High Precision Femtosecond Laser Micromachining for Rapid Manufacture of MEMS Devices
Laser assisted machining in the MEMS context is gaining recognition due to its versatility in application and its cost effectiveness compared to processes such as LIGA, chemical vapor deposition, electrical discharge machining etc. High thermal conductivity causes instant heat transfer to the surroundings leading to significant heat affected zones. Damage to the surroundings is further aggravated by high ablation thresholds for metals when excimer lasers are used. Ultrashort pulse lasers have been found to minimize thermal damage to the surroundings more than any other known laser. Peak power densities cause direct evaporation and plasma formation of the material. High-pressure shock waves at the machined surface transfer the particles away from the spot preventing material redeposition around the feature. In this paper, we explore the use of femtosecond lasers for rapid manufacturing of MEMS devices through laser micromachining of master molds that can be used in replication processes such as hot embossing and injection molding. The effect of various factors that affect the size and quality of the machined feature such as beam quality, length of beam path, beam waist, polarization, energy per pulse and focal length of the lens used is investigated. The effect of various materials along with the use of vacuum and inert gases on the quality of the cut is also This work aims at laying the foundation for the development of a comprehensive database on the effect of various factors that need to be considered in the design of a laser micromachining system for rapid manufacture of MEMS devices.