Comparison of Thermomechanical and Stress Wave Induced Laser Repair Techniques for Stiction-Failed Microcantilevers

2004 ◽  
Author(s):  
Sai B. Koppaka ◽  
Thomas J. Mackin ◽  
Leslie M. Phinney
Keyword(s):  
Stress Wave ◽  
Microelectromechanical Systems ◽  
Stress Waves ◽  
Back Side ◽  
Mems Devices ◽  
Repair Method ◽  
Aspect Ratios ◽  
Major Disadvantage ◽  
Initial Processing ◽  
Wave Induced

Surface micromachined structures with high aspect ratios are often utilized as sensor platforms in microelectromechanical systems (MEMS) devices. These structures generally fail by stiction or adhesion to the underlying substrate during operation, or related initial processing. Such failures represent a major disadvantage in mass production of MEMS devices with highly compliant structures. Fortunately, most stiction failures can be prevented or repaired in a number of ways. Passive approaches implemented during fabrication or release include: (1) utilizing special low adhesion coatings and (2) processing with low surface energy rinse agents. These methods, however, increase both the processing time and cost and are not entirely effective. Active approaches, such as illuminating stiction-failed microstructures with pulsed laser irradiation, have proven to be very effective for stiction repair [1–5]. A more recent and promising method, introduced by Gupta et al. [6], utilized laser-induced stress waves to repair stiction-failed microstructures. This approach represents a logical extension of the laser spallation technique for debonding thin films from substrates [7–9]. The method transmits stress waves into MEMS structures by laser-irradiating the back side of the substrate opposite the stiction-failed structures. This paper presents an experimental study that compares the stress wave repair method with the thermomechanical repair method on identical arrays of stiction-failed cantilevers.

Propagation velocity model of stress waves in larch wood (Larix gmelinii) three-dimensional space with different moisture contents

BioResources ◽  
2020 ◽  
Vol 15 (3) ◽  
pp. 6680-6695
Author(s):  
Xiwen Wei ◽  
Liping Sun ◽  
Hongjv Zhou ◽  
Yang Yang ◽  
Yifan Wang ◽  
...  
Keyword(s):  
Moisture Content ◽  
Wave Velocity ◽  
Stress Wave ◽  
Propagation Velocity ◽  
Dimensional Space ◽  
Three Dimensional ◽  
Stress Waves ◽  
Moisture Contents ◽  
Direction Angle ◽  
Stress Wave Velocity

Based on the effects of stress wave propagation in larch (Larix gmelinii) wood, the propagation mechanism of stress wave was explored, and a theoretical model of the propagation velocity of stress waves in the three-dimensional space of wood was developed. The cross and longitudinal propagation velocities of stress wave were measured in larch wood under different moisture contents (46% to 87%, 56% to 96%, 20% to 62%, and 11% to 30%) in a laboratory setting. The relationships between the propagation velocity of stress waves and the direction angle or chord angle with different moisture contents were analyzed, and the three-dimensional regression models among four parameters were established. The analysis results indicated that under the same moisture content, stress wave velocity increased as the direction angle increased and decreased as chord angle increased, and the radial velocity was the largest. Under different moisture contents, stress wave velocity gradually decreased as moisture content increased, and the stress wave velocity was more noticeably affected by moisture content when moisture content was below the fiber saturation point (FSP, 30%). The nonlinear regression models of the direction angle, chord angle, moisture content, and the propagation velocity of stress wave fit the experiment data well (R2 ≥ 0.97).

scholarly journals Stress wave induced damage and fracture in impacted glasses

1994 ◽  
Vol 04 (C8) ◽  
pp. C8-741-C8-746 ◽  
Author(s):  
H. Senf ◽  
E. Strassburger ◽  
H. Rothenhäusler
Keyword(s):  
Stress Wave ◽  
Damage And Fracture ◽  
Wave Induced

scholarly journals Development of a True-Biaxial Split Hopkinson Pressure Bar Device and Its Application

