Fabrication of Flexible Interposer Using Printing Method

2020 ◽  
Author(s):  
Atsuhiro Furuta ◽  
Kazuki Honjo ◽  
Jun Taniguchi
Keyword(s):  
Silicon Substrate ◽  
Nanoimprint Lithography ◽  
Printed Electronics ◽  
Electronic Devices ◽  
Master Mold ◽  
Sintering Process ◽  
Silver Ink ◽  
Press Method ◽  
Photolithography Process ◽  
Printing Method

Abstract In recent years, flexible electronic devices such as printed electronics are gathering attention. To make flexible connect between one circuit device and another circuit device, interposer is necessary. However, most of conventional interposers are not flexible, because there are made of silicon or glass substrate. To solve this problem, we have been developed fabrication process of flexible interposer. Master mold was fabricated by photolithography process. First, SU-8 resist was coated on silicon substrate with 5μm thickness. Then, photolithography process was carried out to SU-8 resist. After development, pillar shape master molds with diameters of 10 or 20 μm were obtained. After release coating of master molds, hole patterns for vias were transferred by UV nanoimprint lithography. The obtained hole patterns were diameter of 10 μm or 20 μm, and pitch of 21.0 μm and 40.1 μm, respectively. Next, these holes were filled with silver ink by roll press method. Then, sintering process was carried out to evaporate of solvent of silver ink. After that, flexible interposer was obtained. As a result, we have been succeeded in filling the holes array with silver ink. Obtained interposer vias, which were silver region, were 8.2 μm diameter and 3.3 μm height, or 20.3 μm diameter and 5.3 μm height for 10 mm square size.

Fabrication of an Antireflective Structure on a Lenticular Lens

2020 ◽  
Author(s):  
Katsuyuki Yatagawa ◽  
Masato Nakamura ◽  
Masaki Ono ◽  
Jun Taniguchi ◽  
Shin Hiwasa
Keyword(s):  
Nanoimprint Lithography ◽  
Ion Beam ◽  
Back Side ◽  
Master Mold ◽  
Uneven Surface ◽  
Uv Curable ◽  
Oxygen Ion ◽  
Lenticular Lens ◽  
Press Method ◽  
Uv Curable Resin

Abstract In our previous study, various lenses with antireflective structures (ARSs) were fabricated by ultraviolet nanoimprint lithography (UV-NIL) and a thin flexible replica mold, which had ARSs. However, in the case of a lens with a large uneven surface such a lenticular lens, it is difficult to transfer an ARS. In this paper, the improvement of the transfer process for a lenticular lens with an ARS is investigated. A master mold of ARSs was fabricated by irradiating glassy carbon with an oxygen ion beam. A flexible replica mold with ARSs was transferred from the ARS master mold by UV-NIL. In this case, the thickness of the flexible replica mold was 210 μm. A lenticular lens with the reverse shape was also transferred from the original lenticular lens by UV-NIL. To add an ARS to the lenticular lens with the reverse shape, it was covered with a flexible replica mold coated with a UV-curable resin. In addition, the lenticular lens was placed on the back side of the flexible replica mold to contact the lens curve properly. Afterwards, the setting samples were pressed with a roll press and simultaneously UV-cured. After this roll press method was carried out, a lenticular lens with the reverse shape and an ARS was obtained. Using this mold, a lenticular lens with an ARS was replicated by UV-NIL and the reverse-shape mold with an ARS.

scholarly journals Bending reliability of screen-printed vias for a flexible energy module

2020 ◽  
Vol 4 (1) ◽  
Author(s):  
Manu Kujala ◽  
Terho Kololuoma ◽  
Jari Keskinen ◽  
Donald Lupo ◽  
Matti Mäntysalo ◽  
...  
Keyword(s):  
System Integration ◽  
Screen Printing ◽  
Printed Electronics ◽  
Bending Test ◽  
Screen Printing Method ◽  
Silver Ink ◽  
Lower Viscosity ◽  
Process Manufacturing ◽  
Printing Method ◽  
Screen Printed

