Time-to-Market: A Practical CFD Application in the Telecom Industry

2003 ◽  
Author(s):  
Edward R. Champion
Keyword(s):  
Fluid Dynamics ◽  
Computational Fluid Dynamics ◽  
Thermal Performance ◽  
Cable Modem ◽  
Time To Market ◽  
Direct Production ◽  
Performance Verification ◽  
Telecom Industry

This paper summarizes the practical use of CFD (Computational Fluid Dynamics) using a commercially available package, FLOTHERM [1], in a tight and highly competitive marketplace to produce a functional pre-production piece of telecom gear with no prototyping for thermal issues. The paper highlights the direct production, noprototype, analytical thermal performance verification of a small CMTS (Cable Modem Termination System) used in telecom applications.

scholarly journals Evaluation of Active Heat Sinks Design under Forced Convection—Effect of Geometric and Boundary Parameters

Materials ◽  
2021 ◽  
Vol 14 (8) ◽  
pp. 2041
Author(s):  
Eva C. Silva ◽  
Álvaro M. Sampaio ◽  
António J. Pontes
Keyword(s):  
Fluid Dynamics ◽  
Computational Fluid Dynamics ◽  
Additive Manufacturing ◽  
Pressure Drop ◽  
Forced Convection ◽  
Thermal Performance ◽  
Heat Sinks ◽  
Trapezoidal Shape ◽  
Computational Fluid Dynamics Simulations ◽  
Dynamics Simulations

This study shows the performance of heat sinks (HS) with different designs under forced convection, varying geometric and boundary parameters, via computational fluid dynamics simulations. Initially, a complete and detailed analysis of the thermal performance of various conventional HS designs was taken. Afterwards, HS designs were modified following some additive manufacturing approaches. The HS performance was compared by measuring their temperatures and pressure drop after 15 s. Smaller diameters/thicknesses and larger fins/pins spacing provided better results. For fins HS, the use of radial fins, with an inverted trapezoidal shape and with larger holes was advantageous. Regarding pins HS, the best option contemplated circular pins in combination with frontal holes in their structure. Additionally, lattice HS, only possible to be produced by additive manufacturing, was also studied. Lower temperatures were obtained with a hexagon unit cell. Lastly, a comparison between the best HS in each category showed a lower thermal resistance for lattice HS. Despite the increase of at least 38% in pressure drop, a consequence of its frontal area, the temperature was 26% and 56% lower when compared to conventional pins and fins HS, respectively, and 9% and 28% lower when compared to the best pins and best fins of this study.

Computational fluid dynamics for thermal performance of a water-cooled minichannel heat sink with different chip arrangements

2014 ◽  
Vol 24 (4) ◽  
pp. 797-810 ◽  
Author(s):  
Gongnan Xie ◽  
Shian Li ◽  
Bengt Sunden ◽  
Weihong Zhang
Keyword(s):  
Heat Transfer ◽  
Fluid Dynamics ◽  
Computational Fluid Dynamics ◽  
Thermal Performance ◽  
Heat Sink ◽  
Electronic Devices ◽  
Heat Sinks ◽  
Bottom Surface ◽  
Moderate Pressure ◽  
Content Type

Purpose – With the development of electronic devices, including the desires of integration, miniaturization, high performance and the output power, cooling requirement of chips have been increased gradually. Water-cooled minichannel is an effective cooling technology for cooling of heat sinks. The minichannel flow geometry offers large surface area for heat transfer and a high convective heat transfer coefficient with only a moderate pressure loss. The purpose of this paper is to analyze a minichannel heat sink having the bottom size of 35 mm×35 mm numerically. Two kinds of chip arrangement are investigated: diagonal arrangement and parallel arrangement. Design/methodology/approach – Computational fluid dynamics (CFD) technique is used to investigate the flow and thermal fields in forced convection in a three-dimensional minichannels heat sink with different chip arrangements. The standard k-e turbulence model is applied for the turbulence simulations on the minichannel heat sink. Findings – The results show that the bottom surface of the heat sink with various chip arrangements will have different temperature distribution and thermal resistance. A suitable chip arrangement will achieve a good cooling performance for electronic devices. Research limitations/implications – The fluid is incompressible and the thermophysical properties are constant. Practical implications – New and additional data will be helpful as guidelines in the design of heat sinks to achieve a good thermal performance and a long lifetime in operation. Originality/value – In real engineering situations, chips are always placed in various manners according to design conditions and constraints. In this case the assumption of uniform heat flux is acceptable for the surfaces of the chips rather than for the entire bottom surface of the heat sink.