Materials ◽  
2021 ◽  
Vol 14 (23) ◽  
pp. 7298
Author(s):  
Shumeng Pang ◽  
Weijun Tao ◽  
Yingjing Liang ◽  
Shi Huan ◽  
Yijie Liu ◽  
...  
Keyword(s):  
Stress Wave ◽  
Impact Loading ◽  
Split Hopkinson Pressure Bar ◽  
Axial Stress ◽  
Dynamic Mechanical Properties ◽  
Stress Waves ◽  
Hopkinson Pressure Bar ◽  
Dynamic Mechanical ◽  
Split Hopkinson ◽  
Pressure Bar

Although highly desirable, the experimental technology of the dynamic mechanical properties of materials under multiaxial impact loading is rarely explored. In this study, a true-biaxial split Hopkinson pressure bar device is developed to achieve the biaxial synchronous impact loading of a specimen. A symmetrical wedge-shaped, dual-wave bar is designed to decompose a single stress wave into two independent and symmetric stress waves that eventually form an orthogonal system and load the specimen synchronously. Furthermore, a combination of ground gaskets and lubricant is employed to eliminate the shear stress wave and separate the coupling of the shear and axial stress waves propagating in bars. Some confirmatory and applied tests are carried out, and the results show not only the feasibility of this modified device but also the dynamic mechanical characteristics of specimens under biaxial impact loading. This novel technique is readily implementable and also has good application potential in material mechanics testing.

Microsensors, MEMS and NEMS Based Complex Adaptive Smart Devices and Systems

2001 ◽  
Author(s):  
Vijay K. Varadan
Keyword(s):  
Self Assembly ◽  
Communication Systems ◽  
Microelectromechanical Systems ◽  
System Level ◽  
Smart Devices ◽  
Mems Devices ◽  
Wafer Level ◽  
Sensors And Actuators ◽  
Complex Adaptive ◽  
Microelectronics Industry

Abstract The microelectronics industry has seen explosive growth during the last thirty years. Extremely large markets for logic and memory devices have driven the development of new materials, and technologies for the fabrication of even more complex devices with features sizes now down at the sub micron level. Recent interest has arisen in employing these materials, tools and technologies for the fabrication of miniature sensors and actuators and their integration with electronic circuits to produce smart devices and MicroElectroMechanical Systems (MEMS). This effort offers the promise of: 1. Increasing the performance and manufacturability of both sensors and actuators by exploiting new batch fabrication processes developed for the IC and microelectronics industry. Examples include micro stereo lithographic and micro molding techniques. 2. Developing novel classes of materials and mechanical structures not possible previously, such as diamond like carbon, silicon carbide and carbon nanotubes, micro-turbines and micro-engines. 3. Development of technologies for the system level and wafer level integration of micro components at the nanometer precision, such as self-assembly techniques and robotic manipulation. 4. Development of control and communication systems for MEMS devices, such as optical and RF wireless, and power delivery systems.

MEMS-Enabled Smart Beam-Steering Antennas

2014 ◽  
pp. 183-203
Author(s):  
Hadi Mirzajani ◽  
Habib Badri Ghavifekr ◽  
Esmaeil Najafi Aghdam
Keyword(s):  
Microelectromechanical Systems ◽  
Rf Mems ◽  
Beam Steering ◽  
Smart Antennas ◽  
Phase Shifters ◽  
Rapid Rate ◽  
Mems Devices ◽  
Batch Fabrication ◽  
Mems Technology ◽  
Smart Beam

In recent years, Microelectromechanical Systems (MEMS) technology has seen a rapid rate of evolution because of its great potential for advancing new products in a broad range of applications. The RF and microwave devices and components fabricated by this technology offer unsurpassed performance such as near-zero power consumption, high linearity, and cost effectiveness by batch fabrication in respect to their conventional counterparts. This chapter aims to give an in-depth overview of the most recently published methods of designing MEMS-based smart antennas. Before embarking into the different techniques of beam steering, the concept of smart antennas is introduced. Then, some fundamental concepts of MEMS technology such as micromachining technologies (bulk and surface micromachining) are briefly discussed. After that, a number of RF MEMS devices such as switches and phase shifters that have applications in beam steering antennas are introduced and their operating principals are completely explained. Finally, various configurations of MEMS-enabled beam steering antennas are discussed in detail.

