator for Optomechatronic Applications

2017 ◽  
Vol 9 (4) ◽  
Author(s):  
Dion Hicks ◽  
Taufiq Rahman ◽  
Nicholas Krouglicof
Keyword(s):  
High Performance ◽  
Degrees Of Freedom ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
The Novel ◽  
Array Configuration ◽  
Halbach Array ◽  
Mechanical Devices ◽  
Kinematic Mechanisms ◽  
Voice Coil Actuator

Voice coil actuators (VCAs) are simple electro-mechanical devices, which are capable of generating linear motion in response to an electrical input. The generic cylindrical design of commercially available actuators imposes a large variety of limitations on the end user. The most prominent is the requirement to design and fit extra components to the actuator in order to increase functionality. To solve this issue, a novel voice coil actuator was created, which reconfigures the standard cylindrical design with one of a rectangular structure. The novel actuator incorporates planar magnets in a modified Halbach array configuration to ensure compactness and an exceptionally intense, uniform magnetic field. The moving coil is substituted with a printed circuit board (PCB) encompassing numerous current conducting traces. The board contains a miniature linear rail and bearing system, unified drive electronics, and highly adaptive position feedback circuitry resulting in a compact, highly dynamic and accurate device. In pursuit of optomechatronic applications, two distinct parallel kinematic mechanisms (PKMs) were developed to utilize the high dynamics and accuracy of the novel actuator. These devices were configured to function in only rotational degrees-of-freedom (DOF) and because of their underlying kinematic structures can be referred to as parallel orientation manipulators (POMs). In particular, two structures were defined, 2-PSS/U and 3-PSS/S, in order to constrain their payloads to two and three degrees of rotational freedom, respectively. The resultant manipulators are highly dynamic, precise and fulfill size, weight, and power requirements for many applications such as sense and avoidance and visual tracking.

scholarly journals A Self-Powered Nanogenerator for the Electrical Protection of Integrated Circuits from Trace Amounts of Liquid

2019 ◽  
Vol 12 (1) ◽  
Author(s):  
Zhuang Hui ◽  
Ming Xiao ◽  
Daozhi Shen ◽  
Jiayun Feng ◽  
Peng Peng ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
High Performance ◽  
Printed Circuit Board ◽  
Short Circuit ◽  
High Sensitivity ◽  
Short Circuit Current ◽  
Fast Response ◽  
Open Circuit ◽  
Circuit Board ◽  
Self Powered

Abstract With the increase in the use of electronic devices in many different environments, a need has arisen for an easily implemented method for the rapid, sensitive detection of liquids in the vicinity of electronic components. In this work, a high-performance power generator that combines carbon nanoparticles and TiO2 nanowires has been fabricated by sequential electrophoretic deposition (EPD). The open-circuit voltage and short-circuit current of a single generator are found to exceed 0.7 V and 100 μA when 6 μL of water was applied. The generator is also found to have a stable and reproducible response to other liquids. An output voltage of 0.3 V was obtained after 244, 876, 931, and 184 μs, on exposure of the generator to 6 μL of water, ethanol, acetone, and methanol, respectively. The fast response time and high sensitivity to liquids show that the device has great potential for the detection of small quantities of liquid. In addition, the simple easily implemented sequential EPD method ensures the high mechanical strength of the device. This compact, reliable device provides a new method for the sensitive, rapid detection of extraneous liquids before they can impact the performance of electronic circuits, particularly those on printed circuit board.

