Electro-Thermal Codesign Methodology of an On-Board Electric Vehicle Charger

2020 ◽  
Vol 142 (4) ◽  
Author(s):  
Omri Tayyara ◽  
Carlos Da Silva ◽  
Miad Nasr ◽  
Amir Assadi ◽  
Kshitij Gupta ◽  
...  
Keyword(s):  
Electric Vehicle ◽  
Heat Dissipation ◽  
Printed Circuit Board ◽  
Experimental Tests ◽  
Design Guidelines ◽  
Circuit Board ◽  
System Level ◽  
Design And Optimization ◽  
Dynamics And Control ◽  
In Series

Abstract Significant advances are needed to optimize the charging speed, reliability, safety, and cost of today's conservatively designed electric vehicle (EV) charging systems. The design and optimization of these novel engineering systems require concurrent consideration of thermal and electrical phenomena, as well as component and system level dynamics and control to guarantee reliable continuous operation, scalability, and minimum footprint. This work addresses the concurrent thermal and electrical design constraints in a high-density, on-board, bidirectional charger with vehicle-to-grid (V2G), grid-to-vehicle (G2V), vehicle-to-house (V2H), and vehicle-to-vehicle (V2V) power transfer capabilities. The electrical design of this charger consists of DC–DC and DC–AC power stages connected in series. The power-stage circuits are implemented on a printed circuit board (PCB) with 16 surface-mount silicon carbide MOSFETs, three inductors, and one transformer. The main goal of this work is to investigate the interplay between the cooling architecture and the PCB layout, and the corresponding impact on the heat dissipation and parasitic inductance. This work compares the performance of three generations of this multifunctional charger that employ different design methodologies and proposes high-level design guidelines derived from multiphysics simulations and experimental tests.

Effects of Cooling Architecture and PCB Layout Co-Design on the Concurrent Thermal and Electrical Performance of an On-Board Electric Vehicle Charger

2019 ◽  
Author(s):  
Omri Tayyara ◽  
Kshitij Gupta ◽  
Carlos Da Silva ◽  
Miad Nasr ◽  
Amir Assadi ◽  
...  
Keyword(s):  
Electric Vehicle ◽  
Heat Dissipation ◽  
Printed Circuit Board ◽  
Experimental Tests ◽  
Circuit Board ◽  
System Level ◽  
Electrical Performance ◽  
Design And Optimization ◽  
Dynamics And Control ◽  
Pcb Layout

Abstract Significant advances are needed to optimize the charging speed, reliability, safety, and cost of today’s conservatively designed electric vehicle charging systems. The design and optimization of these novel engineering systems require concurrent consideration of thermal and electrical phenomena, as well as component- and system-level dynamics and control to guarantee reliable continuous operation, scalability, and minimum footprint. This work addresses the concurrent thermal and electrical design constraints in a high-density, on-board, bi-directional charger (referred to as power-hub) with vehicle-to-grid (V2G), grid-to-vehicle (G2V), vehicle-to-house (V2H) and vehicle-to-vehicle (V2V) power transfer capabilities. The electrical design of this charger consists of dc-dc and dc-ac power stages connected in series. The power-stage circuits are implemented on a Printed Circuit Board (PCB) with 16 surface-mount Silicon Carbide (SiC) MOSFETs, three inductors and one transformer. The main goal of this work is to investigate the interplay between the cooling architecture and the PCB layout, and the corresponding impact on the heat dissipation and parasitic inductance. This work compares the performance of three prototypes of this multifunctional charger using multi-physics simulations and experimental tests.

Evaluation of new technologies and materials for printed circuit boards with improved heat dissipation properties

Circuit World ◽  
2016 ◽  
Vol 42 (1) ◽  
pp. 32-36 ◽  
Author(s):  
Michal Baszynski ◽  
Edward Ramotowski ◽  
Dariusz Ostaszewski ◽  
Tomasz Klej ◽  
Mariusz Wojcik ◽  
...  
Keyword(s):  
Thermal Properties ◽  
Printed Circuit Boards ◽  
Heat Dissipation ◽  
Printed Circuit Board ◽  
New Technologies ◽  
Electronic Device ◽  
Circuit Board ◽  
New Materials ◽  
Content Type ◽  
Printed Circuit

Purpose – The purpose of this paper is to evaluate thermal properties of printed circuit board (PCB) made with use of new materials and technologies. Design/methodology/approach – Four PCBs with the same layout but made with use of different materials and technologies have been investigated using thermal camera to compare their thermal properties. Findings – The results show how important the thermal properties of PCBs are for providing effective heat dissipation, and how a simple alteration to the design can help to improve the thermal performance of electronic device. Proper layout, new materials and technologies of PCB manufacturing can significantly reduce the temperature of electronic components resulting in higher reliability of electronic and power electronic devices. Originality/value – This paper shows the advantages of new technologies and materials in PCB thermal management.

scholarly journals Capturing Electrocardiogram Signals from Chairs by Multiple Capacitively Coupled Unipolar Electrodes

Sensors ◽  
2018 ◽  
Vol 18 (9) ◽  
pp. 2835 ◽  
Author(s):  
Zhongjie Hou ◽  
Jinxi Xiang ◽  
Yonggui Dong ◽  
Xiaohui Xue ◽  
Hao Xiong ◽  
...  
Keyword(s):  
Printed Circuit Board ◽  
Experimental Tests ◽  
Circuit Board ◽  
Signal Acquisition ◽  
Ecg Signal ◽  
Capacitively Coupled ◽  
Ecg Signals ◽  
Printed Circuit ◽  
Electrocardiogram Signals ◽  
Electrocardiogram Ecg

