Automated Assembly and Hermetic Packaging of MOEMS for Applications Requiring Extended Shelf-Lives

2005 ◽  
Author(s):  
Dan O. Popa ◽  
Michael Deeds ◽  
Abiodun Fasoro ◽  
Heather Beardsley ◽  
Jeongsik Sin ◽  
...  
Keyword(s):  
Machine Vision ◽  
Shelf Life ◽  
Cost Effective ◽  
Wire Bonding ◽  
Automated Assembly ◽  
Hermetic Packaging ◽  
Die Attach ◽  
Pick And Place ◽  
Solder Reflow ◽  
Seam Sealing

In this paper we describe two modular automated microassembly systems, along with a several packaging processes that have been integrated to produce reliable and cost-effective MOEMS devices. The automated and packaging systems consists of robotics such as pick and place, insertion and fastening, machine vision and controls, and processes such as die attach, solder reflow by laser, wire bonding and seam sealing. The target MOEMS devices are intended for applications requiring a minimum twenty year shelf-life.

scholarly journals Feasibility Study of an Automated Assembly Process for Ultrathin Chips

Micromachines ◽  
2020 ◽  
Vol 11 (7) ◽  
pp. 654
Author(s):  
Florian Janek ◽  
Ebru Saller ◽  
Ernst Müller ◽  
Thomas Meißner ◽  
Sascha Weser ◽  
...  
Keyword(s):  
Feasibility Study ◽  
Biomedical Applications ◽  
Adhesive Bonding ◽  
Cost Effective ◽  
Automatic Assembly ◽  
Automated Assembly ◽  
Thermal Release ◽  
Relative Placement ◽  
Pick And Place ◽  
Placement Accuracy

This paper presents a feasibility study of an automated pick-and-place process for ultrathin chips on a standard automatic assembly machine. So far, scientific research about automated assembly of ultrathin chips, with thicknesses less than 50 µm, is missing, but is necessary for cost-effective, high-quantity production of system-in-foil for applications in narrow spaces or flexible smart health systems applied in biomedical applications. Novel pick-and-place tools for ultrathin chip handling were fabricated and a process for chip detachment from thermal release foil was developed. On this basis, an adhesive bonding process for ultrathin chips with 30 µm thickness was developed and transferred to an automatic assembly machine. Multiple ultrathin chips aligned to each other were automatically placed and transferred onto glass and polyimide foil with a relative placement accuracy of ±25 µm.

Processing and Value Addition of Bamboo Shoots for Utilization as Food Products

2020 ◽  
Vol 27 (1) ◽  
pp. 27-32
Author(s):  
Ashok Kumar Pandey ◽  
Keyword(s):  
Shelf Life ◽  
Value Added ◽  
Cost Effective ◽  
Nutrient Content ◽  
Food Products ◽  
Value Addition ◽  
Mineral Contents ◽  
Bamboo Shoots ◽  
Processed Products ◽  
Edible Products

Bamboo shoots being low in fat, high in dietary fiber and rich in mineral contents have been consumed traditionally by the people world over. Besides nutrients it also contains some anti-nutrients e.g. cyanogens. Due to seasonal availability of bamboo shoots, processing for reducing anti-nutrients in raw shoots while keeping nutrients intact and enhancement of shelf life of the value added products assume great significance for its utilization. This paper focuses on post harvest processing and value addition of bamboo shoots for its utilization as food products. Juvenile bamboo shoots of Bambusa bambos, B. tulda, Dendrocalamus asper and D. strictus were collected and processed, by boiling in brine solution, to remove the anti-nutrients (cyanogen). A simple, efficient and cost effective processing method for bamboo shoots was developed. This method significantly reduces the amount of cyanogens and retains considerable amount of nutrients and thus may be utilized for processing of bamboo shoots. Different value added edible products viz. chunks or bari (by adding pulses), pickle, sauce and papad (by adding potato) were prepared. All products were good in taste and texture. Nutritional analysis was done to determine the shelf life of the products. The nutrient content of processed products (chunks, sauce, pickle and papad) showed a gradual decrease and need to be consumed within 6 months from the date of making. However, in case of papad the carbohydrate content did not decrease much but the taste was not acceptable after 8 months. Whereas, in case of pickles, even nutrient content decreased but the product was acceptable even after two years after preparation as it was good in taste and texture. Thus, processing and value addition practices can be considered as key to the future of sustainable management of bamboo resources because they not only provide quality edible products but also enable harvesters/collectors to get better income opportunities.

scholarly journals Purwarupa Alat Kalibrasi Kerataan Bidang Kerja menggunakan Laser Sensor

2018 ◽  
Vol 6 (2) ◽  
pp. 274
Author(s):  
BUDI SUGANDI ◽  
SURADI WIYONO
Keyword(s):  
Prototype System ◽  
Laser Sensor ◽  
Important Process ◽  
Manual Measurement ◽  
Industrial Manufacturing ◽  
Die Attach ◽  
Pick And Place ◽  
Component Assembly ◽  
Keywords Laser

