Assembly Reliability and Molding Material Comparison of Miniature Integrated High Power Module with Insulated Metal Substrate

2021 ◽  
Author(s):  
Chang-Chun Lee ◽  
Kuo-Shu Kao ◽  
Chi-Wei Wang ◽  
Tai-Jyun Yu ◽  
Tai-Kuang Lee ◽  
...  
Keyword(s):  
High Power ◽  
Heat Dissipation ◽  
High Reliability ◽  
Metal Substrate ◽  
Temperature Cycling ◽  
Power Module ◽  
Silicone Gel ◽  
Molding Material ◽  
Operational Life ◽  
Solder Layer

Abstract Given the increasing demand for power density and lightweight specifications, the discrete transistor outline-type package is no longer sufficient for personal vehicle. The new generation of high-power drive needs excellent heat dissipation and miniaturized system simultaneously. However, a traditional architecture of power module, direct bonding copper substrate, has serious warpage deformation and limitation of the heat dissipation. Therefore, a power module with an insulated metal substrate (IMS) is proposed. The proposed power module has a smaller volume, better electrical and thermal performance, and high reliability to be utilized in personal vehicles. A fine-quality assembly process is also presented and verified. Furthermore, two different kinds of molding materials that are widely used in power modules, silicone gel and epoxy, are utilized. The IMS-type module with silicone gel molding fails the temperature cycling test (TCT) with the delamination of the solder layer. The module with epoxy successfully passes the automotive-grade reliability tests, including TCT, highly accelerated stress test, high-temperature reverse bias, and intermittent operational life test according to the standard of AEC-Q101. The finite element analysis for the IMS power module is presented and analyzed under the condition of TCT to estimate the mechanical behavior of the solder layer. The equivalent plastic strain of solder layer with silicone gel and epoxy are 0.76 and 0.08 after TCT, separately. The main reason can be attributed to the coefficient of thermal expansion between the IMS and molding material. According to the analyzed results, the effect of molding material should not be ignored in the power modulus.

Reliability of High-Power Light Emitting Diode Attached With Different Thermal Interface Materials

2010 ◽  
Vol 132 (3) ◽  
Author(s):  
Xin Li ◽  
Xu Chen ◽  
Guo-Quan Lu
Keyword(s):  
High Power ◽  
Heat Dissipation ◽  
Light Emitting Diode ◽  
Temperature Cycling ◽  
Fluorescent Light ◽  
Light Sources ◽  
Light Emitting ◽  
Die Attach ◽  
Nanosilver Paste ◽  
Interconnection Material

As a solid electroluminescent source, white light emitting diode (LED) has entered a practical stage and become an alternative to replace incandescent and fluorescent light sources. However, due to the increasing integration and miniaturization of LED chips, heat flux inside the chip is also increasing, which puts the packaging into the position to meet higher requirements of heat dissipation. In this study, a new interconnection material—nanosilver paste is used for the LED chip packaging to pursue a better optical performance, since high thermal conductivity of this material can help improve the efficiency of heat dissipation for the LED chip. The bonding ability of this new die-attach material is evaluated by their bonding strength. Moreover, high-power LED modules connected with nanosilver paste, Sn3Ag0.5Cu solder, and silver epoxy are aged under hygrothermal aging and temperature cycling tests. The performances of these LED modules are tested at different aging time. The results show that LED modules sintered with nanosilver paste have the best performance and stability.

