Semiconductor Nanostructure Design for Thermoelectric Property Control

2019 ◽  
Vol 18 (03n04) ◽  
pp. 1940036 ◽  
Author(s):  
Y. Nakamura ◽  
T. Ishibe ◽  
T. Taniguchi ◽  
T. Terada ◽  
R. Hosoda ◽  
...  

We present the methodologies for developing high-performance thermoelectric materials using nanostructured interfaces by reviewing our three studies and giving the new aspect of nanostructuring results. (1) Connected Si nanocrystals exhibited ultrasmall thermal conductivity. The drastic thermal conductivity reduction was brought by phonon confinement and phonon scattering. Here, we present discussion about the new aspect for phonon transport: not only nanocrystal size but also shape can contribute to thermal conductivity reduction. (2) Si films including Ge nanocrystals demonstrated that phonon and carrier conductions were independently controlled in the films, where carriers were easily transported through the interfaces between Si and Ge, while phonons could be effectively scattered at the interfaces. (3) Embedded-ZnO nanowire structure demonstrated the simultaneous realization of power factor increase and thermal conductivity reduction. The [Formula: see text] increase was caused by the interface-dominated carrier transport. The nanowire interfaces also worked as phonon scatterers, resulting in the thermal conductivity reduction.

Nanoscale ◽  
2021 ◽  
Vol 13 (9) ◽  
pp. 4971-4977
Author(s):  
Tatsuhiko Taniguchi ◽  
Tsukasa Terada ◽  
Yuki Komatsubara ◽  
Takafumi Ishibe ◽  
Kento Konoike ◽  
...  

Ballistic phonon transport was observed in Si films containing Ge nanodots. In SiGe films containing Ge nanodots, thermal conductivity was drastically reduced close to that of amorphous materials due to alloy phonon scattering and nanodot scattering.


2021 ◽  
Vol 7 (20) ◽  
pp. eabe6000
Author(s):  
Lin Yang ◽  
Madeleine P. Gordon ◽  
Akanksha K. Menon ◽  
Alexandra Bruefach ◽  
Kyle Haas ◽  
...  

Organic-inorganic hybrids have recently emerged as a class of high-performing thermoelectric materials that are lightweight and mechanically flexible. However, the fundamental electrical and thermal transport in these materials has remained elusive due to the heterogeneity of bulk, polycrystalline, thin films reported thus far. Here, we systematically investigate a model hybrid comprising a single core/shell nanowire of Te-PEDOT:PSS. We show that as the nanowire diameter is reduced, the electrical conductivity increases and the thermal conductivity decreases, while the Seebeck coefficient remains nearly constant—this collectively results in a figure of merit, ZT, of 0.54 at 400 K. The origin of the decoupling of charge and heat transport lies in the fact that electrical transport occurs through the organic shell, while thermal transport is driven by the inorganic core. This study establishes design principles for high-performing thermoelectrics that leverage the unique interactions occurring at the interfaces of hybrid nanowires.


Author(s):  
Jungwan Cho ◽  
Pane C. Chao ◽  
Mehdi Asheghi ◽  
Kenneth E. Goodson

Silicon films of thickness near and below one micrometer play a central role in many advanced technologies for computation and energy conversion. Numerous data on the thermal conductivity of silicon thin films are available in the literature, but mainly for the in-plane thermal conductivity of polycrystalline and single-crystal films. Here we use picosecond time-domain thermoreflectance (TDTR), transmission electron microscopy, and phonon transport theory to investigate heat conduction normal to polycrystalline silicon films on diamond substrates. The data agree with predictions that account for the coupled effects of phonon scattering on film boundaries and defects concentrated near grain boundaries. Using the data and the model, we estimate the polysilicon-diamond interface resistance to be 6.5–8 m2 K GW−1.


2017 ◽  
Vol 7 (1) ◽  
Author(s):  
Lina Yang ◽  
Austin J. Minnich

Abstract Nanocrystalline thermoelectric materials based on Si have long been of interest because Si is earth-abundant, inexpensive, and non-toxic. However, a poor understanding of phonon grain boundary scattering and its effect on thermal conductivity has impeded efforts to improve the thermoelectric figure of merit. Here, we report an ab-initio based computational study of thermal transport in nanocrystalline Si-based materials using a variance-reduced Monte Carlo method with the full phonon dispersion and intrinsic lifetimes from first-principles as input. By fitting the transmission profile of grain boundaries, we obtain excellent agreement with experimental thermal conductivity of nanocrystalline Si [Wang et al. Nano Letters 11, 2206 (2011)]. Based on these calculations, we examine phonon transport in nanocrystalline SiGe alloys with ab-initio electron-phonon scattering rates. Our calculations show that low energy phonons still transport substantial amounts of heat in these materials, despite scattering by electron-phonon interactions, due to the high transmission of phonons at grain boundaries, and thus improvements in ZT are still possible by disrupting these modes. This work demonstrates the important insights into phonon transport that can be obtained using ab-initio based Monte Carlo simulations in complex nanostructured materials.


2014 ◽  
Vol 4 (1) ◽  
Author(s):  
Xinjiang Wang ◽  
Baoling Huang

Abstract We have systematically investigated the in-plane thermal transport in Si thin films using an approach based on the first-principles calculations and lattice dynamics. The effects of phonon mode depletion induced by the phonon confinement and the corresponding variation in interphonon scattering, which may be important for the thermal conductivities of ultra-thin films but are often neglected in precedent studies, are considered in this study. The in-plane thermal conductivities of Si thin films with different thicknesses have been predicted over a temperature range from 80 K to 800 K and excellent agreements with experimental results are found. The validities of adopting the bulk phonon properties and gray approximation of surface specularity in thin film studies have been clarified. It is found that in ultra-thin films, while the phonon depletion will reduce the thermal conductivity of Si thin films, its effect is largely offset by the reduction in the interphonon scattering rate. The contributions of different phonon modes to the thermal transport and isotope effects in Si films with different thicknesses under various temperatures are also analyzed.


