High-Temperature Dielectric Materials for Electrical Energy Storage

2018 ◽  
Vol 48 (1) ◽  
pp. 219-243 ◽  
Author(s):  
Qi Li ◽  
Fang-Zhou Yao ◽  
Yang Liu ◽  
Guangzu Zhang ◽  
Hong Wang ◽  
...  
Keyword(s):  
High Temperature ◽  
Energy Storage ◽  
Power Systems ◽  
Oil And Gas ◽  
Elevated Temperatures ◽  
Temperature Stability ◽  
Electrical Energy ◽  
Dielectric Materials ◽  
Future Research ◽  
Capacitive Energy Storage

The demand for high-temperature dielectric materials arises from numerous emerging applications such as electric vehicles, wind generators, solar converters, aerospace power conditioning, and downhole oil and gas explorations, in which the power systems and electronic devices have to operate at elevated temperatures. This article presents an overview of recent progress in the field of nanostructured dielectric materials targeted for high-temperature capacitive energy storage applications. Polymers, polymer nanocomposites, and bulk ceramics and thin films are the focus of the materials reviewed. Both commercial products and the latest research results are covered. While general design considerations are briefly discussed, emphasis is placed on material specifications oriented toward the intended high-temperature applications, such as dielectric properties, temperature stability, energy density, and charge-discharge efficiency. The advantages and shortcomings of the existing dielectric materials are identified. Challenges along with future research opportunities are highlighted at the end of this review.

Ultrahigh Charge-discharge Efficiency and High Energy Density of High-temperature Polymer Sandwiched

2021 ◽  
Author(s):  
Hanxi Chen ◽  
Zhongbin Pan ◽  
Yu Cheng ◽  
Xiangping Ding ◽  
Jinjun Liu ◽  
...  
Keyword(s):  
High Temperature ◽  
Energy Density ◽  
Elevated Temperatures ◽  
Dielectric Materials ◽  
High Energy ◽  
High Energy Density ◽  
Capacitive Energy Storage ◽  
New Generation ◽  
Discharge Efficiency ◽  
Charge Discharge

A new generation of high-temperature dielectric materials toward capacitive energy storage is highly demanded as power electronics are always exposed to elevated temperatures in high-power applications. Polymer dielectric materials, an...

Crosslinked dielectric materials for high-temperature capacitive energy storage

2021 ◽  
Author(s):  
Yadong Tang ◽  
Wenhan Xu ◽  
Sen Niu ◽  
Zhicheng Zhang ◽  
Yunhe Zhang ◽  
...  
Keyword(s):  
High Temperature ◽  
Energy Storage ◽  
Polymer Film ◽  
Dielectric Materials ◽  
Capacitive Energy Storage ◽  
Electrical Systems ◽  
Energy Storage Applications

Polymer film capacitors for energy storage applications at high temperature have shown great potential in modern electronic and electrical systems, such as aerospace, automotive, and oil explorations. Crosslinking strategy has...

scholarly journals Progress and perspectives in dielectric energy storage ceramics

2021 ◽  
Vol 10 (4) ◽  
pp. 675-703
Author(s):  
Dongxu Li ◽  
Xiaojun Zeng ◽  
Zhipeng Li ◽  
Zong-Yang Shen ◽  
Hua Hao ◽  
...  
Keyword(s):  
Energy Storage ◽  
Power Systems ◽  
Temperature Stability ◽  
Pulse Power ◽  
Research Progress ◽  
High Temperature Stability ◽  
Dielectric Ceramic ◽  
Microstructural Design ◽  
Pulse Power Systems ◽  
Fatigue Endurance

AbstractDielectric ceramic capacitors, with the advantages of high power density, fast charge-discharge capability, excellent fatigue endurance, and good high temperature stability, have been acknowledged to be promising candidates for solid-state pulse power systems. This review investigates the energy storage performances of linear dielectric, relaxor ferroelectric, and antiferroelectric from the viewpoint of chemical modification, macro/microstructural design, and electrical property optimization. Research progress of ceramic bulks and films for Pb-based and/or Pb-free systems is summarized. Finally, we propose the perspectives on the development of energy storage ceramics for pulse power capacitors in the future.

scholarly journals Temperature Dependence of Mechanical, Electrical Properties and Crystal Structure of Polyethylene Blends for Cable Insulation

Materials ◽  
2018 ◽  
Vol 11 (10) ◽  
pp. 1922 ◽  
Author(s):  
Lunzhi Li ◽  
Lisheng Zhong ◽  
Kai Zhang ◽  
Jinghui Gao ◽  
Man Xu
Keyword(s):  
High Temperature ◽  
Electrical Properties ◽  
Temperature Dependence ◽  
Elevated Temperatures ◽  
Breakdown Strength ◽  
Temperature Stability ◽  
Xrd Analysis ◽  
Insulation Material ◽  
Cable Insulation ◽  
Polyethylene Blends

There is a long-standing puzzle concerning whether polyethylene blends are a suitable substitution for cable-insulation-used crosslinking polyethylene (XLPE) especially at elevated temperatures. In this paper, we investigate temperature dependence of mechanical, electrical properties of blends with 70 wt % linear low density polyethylene (LLDPE) and 30 wt % high density polyethylene (HDPE) (abbreviated as 70 L-30 H). Our results show that the dielectric loss of 70 L-30 H is about an order of magnitude lower than XLPE, and the AC breakdown strength is 22% higher than XLPE at 90 °C. Moreover, the dynamic mechanical thermal analysis (DMA) measurement and hot set tests suggest that the blends shows optimal mechanical properties especially at high temperature with considerable temperature stability. Further scanning electron microscope (SEM) observation and X-ray diffraction (XRD) analysis uncover the reason for the excellent high temperature performance and temperature stability, which can be ascribed to the uniform fine-spherulite structure in 70 L-30 H blends with high crystallinity sustaining at high temperature. Therefore, our findings may enable the potential application of the blends as cable insulation material with higher thermal-endurance ability.