scholarly journals Thermal and Flow Simulation of Concentric Annular Heat Pipe with Symmetric or Asymmetric Condenser

Energies ◽  
2021 ◽  
Vol 14 (11) ◽  
pp. 3333
Author(s):  
Eui-Hyeok Song ◽  
Kye-Bock Lee ◽  
Seok-Ho Rhi
Keyword(s):  
Fluid Dynamics ◽  
Computational Fluid Dynamics ◽  
Heat Pipe ◽  
Thermal Performance ◽  
Heat Dissipation ◽  
Cfd Simulation ◽  
Research Work ◽  
Experimental Results ◽  
Working Fluid ◽  
Computational Fluid Dynamics Cfd

The current research work describes the flow and thermal analysis inside the circular flow region of an annular heat pipe with a working fluid, using computational fluid dynamics (CFD) simulation. A two-phase flow involving simultaneous evaporation and condensation phenomena in a concentric annular heat pipe (CAHP) is modeled. To simulate the interaction between these phases, the volume of fluid (VOF) technique is used. The temperature profile predicted using computational fluid dynamics (CFD) in the CAHP was compared with previously obtained experimental results. Two-dimensional and three-dimensional simulations were carried out, in order to verify the usefulness of 3D modeling. Our goal was to compute the flow characteristics, temperature distribution, and velocity field inside the CAHP. Depending on the shape of the annular heat pipe, the thermal performance can be improved through the optimal design of components, such as the inner width of the annular heat pipe, the location of the condensation part, and the amount of working fluid. To evaluate the thermal performance of a CAHP, a numerical simulation of a 50 mm long stainless steel CAHP (1.1 and 1.3 in diameter ratio and fixed inner tube diameter (78 mm)) was done, which was identical to the experimental system. In the simulated analysis results, similar results to the experiment were obtained, and it was confirmed that the heat dissipation was higher than that of the existing conventional heat pipe, where the heat transfer performance was improved when the asymmetric area was cooled. Moreover, the simulation results were validated using the experimental results. The 3-D simulation shows good agreement with the experimental results to a reasonable degree.

Comparative Thermal Performance of a Parabolic Trough Receiver With Cu-Therminol®VP-1, Ag-Therminol®VP-1 and Al2O3-Therminol®VP-1 Nanofluids

2016 ◽  
Author(s):  
Aggrey Mwesigye ◽  
Zhongjie Huan ◽  
Josua P. Meyer
Keyword(s):  
Fluid Dynamics ◽  
Computational Fluid Dynamics ◽  
Thermal Performance ◽  
Thermal Efficiency ◽  
Base Fluid ◽  
Concentration Ratio ◽  
Volume Fraction ◽  
Parabolic Trough ◽  
High Concentration ◽  
Flux Boundary Condition

As parabolic trough systems with high concentration ratios become feasible, convective heat transfer enhancement is expected to play a significant role in improving the thermal and thermodynamic performance of these systems. In this paper, the thermal performances of a high concentration ratio system using three different types of nanofluids were investigated. A system with a geometric concentration ratio of 113 and a rim angle of 80° was used in this study. The nanofluids considered were copper-Therminol®VP-1, silver-Therminol®VP-1 and Al2O3-Therminol®VP-1 nanofluid. For each nanofluid, the volume fraction of the nanoparticles in the base fluid was varied from 0–6%. The numerical solution was obtained using a finite volume based computational fluid dynamics tool. Temperature dependent properties were used for both the base fluid and the nanoparticles. An actual receiver heat flux boundary condition obtained using Monte Carlo ray tracing was coupled to the computational fluid dynamics code to model the thermal performance of the receiver. Results show that for each nanofluid used, the thermal performance of the receiver improves significantly. The thermal efficiency increases by about 12.5%, 13.9% and 7.2% for the copper-Therminol®VP-1, silver-Therminol®VP-1 and Al2O3-Therminol®VP-1 nanofluids, respectively as the volume fraction increases from 0 to 6%. The thermal efficiency improvement with silver-Therminol®VP-1 was the highest of the considered nanofluids owing to the relatively higher thermal conductivity of silver.

Sign in / Sign up

Export Citation Format

Share Document