Effects of SiC nanowires on reliability of Sn58Bi-0.05GNSs/Cu solder joints

2020 ◽  
pp. 2150007
Author(s):  
Nan Jiang ◽  
Liang Zhang ◽  
Kai-Kai Xu ◽  
Mu-Lan Li ◽  
Feng-Jiang Wang
Keyword(s):  
Shear Strength ◽  
Powder Metallurgy ◽  
Melting Temperature ◽  
Composite Solder ◽  
Solder Joints ◽  
Shear Properties ◽  
Wetting Behavior ◽  
Sic Nanowires ◽  
Reliability Of Solder Joints ◽  
Powder Metallurgy Route

In this work, SiC nanowires (SiC NWs) reinforced SBG (Sn-58Bi-0.05GNSs) composite solder was prepared using powder metallurgy route. The effect of SiC NWs on melting temperature, wetting behavior, shear properties, microstructure of the prepared solder joints and interfacial reaction were studied in detail. Results reveal that incorporating SiC NWs can develop the wetting behavior and shear properties of solder joint but has a little effect on melting temperature. The microstructure of solder is refined markedly with the addition of SiC NWs, which is one of the reasons for the increase in the shear strength of the solder joints. Additionally, the dimension of Cu6Sn5 IMC grains diminishes with the doping of SiC NWs, which resulted in the thinning of Cu6Sn5 IMC layer. Thence, the addition of SiC NWs may be an effective way to improve the reliability of solder joints.

scholarly journals Microstructure and shear properties of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling

2021 ◽  
Vol 11 (1) ◽  
Author(s):  
Jianguo Cui ◽  
Keke Zhang ◽  
Di Zhao ◽  
Yibo Pan
Keyword(s):  
Shear Strength ◽  
Thermal Cycling ◽  
Solder Joints ◽  
High Reliability ◽  
Sharp Decrease ◽  
Thermal Shock Test ◽  
Shear Properties ◽  
Equivalent Time ◽  
Ultrasonic Assisted ◽  
Reliability Of Solder Joints

AbstractThrough ultrasonic wave assisted Sn2.5Ag0.7Cu0.1RExNi/Cu (x = 0, 0.05, 0.1) soldering test and − 40 to 125 °C thermal shock test, the microstructure and shear properties of Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling were studied by the SEM, EDS and XRD. The results show that the Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints with high quality and high reliability can be obtained by ultrasonic assistance. When the ultrasonic vibration power is 88 W, the ultrasonic-assisted Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu solder joints exhibits the optimized performance. During the thermal cycling process, the shear strength of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints had a linear relationship with the thickness of interfacial intermetallic compound (IMC). Under the thermal cycling, the interfacial IMC layer of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints consisted of (Cu,Ni)6Sn5 and Cu3Sn. The thickness of interfacial IMC of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints was linearly related to the square root of equivalent time. The growth of interfacial IMC of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints had an incubation period, and the growth of IMC was slow within 300 cycles. And after 300 cycles, the IMC grew rapidly, the granular IMC began to merge, and the thickness and roughness of IMC increased obviously, which led to a sharp decrease in the shear strength of the solder joints. The 0.05 wt% Ni could inhibit the excessive growth of IMC, improve the shear strength of solder joints and improve the reliability of solder joints. The fracture mechanism of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints changed from the ductile–brittle mixed fracture in the solder/IMC transition zone to the brittle fracture in the interfacial IMC.

Impact of different aging conditions on the IMC layer growth and shear strength of Ni-modified MWCNTs reinforced Sn-Ag-Cu composite solder

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Xinmeng Zhai ◽  
Yue Chen ◽  
Yuefeng Li
Keyword(s):  
Shear Strength ◽  
Composite Solder ◽  
Solder Joints ◽  
Layer Growth ◽  
Nano Particles ◽  
Content Type ◽  
Aging Conditions ◽  
Multi Walled Carbon Nanotubes ◽  
Reliability Of Solder Joints ◽  
Effects Of Aging