ABSTRAKSalah satu elemen teknologi pendukung dari industri manufaktur elektronika adalah mesin Die Attach. Mesin ini digunakan pada proses assembly komponen dengan metode pick and place komponen pada material. Sebagai proses yang penting dalam industri manufaktur, mesin ini memerlukan kalibrasi secara reguler dan tepat yang akan menjadi kunci sukses dari kualitas suatu produksi. Penelitian ini bertujuan membuat suatu purwarupa alat yang digunakan sebagai pengontrol kalibrasi dengan menggunakan laser sensor. Proses kalibrasi dilakukan dengan cara mengukur kerataan titip sisi work holder menggunakan laser sensor. Kerataan didapatkan dengan membandingkan jarak yang terukur oleh laser sensor pada tiap titik uji. Jarak yang sama pada tiap titik uji menunjukkan kerataan dari work holder. Pergerakan laser sensor dikontrol oleh dua buah motor yang bergerak ke arah sumbu X dan Y. Alat ini telah diuji dengan mengkalibrasi pada empat sisi work holder. Hasil pengujian kemudian dibandingkan dengan pengukuran manual dan didapatkan error rata-rata pengukuran sekitar 4%.Kata kunci: Laser sensor, kerataan, kalibrasi, die attach machine ABSTRACTOne of the element technology supporting an industrial manufacturing is Die Attach machine. This machine is used at component assembly using component pick and place. As an important process, this machine requires regular and precise calibration to support quality of the product. This research aims to build a prototype system using laser sensor which can be used as calibration instrument. The callibration proses was done by measuring the flatness of each side of work holder using laser sensor. The flatness was obtained by comparing the distance of each testing point. The same distance on each testing point represented the flatness of the wrok holder. The movement of laser sensor was controlled by two motors which moved to X and Y axis. The system has been tested to calibrate each side of work holder. The experimental results were then compare with manual measurement and showed the measurement error about 4%.Keywords: Laser sensor, flatness, callibration, die attach machine.

Optimization of pick-and-place in die attach process using a genetic algorithm

2018 ◽  
Vol 68 ◽  
pp. 856-865 ◽  
Author(s):  
You-Jin Park ◽  
Gilseung Ahn ◽  
Sun Hur
Keyword(s):  
Genetic Algorithm ◽  
Die Attach ◽  
Pick And Place

Technologies and Trends to Improve Power Electronic Packaging

2011 ◽  
Vol 2011 (1) ◽  
pp. 000430-000437
Author(s):  
M. Schneider-Ramelow ◽  
M. Hutter ◽  
H. Oppermann ◽  
J.-M. Göhre ◽  
S. Schmitz ◽  
...  
Keyword(s):  
High Reliability ◽  
Transient Liquid Phase ◽  
Wire Bonding ◽  
Temperature Cycling ◽  
Material Behavior ◽  
Process Selection ◽  
Chip Surface ◽  
Bonding Parameters ◽  
Strong Trend ◽  
Die Attach

In the realm of power modules a strong trend toward high temperature and high reliability applications can be observed, which entails new technological challenges, especially for the assembly and packaging of power semiconductors. Because of the well known failure mechanisms of established lead-free standard soldering and heavy aluminum wire bonding technologies, such as fatigue and creep of die attach material and wire bonds at thermal cycling, academic and industrial research focuses on more reliable interconnection technologies. A priority is the research of alternative top and bottom side chip interconnection materials or technologies to improve the temperature cycling capability of power chips that are typically assembled on ceramic substrates. The scientific focus is on Ag sintering as die attach and/or heavy ribbon bonding, for example with Al or bi-metal (Al-Cu). Another focus is the material behavior of ribbon bonds in combination with bonding machine improvements (higher bonding parameters, cutting tool). But there are other very promising technologies like transient liquid phase bonding, for example with Cu-Sn or Ag-Sn systems or Cu heavy wire bonding (up to 400 μm wire diameter) or Cu/Al-Bi metal ribbon bonding. Challenges posed by these technologies have to be discussed focusing on materials and process selection and reliability issues. Process temperatures and temperature profiles must be optimized, wire bonding machines and the chip surface structures as well as finish metallizations need to be adapted. This paper will give an overview of alternative power chip interconnection technologies and discuss the challenges related to processing and reliability.

Application of plasma cleaning process in MEMS filter micro-assembly

2020 ◽  
Vol 34 (24) ◽  
pp. 2050256
Author(s):  
Yuhua Hu ◽  
Yan Zhang ◽  
Qin Zhou
Keyword(s):  
Radio Frequency ◽  
Wire Bonding ◽  
Circuit Board ◽  
Plasma Cleaning ◽  
Cleaning Process ◽  
Micro Assembly ◽  
Die Attach ◽  
Before And After ◽  
Low Efficiency ◽  
Mems Filter

To solve the problems of low efficiency and high void rate in the process of the MEMS filter (die) attach and increase the strength of wire bonding between the die and microwave circuit board, plasma cleaning process was introduced in the micro-assembly process of the MEMS filter switch module. The spreading area of the solder melted on the copper was analyzed before and after the plasma cleaning process. Process parameters including plasma flow, radio frequency time and radio frequency power were optimized by the orthogonal test. It is demonstrated that the plasma cleaning process is effective to decrease the void rates in die attach and enhance the wire bonding strength, thus improve the reliability of the MEMS filter module micro-assembly.

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