Heat Transfer Modeling of Nanoparticle Packings on a Substrate
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The temperature evolution of nanoparticle packings on a substrate under high laser power is investigated both experimentally and via numerical simulations. Numerical modeling of temperature distributions in copper nanoparticle packings on a glass substrate is performed and results are compared with experiment under 2.6 kW/cm2 laser power. A coupled electromagnetic-heat transfer model is implemented to understand the nanoparticle temperature distribution. Very good agreement between the coupled electromagnetic-heat transfer model and the experimental results is obtained by matching the interfacial thermal conductance, G, between the nanoparticles using the experimental result in the coupled electromagnetic-heat transfer model.
2012 ◽
Vol 516-517
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pp. 312-315
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2006 ◽
Vol 116-117
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pp. 569-572
2003 ◽
Vol 7
(3)
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pp. 147-164
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