Purpose The purpose of this paper is to develop a new composite solder to improve the reliability of composite solder joints. Nano-particles modified multi-walled carbon nanotubes (Ni-MWCNTs) can indeed improve the microstructure of composite solder joints and improve the reliability of solder joints. Although many people have conducted in-depth research on the composite solder of Ni-MWCNTs. However, no one has studied the performance of Ni-MWCNTs composite solder under different aging conditions. In this article, Ni-MWCNTs was added to Sn-Ag-Cu (SAC) solder, and the physical properties of composite solder, the microstructure and mechanical properties were evaluated. Design/methodology/approach In this study, the effect of different aging conditions on the intermetallic compound (IMC) layer growth and shear strength of Ni-modified MWCNTs reinforced SAC composite solder was studied. Compared with SAC307 solder alloy, the influence of Ni-MWCNTs with different contents (0, 0.1 and 0.2 Wt.%) on composite solder was examined. To study the aging characteristics of composite solder joints, the solder joints were aged at 80°C, 120°C and 150°C. Findings The experimental results show that the content of Ni-MWCNTs affects the morphology and growth of the IMC layer at the interface. The microhardness of the solder increases and the wetting angle decreases. After aging at moderate (120°C) and high temperature (150°C), the morphology of the Cu6Sn5 IMC layer changed from scallop to lamellar and the grain size became coarser. The following two different phase compositions were observed in the solder joints with Ni-MWCNTs reinforcement: Cu3Sn and (Cu, Ni)6Sn5. The fracture surface of the solder joints all appeared ductile dents, and the size of the pits increased significantly with the increase of the aging temperature. Through growth kinetic analysis, Ni-modified MWCNTs in composite solder joints can effectively inhibit the diffusion of atoms in solder joints. In short, when the addition amount of Ni-MWCNTs is 0.1 Wt.%, the solder joints exhibit the best wettability and the highest shear strength. Originality/value In this study, the effects of aging conditions on the growth and shear strength of the IMC layer of Ni modified MWCNTs reinforced SAC307 composite solder were studied. The effects of Ni MWCNTs with different contents (0, 0.1 and 0.2 Wt.%) on the composite solder were examined.

An investigation of microstructure and properties of Sn3.0Ag0.5Cu-XAl2O3 composite solder

2016 ◽  
Vol 28 (2) ◽  
pp. 84-92 ◽  
Author(s):  
Guang Chen ◽  
Bomin Huang ◽  
Hui Liu ◽  
Y.C. Chan ◽  
Zirong Tang ◽  
...  
Keyword(s):  
Powder Metallurgy ◽  
Ball Milling ◽  
Composite Solder ◽  
Solder Joints ◽  
Solder Matrix ◽  
Solder Alloys ◽  
Content Type ◽  
Microstructure And Properties ◽  
Sac Solder ◽  
Powder Metallurgy Route

Purpose The purpose of this paper is to investigate microstructure and properties of Sn3.0Ag0.5Cu-XAl2O3 composite solder which were prepared through powder metallurgy route. Design/methodology/approach Sn3.0Ag0.5Cu (SAC305)-XAl2O3 (X = 0.2, 0.4, 0.6, 0.8 Wt. %) composite solders were prepared through the powder metallurgy route. The morphology of composite solder powders which consists of Al2O3 particles and SAC solder powders after ball milling was observed. The retained ratio of Al2O3 nanoparticles in composite solder billets and solder joints were also quantitatively measured. Furthermore, the as-prepared composite solder alloys were studied extensively with regard to their microstructures, thermal property, wettability and mechanical properties. Findings After ball milling, the Al2O3 nanoparticles added were observed embedded into the surface of SAC solder powders. Only about 5-10 per cent of the initial Al2O3 nanoparticles added were detected in the composite solder joints after reflow. In addition, finer ß-Sn grains were achieved with addition of Al2O3 nanoparticles; the Al2O3 nanoparticles were found retained in the composite solder matrix. Besides, negligible changes in melting temperature and the considerably reduced undercooling were obtained in composite solder alloys. Wettability was improved by appropriate addition of Al2O3 nanoparticles. Microhardness and shear strength of composite solders were both improved after Al2O3 nanoparticles addition. Originality/value This paper indicated that powder metallurgy route offered a feasible approach to produce nanoparticle reinforced composite solder. In addition, the quantitative analysis of the actual retained ratio of the Al2O3 nanoparticles in solder joints provided practical implications for the manufacture of composite solders.

Research Advances of Composite Solder Material Fabricated via Powder Metallurgy Route

2012 ◽  
Vol 626 ◽  
pp. 791-796 ◽  
Author(s):  
Mohd Arif Anuar Mohd Salleh ◽  
Muhammad Hafiz Hazizi ◽  
Mohd Mustafa Al Bakri Abdullah ◽  
N.Z. Noriman ◽  
Ramani Mayapan ◽  
...  
Keyword(s):  
Elevated Temperature ◽  
Powder Metallurgy ◽  
Solder Joint ◽  
Composite Solder ◽  
Lead Free ◽  
Mixed Powder ◽  
Solder Joint Reliability ◽  
Solder Material ◽  
Joint Reliability ◽  
Powder Metallurgy Route

Researches and studies on composite solder have been done by many researchers in an effort to develop viable lead-free solders which can replace the conventional lead-based solders as lead is considered as toxic. Solder materials developed by composite approach showed improvement in their properties and importantly it improved their service performance when compared with solder materials developed by other methods. This paper reviews the solder properties of various types of composite lead-free solder that were fabricated via powder metallurgy route. The fabrication processes of the composite solder material by using powder metallurgy route which involved mixing the powder homogeneously, compaction of the mixed powder and sintering the green body were discussed in detail. The types of reinforcements used in order to enhance its properties and the roles of the reinforcement used were also discussed in detail. Properties of a desirable composite solder and the effects of the reinforcement addition to the composite solder microstructure, changes in its wettability and improvement of its mechanical properties were later discussed in this paper. In conclusion, by reviewing various research advances in composite solder material, a solder material with high solder joint reliability at elevated temperature have yet to be found. Thus, a novel composite solder material with higher solder joint reliability at room and elevated temperature was proposed.