A prototype of an electrocardiogram (ECG) signal acquisition system with multiple unipolar capacitively coupled electrodes is designed and experimentally tested. Capacitively coupled electrodes made of a standard printed circuit board (PCB) are used as the sensing electrodes. Different from the conventional measurement schematics, where one single lead ECG signal is acquired from a pair of sensing electrodes, the sensing electrodes in our approaches operate in a unipolar mode, i.e., the biopotential signals picked up by each sensing electrodes are amplified and sampled separately. Four unipolar electrodes are mounted on the backrest of a regular chair and therefore four channel of signals containing ECG information are sampled and processed. It is found that the qualities of ECG signal contained in the four channel are different from each other. In order to pick up the ECG signal, an index for quality evaluation, as well as for aggregation of multiple signals, is proposed based on phase space reconstruction. Experimental tests are carried out while subjects sitting on the chair and clothed. The results indicate that the ECG signals can be reliably obtained in such a unipolar way.

A Numerical Study of Single Phase Dielectric Fluid Immersion Cooling of Multichip Modules

2012 ◽  
Vol 2012 (1) ◽  
pp. 000581-000590
Author(s):  
Roy W. Knight ◽  
Seth Fincher ◽  
Sushil H. Bhavnani ◽  
Daniel K. Harris ◽  
R. Wayne Johnson
Keyword(s):  
Single Phase ◽  
Printed Circuit Board ◽  
Numerical Study ◽  
Design Guidelines ◽  
Circuit Board ◽  
Dielectric Fluid ◽  
Multichip Modules ◽  
Ansys Fluent ◽  
Immersion Cooling ◽  
Numerical Parametric Study

Immersion, single phase free convection cooling of multichip modules on a printed circuit board in a pool of dielectric fluid was examined numerically, with experimental verification of baseline cases. A multi-chip module with multiple thermal test cells with temperature sensing capability was simulated. The commercially available computational fluid dynamics program from ANSYS, Fluent, was used with the electronics packaging front end, Icepak, employed to create the models and compact conduction modules. Simulations were first performed of an experimental test vehicle which had five 18 mm by 18 mm die, arranged in a cross pattern, equally spaced die, 25 mm between them. Two of the die were aligned vertically with the center die, two aligned horizontally with it. The board was suspended vertically in a large pool of dielectric fluid. Heat was dissipated in the die at a flux of up to 2 W/cm2, based on the die surface area. Simulation results were compared with experimentally measured die temperature values and excellent agreement was seen for the cases of one die heated and all five die uniformly heated with the board cooled by FC-72. A numerical parametric study was performed to examine the effect of die size and spacing on temperature rise. In addition to FC-72, immersion cooling in Novec 649 and HFE 7100 were modeled. Design guidelines are suggested for dielectric fluid immersion cooled multichip modules.

scholarly journals NotchPUF: Printed Circuit Board PUF Based on Microstrip Notch Filter

Cryptography ◽  
2020 ◽  
Vol 4 (2) ◽  
pp. 11
Author(s):  
Mitchell Martin ◽  
Jim Plusquellic
Keyword(s):  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Statistical Tests ◽  
Notch Filter ◽  
Circuit Board ◽  
Circuit Boards ◽  
Printed Circuit ◽  
In Series ◽  
Commercial Off The Shelf ◽  
Using Data

Physical Unclonable Functions (PUFs) are primitives that are designed to leverage naturally occurring variations to produce a random bitstring. Current PUF designs are typically implemented in silicon or utilize variations found in commercial off-the-shelf (COTS) parts. Because of this, existing designs are insufficient for the authentication of Printed Circuit Boards (PCBs). In this paper, we propose a novel PUF design that leverages board variations in a manufactured PCB to generate unique and stable IDs for each PCB. In particular, a single copper trace is used as a source of randomness for bitstring generation. The trace connects three notch filter structures in series, each of which is designed to reject specific but separate frequencies. The bitstrings generated using data measured from a set of PCBs are analyzed using statistical tests to illustrate that high levels of uniqueness and randomness are achievable.

FUZZY BASED DESIGN OPTIMIZATION TO REDUCE THE CROSSTALK IN MICROSTRIP LINES

2004 ◽  
Vol 13 (01) ◽  
pp. 121-136 ◽  
Author(s):  
T. AHMAD ◽  
M. A. HOSSAIN ◽  
A. K. RAY ◽  
Z. GHASSEMLOOY
Keyword(s):  
Fuzzy Logic ◽  
Design Optimization ◽  
High Speed ◽  
Printed Circuit Board ◽  
Optimization Methods ◽  
Circuit Board ◽  
Electrical Parameters ◽  
Design And Optimization ◽  
Printed Circuit ◽  
Microstrip Lines

This paper presents an investigation of the design optimization in microstrip lines to reduce the crosstalk level using Fuzzy Logic. In microstrip lines length and spacing, termination conditions of interconnection and output impedance of gates are the major components that cause crosstalk. In order to design high speed printed circuit board (PCB) with optimum interconnection configuration, it is essential to reduce the crosstalk to its minimum tolerance level. A design methodology is proposed to correlate electrical parameters and physical configuration of lines to the crosstalk phenomena. This design is subsequently optimized using Fuzzy Logic to reduce the level of crosstalk. A set of experiments is carried out to demonstrate the capabilities of the design and optimization methods. The effect of the geometrical configuration of the lines on crosstalk, particularly the spacing, is highlighted.

Sign in / Sign up

Export Citation Format

Share Document