Abstract The future of printed electronics involves advancements not only related to full system integration, but also lean process manufacturing. A critical aspect of this progress is developed in this study, which evaluates a highly flexible screen printed through-hole-via using silver microparticle inks, for applications in energy harvesting and storage modules. The printed vias’ fabrication and durability are evaluated by means of a double sided screen-printing method and repetitive (cyclic) bending tests. Vias, through 125-µm-thick PET foil, were laser cut (nominally 50, 100, 150, and 200 µm diameters) then filled, and simultaneously connected to adjacent vias by screen printing. To investigate the use of the printed via in a monolithic energy module, the vias were used for the fabrication of a flexible printed supercapacitor containing aqueous electrolyte and carbon electrodes. The results indicate that the lower viscosity silver ink (DuPont 5064H) fills the via less effectively than the higher viscosity ink (Asahi LS411AW), and as the via size increases (≥150 µm diameter) via walls are coated rather than filled. Conversely, the more viscous ink fills the via thoroughly and exhibited a 100% yield (1010 vias; 100 µm nominal via diameter) with the two-step direct screen-printing method. The 10-mm radius bending test showed no signs of via specific breakdown after 30,000 cycles. The results indicate that this via filling process is likely roll-to-roll compatible to enable multi-layered printed electronic devices.

Fabrication of highly conductive and flexible printed electronics by low temperature sintering reactive silver ink

2018 ◽  
Vol 459 ◽  
pp. 249-256 ◽  
Author(s):  
Yun Mou ◽  
Yuru Zhang ◽  
Hao Cheng ◽  
Yang Peng ◽  
Mingxiang Chen
Keyword(s):  
Low Temperature ◽  
Printed Electronics ◽  
Low Temperature Sintering ◽  
Silver Ink

scholarly journals Optimization of a Handwriting Method by an Automated Ink Pen for Cost-Effective and Sustainable Sensors

Chemosensors ◽  
2021 ◽  
Vol 9 (9) ◽  
pp. 264
Author(s):  
Florin C. Loghin ◽  
José F. Salmerón ◽  
Paolo Lugli ◽  
Markus Becherer ◽  
Aniello Falco ◽  
...  
Keyword(s):  
Printed Electronics ◽  
Low Cost ◽  
Electronic Devices ◽  
Cost Effective ◽  
Capacitive Sensor ◽  
Fabrication Technique ◽  
Rfid Tag ◽  
Environmental Friendly ◽  
Fast Prototyping ◽  
Do It Yourself

In this work, we present a do-it-yourself (DIY) approach for the environmental-friendly fabrication of printed electronic devices and sensors. The setup consists only of an automated handwriting robot and pens filled with silver conductive inks. Here, we thoroughly studied the fabrication technique and different optimized parameters. The best-achieved results were 300 mΩ/sq as sheet resistance with a printing resolution of 200 µm. The optimized parameters were used to manufacture fully functional electronics devices: a capacitive sensor and a RFID tag, essential for the remote reading of the measurements. This technique for printed electronics represents an alternative for fast-prototyping and ultra-low-cost fabrication because of both the cheap equipment required and the minimal waste of materials, which is especially interesting for the development of cost-effective sensors.

Morphological Characterization of Fabricated Aluminum Interdigitated Electrodes on Silicon Substrate

2015 ◽  
Vol 1109 ◽  
pp. 381-384
Author(s):  
M. Safwan Azmi ◽  
Sharipah Nadzirah ◽  
Uda Hashim
Keyword(s):  
Electron Microscope ◽  
Scanning Electron Microscope ◽  
Silicon Substrate ◽  
Morphological Characterization ◽  
Interdigitated Electrodes ◽  
Photolithography Process ◽  
Scanning Electron

The purpose of this paper is to study the morphological characterization of aluminum interdigitated electrodes (IDE) of different gap sizes on silicon substrate. The electrodes were fabricated using standard photolithography process and were done so with sizes of 12 μm, 10 μm and 7 μm. The electrodes were morphologically characterized using scanning electron microscope (SEM) and high-powered microscope (HPM).Keywords: morphological, interdigitated electrodes, aluminum

scholarly journals Printing low-melting-point alloy ink to directly make a solidified circuit or functional device with a heating pen

2014 ◽  
Vol 470 (2172) ◽  
pp. 20140609 ◽  
Author(s):  
Lei Wang ◽  
Jing Liu
Keyword(s):  
Melting Point ◽  
Electronic Circuit ◽  
Printed Electronics ◽  
Solid Phase ◽  
Electronic Devices ◽  
Change Mechanism ◽  
Short Period ◽  
Control Switch ◽  
Double Diamond ◽  
Rapidly Solidified