Effect of Si3N4 Addition on the Properties of Sn-1.0Ag-0.7Cu Solder Alloy

2015 ◽  
Vol 819 ◽  
pp. 167-172 ◽  
Author(s):  
Norhayanti Mohd Nasir ◽  
Norainiza Saud ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Mohd Nazree Derman ◽  
Mohd Izrul Izwan Ramli ◽  
...  
Keyword(s):  
Silicon Nitride ◽  
Powder Metallurgy ◽  
Grain Boundaries ◽  
Melting Temperature ◽  
Solder Alloy ◽  
Composite Solder ◽  
Homogeneous Distribution ◽  
The Novel ◽  
Soldering Process

This research has investigated the properties of low-silver Sn-1.0Ag-0.7Cu (SAC107) alloy. Different weight percentages (0, 0.25, 0.5, 0.75 and 1 wt. %) of silicon nitride (Si3N4) were used as reinforcement particles. The SAC107 - Si3N4 composite solder was fabricated via powder metallurgy (PM) technique. The results showed that homogeneous distribution of Si3N4 particles along the grain boundaries has increased the hardness of the SAC107 - Si3N4 composite solders compared to monolithic SAC107 solder alloy. The melting temperature is maintained at the SAC107 level, indicating that the novel composite solder is suitable for existing soldering process.

Mixing Optimization of Sn-Cu-Si3N4 via Powder Metallurgy Route for Composite Solder Fabrication

2013 ◽  
Vol 594-595 ◽  
pp. 765-769
Author(s):  
Muhammad Hafiz Zan Hazizi ◽  
M.A.A. Mohd Salleh ◽  
Zainal Ariffin Ahmad
Keyword(s):  
Powder Metallurgy ◽  
Composite Solder ◽  
Horizontal Tube ◽  
Average Particle ◽  
Mixing Process ◽  
Mixed Powder ◽  
Particle Distributions ◽  
Imagej Software ◽  
Horizontal Tube Furnace ◽  
Powder Metallurgy Route

The aim of this study was to optimize the mixing process of a composite solder fabricated via powder metallurgy route, before details study were conducted in the next stage. Powder of Sn, Cu and Si3N4were carefully weighted, mixed and blended in a mechanical alloying machine. The speed of rotation for the jar was kept constant while the time of mixing was varied. Si3N4were added to the Sn-0.7Cu solder as reinforcement. Upon completion of mixing process, the mixed powders were later compacted into a thin disc. The compacted samples were then sintered in a horizontal tube furnace. Microstructural examinations by using SEM were conducted in order to analyze the distribution of Cu and Si3N4particles. With the assistance of ImageJ software, average particle distributions were calculated. Results showed that the best particle distributions were achieved when the mixed powder were blended for 6 hours.

Effect of Ni-Coated Carbon Nanotubes on the Creep Behavior of Sn-Ag-Cu Solder by Nanoindentation

2011 ◽  
Author(s):  
J. Wei ◽  
Y. D. Han ◽  
H. Y. Jing ◽  
S. M. L. Nai ◽  
L. Y. Xu
Keyword(s):  
Carbon Nanotubes ◽  
Powder Metallurgy ◽  
Room Temperature ◽  
Composite Solder ◽  
Creep Behaviour ◽  
Maximum Load ◽  
Percentage Reduction ◽  
Coated Carbon ◽  
Nanocomposite Solder ◽  
Powder Metallurgy Route

In the present study, the powder metallurgy route was used to successfully incorporate Ni-coated carbon nanotubes into Sn-Ag-Cu solder, to form a nanocomposite solder. Nanoindentation tests were performed on both composite and Sn-Ag-Cu solder samples to investigate their creep behaviour at room temperature. Characterization results revealed that with the addition of Ni-coated carbon nanotubes, the creep behaviour of composite solder improved significantly as compared to that of the unreinforced solder alloy. Moreover, increasing the maximum load from 20 mN to 100 mN increased the percentage reduction in creep strain rate from 4% to 28%, for the composite compared to its monolithic counterpart after 300 s of holding.

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