Thermal Decoupling in Power Electronics Modules Using Thermal Pyrolytic Graphite

2019 ◽  
Vol 2019 (1) ◽  
pp. 000183-000187
Author(s):  
Riya Paul ◽  
Amol Deshpande ◽  
Fang Luo
Keyword(s):  
Power Electronics ◽  
High Power ◽  
Heat Dissipation ◽  
Pyrolytic Graphite ◽  
High Density ◽  
Junction Temperature ◽  
Heat Extraction ◽  
Maximum Temperature ◽  
Thermal Coupling ◽  
Power Module

Abstract The device within a power electronics module package will fail if the maximum junction temperature is not within the device's permissible maximum temperature rating specified by the manufacturer. Modern electronic miniaturization demands multi-chip module (MCM) packaging providing different semiconductor technology integration, reduced number of component interconnects, and lower power supply. But the huge amount of heat generated by each chip produces thermal coupling among devices, leading to an increase in the junction temperature. The power device specifications in the datasheet assume the devices being mounted on a suitable heatsink. Wide bandgap (WBG) devices like silicon carbide (SiC) devices can generally sustain a maximum junction temperature of about 175 °C – 200 °C. The junction temperature of the WBG devices becomes severe in a high-density high-power module. This highlights the need for a thermal management system to limit the maximum junction temperature within the device's permissible range. As a result, the power module needs to be connected to a heatsink to effectively increase the surface area of the heat dissipation junctions. A high conductivity material based heatsink extracts heat effectively from the module as the thermal resistance value remains low. In this paper, preliminary thermal analysis is done for a high density high-power module where the high in-plane thermal conductivity of thermal pyrolytic graphite (TPG) is exploited in substrate as well as heatsink designs. TPG brings down the junction temperature to a considerably lower level, leading to a safer power module functioning. This paper focuses on the design and proper alignment of the substrate and heatsink with respect to the module layout so that maximum junction temperature is reduced by proper heat extraction far below the operating temperature of the devices and also extent of reduction of the thermal coupling among the power devices placed next to each other on the same plane within the power module.

scholarly journals Space High-Voltage Power Module

2021 ◽  
Vol 9 ◽  
Author(s):  
Wenjie Zhao ◽  
Yuanyuan Jiang ◽  
Jianchao Wu ◽  
Yonghui Huang ◽  
Yan Zhu ◽  
...  
Keyword(s):  
High Voltage ◽  
High Power ◽  
Power Supply ◽  
Electric Propulsion ◽  
High Reliability ◽  
Rapid Development ◽  
Space Environment ◽  
Resonant Circuit ◽  
Power Module ◽  
High Voltage Power Supply

With the rapid development of the world’s aerospace technologies, a high-power and high-reliability space high-voltage power supply is significantly required by new generation of applications, including high-power electric propulsion, space welding, deep space exploration, and space solar power stations. However, it is quite difficult for space power supplies to directly achieve high-voltage output from the bus, because of the harshness of the space environment and the performance limitations of existing aerospace-grade electronic components. This paper proposes a high-voltage power supply module design for space welding applications, which outputs 1 kV and 200 W when the input is 100 V. This paper also improves the efficiency of the high-voltage converter with a phase-shifted full-bridge series resonant circuit, then simulates the optimized power module and the electric field distribution of the high-voltage circuit board.

Vapor Chamber Acting as a Heat Spreader for Power Module Cooling

2009 ◽  
Vol 1 (2) ◽  
Author(s):  
Y. P. Zhang ◽  
X. L. Yu ◽  
Q. K. Feng ◽  
L. H. Zhang
Keyword(s):  
Power Density ◽  
High Power ◽  
Heat Sink ◽  
Copper Substrate ◽  
Metal Substrate ◽  
Junction Temperature ◽  
High Power Density ◽  
Vapor Chamber ◽  
Power Module ◽  
Heat Spreader

This paper presents an integrated power electronics module with a vapor chamber (VC) acting as a heat spreader to transfer the heat from the insulated gate bipolar transistor (IGBT) module to the base of the heat-sink. The novel VC integrated in a power module instead of a metal substrate is proposed. Compared with a conventional metal heat spreader, the VC significantly diffuses the concentrated heat source to a larger condensing area. The experimental results indicate that the VC based heat-sink will maintain the IGBT junction temperature 20°C cooler than a non-VC based heat-sink with high power density. The junction-to-case thermal resistance of the power module based on the VC is about 50% less than that of the power module based on a copper substrate with the same weight. The chip overshooting temperature of the copper substrate module with the same weight goes beyond 10°C against the junction temperature of the VC module at a given impulse power of 225 W. Consequently, thanks to a longer time duration to reach the same temperature, a power surge for the chip can be avoided and the ability to resist thermal impact during the VC module startup can be improved as well. The investigation shows that the VC power module is an excellent candidate for the original metal substrate, especially for an integrated power module with high power density.