Vision-force guided precise robotic assembly for 2.5D components in a semistructured environment

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Boyoung Kim ◽  
Minyong Choi ◽  
Seung-Woo Son ◽  
Deokwon Yun ◽  
Sukjune Yoon
Keyword(s):  
Computer Aided Design ◽  
Degrees Of Freedom ◽  
Printed Circuit Board ◽  
Force Sensor ◽  
Circuit Board ◽  
Robotic Assembly ◽  
Ccd Cameras ◽  
Content Type ◽  
3 Dimensional ◽  
Aided Design

Purpose Many manufacturing sites require precision assembly. Particularly, similar to cell phones, assembly at the sub-mm scale is not easy, even for humans. In addition, the system should assemble each part with adequate force and avoid breaking the circuits with excessive force. The purpose of this study is to assemble high precision components with relatively reasonable vision devices compared to previous studies. Design/methodology/approach This paper presents a vision-force guided precise assembly system using a force sensor and two charge coupled device (CCD) cameras without an expensive 3-dimensional (3D) sensor or computer-aided design model. The system accurately estimates 6 degrees-of-freedom (DOF) poses from a 2D image in real time and assembles parts with the proper force. Findings In this experiment, three connectors are assembled on a printed circuit board. This system obtains high accuracy under 1 mm and 1 degree error, which shows that this system is effective. Originality/value This is a new method for sub-mm assembly using only two CCD cameras and one force sensor.

scholarly journals HIGH-PERFORMANCE FLEXIBLE FORCE AND TEMPERATURE SENSING ARRAY WITH A ROBUST STRUCTURE

2013 ◽  
Vol 24 ◽  
pp. 1360014
Author(s):  
MIN-SEOK KIM ◽  
HAN-WOOK SONG ◽  
YON-KYU PARK
Keyword(s):  
High Performance ◽  
Sensor Array ◽  
Printed Circuit Board ◽  
High Spatial Resolution ◽  
Tactile Sensor ◽  
Circuit Board ◽  
Micro Fabrication ◽  
Printed Circuit ◽  
Flexible Printed Circuit ◽  
Physical Quantities

We have developed a flexible tactile sensor array capable of sensing physical quantities, e.g. force and temperature with high-performances and high spatial resolution. The fabricated tactile sensor consists of 8 × 8 force measuring array with 1 mm spacing and a thin metal (copper) temperature sensor. The flexible force sensing array consists of sub-millimetre-size bar-shaped semi-conductor strain gage array attached to a thin and flexible printed circuit board covered by stretchable elastomeric material on both sides. This design incorporates benefits of both materials; the semi-conductor's high performance and the polymer's mechanical flexibility and robustness, while overcoming their drawbacks of those two materials. Special fabrication processes, so called “dry-transfer technique” have been used to fabricate the tactile sensor along with standard micro-fabrication processes.

Enabling High-Performance Heterogeneous Integration via Interface Standards, IP Reuse, and Modular Design

2018 ◽  
Vol 2018 (1) ◽  
pp. 000246-000251
Author(s):  
Andreas Olofsson ◽  
Daniel S. Green ◽  
Jeffrey Demmin
Keyword(s):  
High Performance ◽  
Printed Circuit Board ◽  
Modular Design ◽  
Semiconductor Industry ◽  
Leading Edge ◽  
Cost Effective ◽  
Circuit Board ◽  
Heterogeneous Integration ◽  
Prohibitive Cost ◽  
Ip Reuse

Abstract DARPA is leading a new thrust to leverage mainstream semiconductor design approaches to enable the rapid and cost-effective integration of heterogeneous device technologies. This represents a leap ahead beyond the monolithic silicon approach that has served the semiconductor industry well, but which now creates prohibitive cost and design issues at leading-edge nodes, as well as performance constraints without the benefits of broad device technology options. DARPA's Common Heterogeneous Integration and IP Reuse Strategies (CHIPS) program will develop interface standards, IP reuse methodologies, and modular design approaches with the goal of making heterogeneous integration as straightforward as printed circuit board design and assembly, without compromising device performance. An overview of the program's vision, goals, and progress to date is presented here.

