Effect of Ni-Coated Carbon Nanotubes on the Creep Behavior of Sn-Ag-Cu Solder by Nanoindentation
Keyword(s):
In the present study, the powder metallurgy route was used to successfully incorporate Ni-coated carbon nanotubes into Sn-Ag-Cu solder, to form a nanocomposite solder. Nanoindentation tests were performed on both composite and Sn-Ag-Cu solder samples to investigate their creep behaviour at room temperature. Characterization results revealed that with the addition of Ni-coated carbon nanotubes, the creep behaviour of composite solder improved significantly as compared to that of the unreinforced solder alloy. Moreover, increasing the maximum load from 20 mN to 100 mN increased the percentage reduction in creep strain rate from 4% to 28%, for the composite compared to its monolithic counterpart after 300 s of holding.
2010 ◽
Vol 09
(04)
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pp. 283-287
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2011 ◽
Vol 23
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pp. 1108-1115
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2012 ◽
Vol 626
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pp. 791-796
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2009 ◽
Vol 289-292
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pp. 127-136
2012 ◽
Vol 554-556
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