A Renewal Weakest-Link Model of Strength Distribution of Polycrystalline Silicon MEMS Structures

2019 ◽  
Vol 86 (8) ◽  
Author(s):  
Zhifeng Xu ◽  
Roberto Ballarini ◽  
Jia-Liang Le
Keyword(s):  
Experimental Data ◽  
Polycrystalline Silicon ◽  
Microelectromechanical Systems ◽  
Strength Distribution ◽  
Material Strength ◽  
Mems Devices ◽  
Efficient Computation ◽  
Weakest Link ◽  
Large Size ◽  
The Stability

Experimental data have made it abundantly clear that the strength of polycrystalline silicon (poly-Si) microelectromechanical systems (MEMS) structures exhibits significant variability, which arises from the random distribution of the size and shape of sidewall defects created by the manufacturing process. Test data also indicated that the strength statistics of MEMS structures depends strongly on the structure size. Understanding the size effect on the strength distribution is of paramount importance if experimental data obtained using specimens of one size are to be used with confidence to predict the strength statistics of MEMS devices of other sizes. In this paper, we present a renewal weakest-link statistical model for the failure strength of poly-Si MEMS structures. The model takes into account the detailed statistical information of randomly distributed sidewall defects, including their geometry and spacing, in addition to the local random material strength. The large-size asymptotic behavior of the model is derived based on the stability postulate. Through the comparison with the measured strength distributions of MEMS specimens of different sizes, we show that the model is capable of capturing the size dependence of strength distribution. Based on the properties of simulated random stress field and random number of sidewall defects, a simplified method is developed for efficient computation of strength distribution of MEMS structures.

scholarly journals Stability Improvement of Flexible Shallow Shells Using Neutron Radiation

Materials ◽  
2020 ◽  
Vol 13 (14) ◽  
pp. 3187
Author(s):  
Anton V. Krysko ◽  
Jan Awrejcewicz ◽  
Irina V. Papkova ◽  
Vadim A. Krysko
Keyword(s):  
Temperature Field ◽  
Neutron Irradiation ◽  
Microelectromechanical Systems ◽  
Neutron Radiation ◽  
Middle Surface ◽  
Aviation Industry ◽  
Irradiation Effect ◽  
Structural Members ◽  
Mems Devices ◽  
Shallow Shells

Microelectromechanical systems (MEMS) are increasingly playing a significant role in the aviation industry and space exploration. Moreover, there is a need to study the neutron radiation effect on the MEMS structural members and the MEMS devices reliability in general. Experiments with MEMS structural members showed changes in their operation after exposure to neutron radiation. In this study, the neutron irradiation effect on the flexible MEMS resonators’ stability in the form of shallow rectangular shells is investigated. The theory of flexible rectangular shallow shells under the influence of both neutron irradiation and temperature field is developed. It consists of three components. First, the theory of flexible rectangular shallow shells under neutron radiation in temperature field was considered based on the Kirchhoff hypothesis and energetic Hamilton principle. Second, the theory of plasticity relaxation and cyclic loading were taken into account. Third, the Birger method of variable parameters was employed. The derived mathematical model was solved using both the finite difference method and the Bubnov–Galerkin method of higher approximations. It was established based on a few numeric examples that the irradiation direction of the MEMS structural members significantly affects the magnitude and shape of the plastic deformations’ distribution, as well as the forces magnitude in the shell middle surface, although qualitatively with the same deflection the diagrams of the main investigated functions were similar.

Stress wave velocity measured in intact pig lungs with cross-spectral analysis

1994 ◽  
Vol 76 (2) ◽  
pp. 565-571 ◽  
Author(s):  
M. Jahed ◽  
S. J. Lai-Fook
Keyword(s):  
Spectral Analysis ◽  
Stress Wave ◽  
Intratracheal Instillation ◽  
Weight Ratio ◽  
Transpulmonary Pressure ◽  
Dry Weight ◽  
Stress Waves ◽  
Wave Velocities ◽  
Esophageal Balloon