3D SiP Assembly and Reliability for Glass Substrate with Through Vias

2016 ◽  
Vol 2016 (1) ◽  
pp. 000282-000287
Author(s):  
Ra-Min Tain ◽  
Dyi-Chung Hu ◽  
Kai-Ming Yang ◽  
Yu-Hua Chen ◽  
Jui-Tang Chen ◽  
...  
Keyword(s):  
Glass Substrate ◽  
High Performance ◽  
Printed Circuit Board ◽  
Dielectric Material ◽  
Mechanical Test ◽  
Circuit Board ◽  
Material Structure ◽  
Back Side ◽  
Glass Technology ◽  
Resistance Change

Abstract Applications of Glass substrate for high performance system-in-package (SiP) products have gradually become a promising technology in recent years. Research and development activities are reported in many journal papers and conferences [1,2]. Consortiums and Alliances are also formed to gather worldwide efforts for developing glass technology. In the past, we have published our development efforts on the process of producing glass substrate with through via and build-up redistribution circuit layers (RDLs) [3]. N. Koizumi [4] first reported glass reliability issues in 2013; and the phenomena he called SE-WA-RE has caused a great concern of using glass as a substrate. Model simulations have indicated that the glass crack is related to the stress buildup by the materials and structure. In this study, we selected a dielectric material/structure set that is designed to be less stressful to the glass substrate. A better reliability result can be expected. In this paper, we will discuss an assembly structure of SiP module using the glass substrate with through-glass via (TGV) where the diameter of TGV is 100μm with thickness at 200μm. The copper plating technique to form the through via conductor is called direct-metal-on-glass (DMoG) which deposits titanium and copper directly on glass both in the wall of through vias and on glass surfaces of both sides. The first RDL is formed on both surfaces of glass substrate by semi-additive plating (SAP); then followed by build-up RDLs on top of the DMoG RDLs on both sides of the substrate also by SAP with interconnect vias to form connections between DMoG RDLs and build-up RDLs. Finally, solder mask is applied on both sides of the glass substrate leaving pad openings (SRO) for surface finish, die mounting and printed-circuit board connection purposes. At die mounting side, the SRO is 60μm in diameter with minimum pitch at 150μm. The TGV conductors connect the DMoG RDLs on both sides of the substrate. A mechanical test die with 18μm bump diameter is mounted on the build-up RDL at the substrate top side with daisy-chain design both in the test die and TGV substrate RDLs. Thus, the daisy-chain connection can go from the build-up RDL of the substrate back side to the test die on the top side of the substrate. 200 thermal-cycling test (TCT) has been performed and the daisy-chain resistances are measured before and after the 200 TCTs. It is found that 96% of daisy-chains have less than 10% of resistance change after 200 TCTs.

Dielectric and Hot/Wet Properties of Methyl-Silsesquioxane/Cyanate Ester Resin Hybrid Materials

2011 ◽  
Vol 216 ◽  
pp. 630-634
Author(s):  
Zeng Ping Zhang ◽  
Yong Wen ◽  
Hong Zhao Du ◽  
Jian Zhong Pei ◽  
Shuan Fa Chen
Keyword(s):  
Dielectric Constant ◽  
Dielectric Properties ◽  
Dielectric Loss ◽  
High Performance ◽  
Printed Circuit Board ◽  
Cyanate Ester ◽  
Circuit Board ◽  
Printed Circuit ◽  
Cyanate Ester Resin ◽  
Properties Of Materials

Methylsilsesquioxane (Me-SSQ) was incorporated into cyanate ester resin (CE) to obtain organic-inorganic hybrids with better dielectric properties in this study. First, methyltriethoxysilane was hydrolyzed and condensed to synthesize Me-SSQ. Then several Me-SSQ/CE hybrids containing different contents of Me-SSQ were prepared. The effect of Me-SSQ content on the dielectric and hot/wet properties of materials was investigated. Results showed that the Me-SSQ/CE hybrid containing 20wt% of Me-SSQ shows a dielectric constant of 2.78, which is much lower than the pure CE resin. At the same time, the dielectric loss of the Me-SSQ/CE hybrids was slightly increased (tanδ<0.006). It indicates that Me-SSQ/CE hybrid is a promising matrix materials for high-performance printed circuit board (PCB).

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