A new method to directly print out a solidified electronic circuit through low-melting-point metal ink is proposed. A functional pen with heating capability was fabricated. Several typical thermal properties of the alloy ink Bi 35 In 48.6 Sn 16 Zn 0.4 were measured and evaluated. Owing to the specifically selected melting point of the ink, which is slightly higher than room temperature, various electronic devices, graphics or circuits can be manufactured in a short period of time and then rapidly solidified by cooling in the surrounding air. The liquid–solid phase change mechanism of the written lines was experimentally characterized using a scanning electron microscope. In order to determine the matching substrate, wettability between the metal ink Bi 35 In 48.6 Sn 16 Zn 0.4 and several materials, including mica plate and silicone rubber, was investigated. The resistance–temperature curve of a printed resistor indicated its potential as a temperature control switch. Furthermore, the measured reflection coefficient of a printed double-diamond antenna accords well with the simulated result. With unique merits such as no pollution, no requirement for encapsulation and easy recycling, the present printing approach is an important supplement to current printed electronics and has enormous practical value in the future.

Experimental Test on Continuous Drying Sintering Apparatus by Heating Roller Type

2015 ◽  
Vol 1095 ◽  
pp. 741-745
Author(s):  
Bo Gao ◽  
Xiao Gui Zhang ◽  
Wu Qi Wang
Keyword(s):  
Printed Electronics ◽  
Experimental Device ◽  
Laboratory Research ◽  
Test Results ◽  
Sintering Process ◽  
Printing Technology ◽  
Static State ◽  
Motion State ◽  
External Circulation ◽  
The Impact

Dry sintering process has the vital significance for the printed electronics function. In order to reduce the production cost, the volume of printing technology will be an inevitable choice. In current laboratory research on dry sintering, the object of the dry sintering is still in the static state. In order to study on the related problem of moving dry sintering object under continuous dry sintering process while the volume of printing technology, to solve problems of the static motionless state, we designed a test apparatus for printing electronic dry sintering. The experimental device was driven by stepping motor, controlled by PLC, temperature controlled by external circulation heat conduction oil, heated by roller drying sintering object. Assembly test results showed that the roller surface temperature was uniform heated by experimental device, and the impact on the uniformity of dry sintering was small. The experimental device could simulate volume of continuous motion state, and also could adapt to the preparation of the shorter sample to save the experiment cost.

Chrome Mask Design for Microfluidic Fabrication

2013 ◽  
Vol 795 ◽  
pp. 276-280 ◽  
Author(s):  
Veeradasan Perumal ◽  
U. Hashim
Keyword(s):  
Device Fabrication ◽  
Wafer Surface ◽  
Master Mold ◽  
Major Step ◽  
Mask Design ◽  
Alignment Mark ◽  
Conventional Photolithography ◽  
Photolithography Process ◽  
Resolution Requirements ◽  
Chrome Mask

This paper presents a simple and effective method to design chrome mask for microfludic fabrication. Microfluidic fabrication involves 9 major step and mainly depends on the master mold template formation by SU-8 photoresists using conventional photolithography process The chrome mask was design using AutoCAD software. Essentially, mask is a crucial element in a microfluidic fabrication in which resolution requirements and precise alignment are vital, each mask needs to be precisely aligned with original alignment mark. Otherwise, it cant successfully transfer the original pattern to the wafer surface causing microchannel formation failure. Thus, the initial design is compared with the fabricated chrome mask to achieved a better result during device fabrication.

Pattern Transfer of 1μm Sized Microgap and Microbridge Electrode for Application in Biomedical Nano-Diagnostics

2014 ◽  
Vol 925 ◽  
pp. 533-537 ◽  
Author(s):  
Balakrishnan Sharma Rao ◽  
Uda Hashim
Keyword(s):  
Nanoimprint Lithography ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Conventional Technique ◽  
Good Choice ◽  
Clinical Diagnostics ◽  
Pattern Transfer ◽  
Ion Beam Lithography ◽  
Microelectronic Fabrication ◽  
Photolithography Process

We present a new design of biochip for application in clinical diagnostics by using a conventional method of pattern transfer process in microelectronic fabrication. Although there are many advanced techniques available to produce nanostructures such as electron beam lithography (EBL), ion-beam lithography (IBL), focused ion beam milling and nanoimprint lithography, these methods often requires high maintenance costs, time consuming and very complicated compared to conventional photolithography. This conventional technique is still a good choice for a feature size more than 1 micron. In this work, microbridge and microgap design from chrome mask are transferred on silicon wafer to fabricate a biochip. The pattern transfer of the first mask of electrode is presented in this paper to test the repeatability of pattern transfer during photolithography process. Therefore, during the process, the resolution and precise alignment factors are taken into account to prevent circuit and device failure. Post-exposure bake time and development limitations are recorded for both designs.

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