Author(s):  
Dhruv Singh ◽  
Jayathi Y. Murthy ◽  
Timothy S. Fisher

This paper examines the thermodynamic and thermal transport properties of the 2D graphene lattice. The interatomic interactions are modeled using the Tersoff interatomic potential and are used to evaluate phonon dispersion curves, density of states and thermodynamic properties of graphene as functions of temperature. Perturbation theory is applied to calculate the transition probabilities for three-phonon scattering. The matrix elements of the perturbing Hamiltonian are calculated using the anharmonic interatomic force constants obtained from the interatomic potential as well. An algorithm to accurately quantify the contours of energy balance for three-phonon scattering events is presented and applied to calculate the net transition probability from a given phonon mode. Under the linear approximation, the Boltzmann transport equation (BTE) is applied to compute the thermal conductivity of graphene, giving spectral and polarization-resolved information. Predictions of thermal conductivity for a wide range of parameters elucidate the behavior of diffusive phonon transport. The complete spectral detail of selection rules, important phonon scattering pathways, and phonon relaxation times in graphene are provided, contrasting graphene with other materials, along with implications for graphene electronics. We also highlight the specific scattering processes that are important in Raman spectroscopy based measurements of graphene thermal conductivity, and provide a plausible explanation for the observed dependence on laser spot size.


Author(s):  
Brian R. Smith ◽  
Cristina H. Amon

This paper analyzes the effect of Fourier vs. subcontinuum heat transport through thin layers of nanoporous silica (aerogel) in the framework of an infrared focal plane array (IRFPA) sensor system. Aerogel is introduced as a compatible material for emerging microsystems applications and the comparison between aerogel and conventional insulation systems is analyzed. Correlations between aerogel’s macro-scale thermal properties and its nano-scale structure are discussed to address the effect of the material’s amorphous structure and sub-continuum phonon transport phenomena on macro-scale thermal conductivity. Simulations using the Lattice Boltzmann Method (LBM) quantify the effect of phonon scattering on silica conductivity. Techniques for extending the analysis to a three-dimensional silica matrix are discussed in light of recent advances in the simulation of aerogel morphology.


2013 ◽  
Vol 832 ◽  
pp. 33-38 ◽  
Author(s):  
S.M. Mamand ◽  
M.S. Omar

Modified Callaway's theory was used to calculate lattice thermal conductivity (LTC) of Germanium nanowires. Results are compared to those of experimental values of the temperature dependence of LTC for nanowire diameters of 62, 19, and 15nm. In this calculation, both longitudinal and transverse modes are taken into account. Scattering of phonons is assumed to be by nanowire boundaries, imperfections, dislocations, electrons, and other phonons via both normal and Umklapp processes. Effect of parameters, phonon confinement and imperfections in limiting thermal conductivity for the nanowires under considerations are investigated. The suppression in thermal conductivity of these nanowires is arise from electron-phonon scattering and phonon-boundary scattering at low temperatures, while at high temperatures is due to imperfections and intrinsic properties.


2000 ◽  
Vol 626 ◽  
Author(s):  
B. Yang ◽  
G. Chen

ABSTRACTPast studies on the thermal conductivity suggest that phonon confinement and the associated group velocity reduction are the causes of the observed drop in the cross-plane thermal conductivity of semiconductor superlattices. In this work, we investigate the contribution of phonon confinement to the in-plane thermal conductivity of superlattices and the anisotropic effects of phonon confinement on the thermal conductivity in different directions, using a lattice dynamics model. We find that the reduced phonon group velocity due to phonon confinement may account for the dramatic reduction in the cross-plane thermal conductivity, but the in-plane thermal conductivity drop, caused by the reduced group velocity, is much less than the reported experimental results. This suggests that the reduced relaxation time due to diffuse interface phonon scattering, dislocation scattering, etc, should make major contribution to the in-plane thermal conductivity reduction.


2007 ◽  
Vol 1053 ◽  
Author(s):  
Travis Z. Fullem ◽  
Eric J. Cotts

AbstractWhile detailed theories exist for thermal conduction due to electrons and phonons in crystalline solids, phonon scattering and transmission at solid/solid interfaces is not as well understood. Steady increases in the power density of microelectronic devices have resulted in an increasing need in the electronics industry for an understanding of thermal conduction in multilayered structures. The materials of interest in this study consist of a polymer matrix in which small (on the order of microns to tens of microns) highly conductive filler particles (such as Ag or alumina) are suspended. These materials are used to form a thermal interface material bondline (a fifty to several hundred micron bonding layer) between a power device and a heat spreader. Such a bondline contains many polymer/filler interfaces. Using a micro Fourier apparatus, the thermal conductivities of such thermal interface material (TIM) bondlines of various thicknesses, ranging from fifty microns to several hundred microns, have been measured. The microstructure of these bondlines has been investigated using optical microscopy and acoustic microscopy. Measured values of thermal conductivity are compared to values for bulk samples, and considered in terms of microstructural features such as filler particle depleted regions. The influence of polymer/filler particle interfaces in the TIM bondline on phonon transport through the bondline is also considered.


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