High Power UPS Selection Methodology and Installation Guideline for High Reliability Power Supply

2005 ◽  
Vol 1 (03) ◽  
pp. 396-402
Author(s):  
A. Sudrià ◽  
◽  
E. Jaureguialzo ◽  
A. Samper ◽  
R. Villafáfila ◽  
...  
Keyword(s):  
High Power ◽  
Power Supply ◽  
High Reliability ◽  
Selection Methodology

Intermittent Failures in High Pin Count Packaging

2006 ◽  
Author(s):  
Ramesh Varma ◽  
Richard Brooks ◽  
Ronald Twist ◽  
James Arnold ◽  
Cleston Messick
Keyword(s):  
Failure Analysis ◽  
Shape Analysis ◽  
State Of The Art ◽  
Process Variation ◽  
High Reliability ◽  
Temperature Cycling ◽  
Assembly Process ◽  
System Failures ◽  
Industrial Grade ◽  
Corrective Actions

Abstract In a prequalification effort to evaluate the assembly process for the industrial grade high pin count devices for use in a high reliability application, one device exhibited characteristics that, without corrective actions and/or extensive screening, may lead to intermittent system failures and unacceptable reliability. Five methodologies confirmed this conclusion: (1) low post-decapsulation wire pull results; (2) bond shape analysis showed process variation; (3) Failure Analysis (FA) using state of the art equipment determined the root causes and verified the low wire pull results; (4) temperature cycling parts while monitoring, showed intermittent failures, and (5) parts tested from other vendors using the same techniques passed all limits.

scholarly journals Analysis on High-Power Seaport LED Luminaire with Uniform Light Distribution Based on Optimized Lens and Heatsink

2021 ◽  
Vol 11 (9) ◽  
pp. 4035
Author(s):  
Jinsheon Kim ◽  
Jeungmo Kang ◽  
Woojin Jang
Keyword(s):  
Light Source ◽  
High Power ◽  
Heat Dissipation ◽  
Light Emitting Diode ◽  
Light Distribution ◽  
Light Sources ◽  
Led Light ◽  
High Power Led ◽  
Distribution Requirement ◽  
Lighting Application

In the case of light-emitting diode (LED) seaport luminaires, they should be designed in consideration of glare, average illuminance, and overall uniformity. Although it is possible to implement light distribution through auxiliary devices such as reflectors, it means increasing the weight and size of the luminaire, which reduces the feasibility. Considering the special environment of seaport luminaires, which are installed at a height of 30 m or more, it is necessary to reduce the weight of the device, facilitate replacement, and secure a light source with a long life. In this paper, an optimized lens design was investigated to provide uniform light distribution to meet the requirement in the seaport lighting application. Four types of lens were designed and fabricated to verify the uniform light distribution requirement for the seaport lighting application. Using numerical analysis, we optimized the lens that provides the required minimum overall uniformity for the seaport lighting application. A theoretical analysis for the heatsink structure and shape were conducted to reduce the heat from the high-power LED light sources up to 250 W. As a result of these analyses on the heat dissipation characteristics of the high-power LED light source used in the LED seaport luminaire, the heatsink with hexagonal-shape fins shows the best heat dissipation effect. Finally, a prototype LED seaport luminaire with an optimized lens and heat sink was fabricated and tested in a real seaport environment. The light distribution characteristics of this prototype LED seaport luminaire were compared with a commercial high-pressure sodium luminaire and metal halide luminaire.

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