In anesthetized pigs (25–40 kg), we generated stress waves in the lung by rapid deflation of an esophageal balloon. The source distortion was measured by an accelerometer (1 g wt) bonded to the balloon. Stress waves were detected by three accelerometers bonded to intercostal muscle and to the skin near midchest. The distance between the source and chest receivers were measured radiographically. Cross-spectral analysis was used to calculate transit times. We measured stress wave velocities at airway pressures of 0 (functional residual capacity) and 25 cmH2O. Transpulmonary pressure (Ptp) was measured by an esophageal balloon. In vivo, stress wave velocities increased from 291 +/- 117 (SD) cm/s at 3.0 +/- 0.9 cmH2O Ptp to 573 +/- 73 cm/s at 13.8 +/- 3.5 cmH2O Ptp (n = 6). These velocities agreed with longitudinal wave velocities measured in isolated sheep lungs and predictions based on the elastic moduli of lung parenchyma. Post-mortem edema was induced by intratracheal instillation of 200 ml of saline, resulting in a wet-to-dry weight ratio of 7.7 +/- 1.4 (n = 5). At 15 cmH2O Ptp, stress wave velocities decreased from 565 +/- 155 cm/s before edema to 445 +/- 130 cm/s after edema. This decrease correlated well with predictions based on the increased lung density, as dictated by elasticity theory.

Wafer-Level Strength and Fracture Toughness Testing of Surface-Micromachined MEMS Devices

1999 ◽  
Vol 605 ◽  
Author(s):  
H. Kahn ◽  
N. Tayebi ◽  
R. Ballarini ◽  
R.L. Mullen ◽  
A.H. Heuer
Keyword(s):  
Fracture Toughness ◽  
Tensile Strength ◽  
Microelectromechanical Systems ◽  
Reliability Prediction ◽  
Bend Strength ◽  
Mems Devices ◽  
Wafer Level ◽  
Toughness Testing ◽  
Loading Devices

AbstractDetermination of the mechanical properties of MEMS (microelectromechanical systems) materials is necessary for accurate device design and reliability prediction. This is most unambiguously performed using MEMS-fabricated test specimens and MEMS loading devices. We describe here a wafer-level technique for measuring the bend strength, fracture toughness, and tensile strength of MEMS materials. The bend strengths of surface-micromachined polysilicon, amorphous silicon, and polycrystalline 3C SiC are 5.1±1.0, 10.1±2.0, and 9.0±1.0 GPa, respectively. The fracture toughness of undoped and P-doped polysilicon is 1.2±0.2 MPa√m, and the tensile strength of polycrystalline 3C SiC is 3.2±1.2 GPa. These results include the first report of the mechanical strength of micromachined polycrystalline 3C SiC.

Resonant Fatigue Testing of Cantilever Specimens Prepared from Thin Films

2008 ◽  
Vol 1139 ◽  
Author(s):  
Kwangsik Kwak ◽  
Masaaki Otsu ◽  
Kazuki Takashima
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Cantilever Beam ◽  
Microelectromechanical Systems ◽  
Fatigue Testing ◽  
Crystalline Silicon ◽  
Gold Foil ◽  
Fatigue Properties ◽  
Mems Devices ◽  
Testing Method

AbstractFatigue properties of thin film materials are extremely important to design durable and reliable microelectromechanical systems (MEMS) devices. However, it is rather difficult to apply conventional fatigue testing method of bulk materials to thin films. Therefore, a fatigue testing method fitted to thin film materials is required. In this investigation, we have developed a fatigue testing method that uses a resonance of cantilever type specimen prepared from thin films. Cantilever beam specimens with dimensions of 1(W) × 3(L) × 0.01(t) mm3 were prepared from Ni-P amorphous alloy thin films and gold foils. In addition, cantilever beam specimens with dimension of 3(L) × 0.3(W) × 0.005(t) mm3 were also prepared from single crystalline silicon thin films. These specimens were fixed to a holder that is connected to an golddio speaker used as an actuator, and were resonated in bending mode. In order to check the validity of this testing method, Young's moduli of these specimens were measured from resonant frequencies. The average Young's modulus of Ni-P was 108 GPa and that of gold foil specimen was 63 GPa, and these values were comparable with those measured by other techniques. This indicates that the resonance occurred theoretically-predicted manner and this testing method is valid for measuring the fatigue properties of thin films. Resonant fatigue tests were carried out for these specimens by changing amplitude range of resonance, and S-N curves were successfully obtained.

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