Fabrication, Characterization, and Thermal Failure Analysis of a Micro Hot Plate Chemical Sensor Substrate

2004 ◽  
Vol 151 (3) ◽  
pp. H59 ◽  
Author(s):  
Bruce H. Weiller ◽  
Peter D. Fuqua ◽  
Jon V. Osborn
Keyword(s):  
Failure Analysis ◽  
Chemical Sensor ◽  
Hot Plate ◽  
Thermal Failure

A Study on a Low Cost Thin Film Antireflection Coating Solution for Failure Analysis Applications

2016 ◽  
Author(s):  
Fritz Christian Awitan ◽  
Camille Joyce Garcia ◽  
Dirk Andrew Doyle ◽  
Lawrence Benedict
Keyword(s):  
Failure Analysis ◽  
Focused Ion Beam ◽  
Spray Pyrolysis Technique ◽  
Low Cost ◽  
Ion Beam ◽  
Antireflection Coating ◽  
Hot Plate ◽  
Coating Solution ◽  
Set Up ◽  
Voltage Contrast

Abstract An ARC solution that can be used to improve backside imaging for backside photoemission microscopy applications is presented in this paper. Zinc Oxide (ZnO) -based thin films used as ARCs are deposited at the backside of the failing units through a simple and low cost spray pyrolysis technique. An improvised set-up, composed of an atomizer and a hot plate, is used in the experiment. The paper provides evidence of acceptable process repeatability and demonstrates that the technique and the material have important applications in the field of failure analysis. Furthermore, it shows that the application of ARC resulted in better defect localization. The location of the defect is easily been determined upon doing frontside inspection - to - backside image comparison on the deposited unit. By using high kV ion beam passive voltage contrast (PVC) and angled cut focused ion beam (FIB) cross section, we are able to isolate further and show the nature of the defect at the failing block.

Case Study—Lock-in Thermography Application in Failure Analysis of a System Level DC-DC μModule Regulator

2017 ◽  
Author(s):  
Vikash Kumar ◽  
Devraj Karthikeyan
Keyword(s):  
Heat Source ◽  
Failure Analysis ◽  
Case Studies ◽  
Fault Localization ◽  
System Level ◽  
Thermal Failure ◽  
Analysis Process ◽  
Lock In

Abstract Fault localization is a common failure analysis process that is used to detect the anomaly on a faulty device. The Infrared Lock-In Thermography (LIT) is one of the localization techniques which can be used on the packaged chips for identifying the heat source which is a result of active damage. This paper extends the idea that the LIT analysis for fault localization is not only limited to the devices within the silicon die but it also highlights thermal failure indications of other components on the PCB (like capacitors, FETs etc on a system level DC-DC μmodule). The case studies presented demonstrate the effectiveness of using LIT in the Failure analysis process of a system level DC-DC μmodule regulator

Advanced thermal failure analysis and reliability investigations – Industrial demands and related limitations

2008 ◽  
Vol 48 (8-9) ◽  
pp. 1273-1278 ◽  
Author(s):  
Andreas Altes ◽  
Rainer Tilgner ◽  
Markus Reissner ◽  
Grazyna Steckert ◽  
Gerald Neumann
Keyword(s):  
Failure Analysis ◽  
Thermal Failure

scholarly journals Thermal Failure Analysis of Fiber-Reinforced Silica Aerogels under Liquid Nitrogen Thermal Shock

Molecules ◽  
2018 ◽  
Vol 23 (7) ◽  
pp. 1522 ◽  
Author(s):  
Ai Du ◽  
Mingfang Liu ◽  
Shangming Huang ◽  
Conghang Li ◽  
Bin Zhou
Keyword(s):  
Failure Analysis ◽  
Thermal Shock ◽  
Liquid Nitrogen ◽  
Silica Aerogels ◽  
Fiber Reinforced ◽  
Thermal Failure

Failure Analysis With the Scanning Electron Microscope

1972 ◽  
Vol 30 ◽  
pp. 482-483
Author(s):  
John R. Devaney
Keyword(s):  
Electron Microscope ◽  
Scanning Electron Microscope ◽  
Integrated Circuits ◽  
Failure Analysis ◽  
High Reliability ◽  
Military Applications ◽  
Small Structure ◽  
Useful Life ◽  
Insight Into ◽  
Scanning Electron

Occasionally in history, an event may occur which has a profound influence on a technology. Such an event occurred when the scanning electron microscope became commercially available to industry in the mid 60's. Semiconductors were being increasingly used in high-reliability space and military applications both because of their small volume but, also, because of their inherent reliability. However, they did fail, both early in life and sometimes in middle or old age. Why they failed and how to prevent failure or prolong “useful life” was a worry which resulted in a blossoming of sophisticated failure analysis laboratories across the country. By 1966, the ability to build small structure integrated circuits was forging well ahead of techniques available to dissect and analyze these same failures. The arrival of the scanning electron microscope gave these analysts a new insight into failure mechanisms.

Erythrophagocytosis by Entamoeba histolytica.- Ultrastructural Study

1972 ◽  
Vol 30 ◽  
pp. 156-157 ◽  
Author(s):  
Norberto Treviño ◽  
Alfredo Feria-Velasco ◽  
I. Ruiz de Chávez
Keyword(s):  
Electron Microscopy ◽  
Light Microscopy ◽  
Entamoeba Histolytica ◽  
Ultrastructural Study ◽  
Saline Solution ◽  
Physiological Saline ◽  
Ultrastructural Level ◽  
Hot Plate ◽  
Physiological Saline Solution ◽  
Axenic Conditions

Although erythrophagocytosis by various species of Entamoeba is a well known phenomenon this has not yet been studied in detail at the ultrastructural level. The present work deals with the description of the incorporation process of erythrocytes by trophozoites of E. histolytica. For this study, trophozoites of E. histolytica, HK-9:NIH strain cultured in axenic conditions and washed human erythrocytes were placed on a hot plate at 37°C in physiological saline solution. After 5 minutes, 2.5% glutarldehyde was added and the samples were processed according to conventional techniques for electron microscopy.Based upon light microscopy studies on living trophozoites in contact with erythrocytes, it seems that erythrophagocytosis only takes place in one pole of the parasite.

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