Scalable Polyimide‐poly(Amic Acid) Copolymer Based Nanocomposites for High‐Temperature Capacitive Energy Storage

2021 ◽  
pp. 2101976
Author(s):  
Zhizhan Dai ◽  
Zhiwei Bao ◽  
Song Ding ◽  
Chuanchuan Liu ◽  
Haoyang Sun ◽  
...  
Keyword(s):  
High Temperature ◽  
Energy Storage ◽  
Amic Acid ◽  
Capacitive Energy Storage ◽  
Acid Copolymer

230°C Accelerometer with Digitized Output for Directional Drilling

2014 ◽  
Vol 2014 (HITEC) ◽  
pp. 000298-000304
Author(s):  
Douglas C. MacGugan ◽  
Eric C. Abbott ◽  
J. Chris Milne
Keyword(s):  
High Temperature ◽  
Oil And Gas ◽  
Elevated Temperatures ◽  
Digital Signal ◽  
Enhanced Geothermal Systems ◽  
Geothermal Systems ◽  
Directional Drilling ◽  
Orientation Measurement ◽  
Acceleration Signal ◽  
Vibrating Beams

Measurement-While-Drilling (MWD) technology for oil and gas, and geothermal directional drilling exploration is pushing into ever higher temperature environments - beyond 200°C. Orientation sensors supporting these high temperature environments need to provide highly accurate elevation and tool face measurements on the order of 0.1°. Honeywell has developed a new digital high temperature down-hole accelerometer, DHTA230, capable of providing the required accuracy at the elevated temperatures of 230°C, in the rugged MWD shock and vibration environment, with expected excellent reliability and life. The DHTA230 is designed for use in the downhole environment, but is based upon a mature Honeywell accelerometer using dual vibrating beam sensing elements. These sensing elements are configured as double-ended-tuning-forks in a push-pull orientation attached onto a pendulous proof mass. This push-pull configuration provides an acceleration signal proportional to the frequency difference of the vibrating beams, an easily captured digital signal through measurement of the two vibrating beam phases. The digitized accelerometer eliminates the need for A/D electronics in the high temperature drilling environment. The DHTA230 is 0.79” in diameter with a depth of .393” at the mount flange. The ruggedized configuration of the DHTA230 is expected to provide reliable orientation measurement in high temperature direction drilling applications up to 1000h. The DHTA230 electronics incorporate ceramic hybrids with chip and wire construction. Active die are based upon proven 300°C chips developed previously for the Enhanced Geothermal Systems OM300, fabricated using Honeywell HTSOI4 process. The electronics include power conditioning providing reliable operation using a single power supply between 7V and 15V. Dual oscillator electronic circuits provide the necessary function to drive and sense the dual vibrating beams, while providing a CMOS logic level signal of the frequency pulse train. The accelerometer provides precision output up to 15g acceleration inputs, and allows sensing of higher-g vibration levels. This paper contains information on the target application, electrical and mechanical component requirements, design, fabrication approach, and initial prototype testing. The DHTA230 is expected to enter production transition in 2015.

Environmentally Hardening IC Die Previously Assembled in Plastic Packages through Die Removal, Bond Pad Replating and Reassembly into Hermetic Packages

2018 ◽  
Vol 2018 (HiTEC) ◽  
pp. 000039-000044
Author(s):  
Charlie Beebout ◽  
Erick M. Spory
Keyword(s):  
High Temperature ◽  
Integrated Circuits ◽  
Oil And Gas ◽  
Elevated Temperatures ◽  
Electroless Nickel ◽  
Oil And Gas Industry ◽  
Market Demand ◽  
Global Circuit ◽  
Bond Wires ◽  
Bond Pads

ABSTRACT Many integrated circuits (ICs) will operate well above their maximum rated temperature of +70°C or +125°C, but are often not packaged appropriately to reliably endure temperatures above +150C. Specifically, the original gold or copper bonds on the aluminum die bond pads are prone to Kirkendall or Horsting voiding, particularly at temperatures greater than +150°C. Also the mold compounds used in plastic packaging for IC assembly can degrade at these elevated temperatures. In some cases, commercial demand for higher temperature reliability can justify a separate offering of ICs assembled in hermetic, ceramic packages from the original component manufacturer (OCM). However, in most cases, the market demand is deemed insufficient. Global Circuit Innovations (GCI) has developed a high-yielding process, which can remove a semiconductor die (i.e., computer chip) from a plastic package, remove the original bond wires and/or ball bonds, plate the aluminum die bond pads with Electroless Nickel, Electroless Palladium, and Immersion Gold (ENEPIG), and then reassemble the now improved semiconductor die into a hermetic, ceramic package. Device Extraction, ENEPIG die bond pad plating and Repackaging (DEER) provides an improved die bond pad surface such that works well with either gold or aluminum bond wires in applications up to +250°C without mechanical or electrical connectivity degradation. GCI routinely exposes sample devices to +250°C bakes with 100% post bake yields so as to continuously ensure that any device processed with the DEER technology will reliably perform in high-temperature environments. Although the oil and gas industry has already expressed significant interest in the DEER process, with excellent lifetest and production application results demonstrating dramatically increased component lifetimes at elevated temperatures, this technology can also be leveraged for any application exposing ICs to harsh environments. Not only is the high-temperature reliability dramatically increased, but also the new hermetic, ceramic package protects the IC from a variety of elements and environments (i.e., corrosives and moisture).

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