Case Study—Lock-in Thermography Application in Failure Analysis of a System Level DC-DC μModule Regulator

2017 ◽  
Author(s):  
Vikash Kumar ◽  
Devraj Karthikeyan
Keyword(s):  
Heat Source ◽  
Failure Analysis ◽  
Case Studies ◽  
Fault Localization ◽  
System Level ◽  
Thermal Failure ◽  
Analysis Process ◽  
Lock In

Abstract Fault localization is a common failure analysis process that is used to detect the anomaly on a faulty device. The Infrared Lock-In Thermography (LIT) is one of the localization techniques which can be used on the packaged chips for identifying the heat source which is a result of active damage. This paper extends the idea that the LIT analysis for fault localization is not only limited to the devices within the silicon die but it also highlights thermal failure indications of other components on the PCB (like capacitors, FETs etc on a system level DC-DC μmodule). The case studies presented demonstrate the effectiveness of using LIT in the Failure analysis process of a system level DC-DC μmodule regulator

System Failure Analysis Process and Case Study

2006 ◽  
Author(s):  
Nicholas Konkol
Keyword(s):  
Failure Analysis ◽  
Personal Computer ◽  
Failure Mechanisms ◽  
System Level ◽  
System Failure ◽  
Quality Improvements ◽  
Analysis Process ◽  
Electrical Overstress ◽  
Type Of Failure

Abstract Failure analysis at the system level requires a well-defined process and methodology in order to drive quality improvements onto motherboards or other subsystems of a personal computer. This process needs to be structured around the type of failure mechanisms that an FA group desires to understand. This paper discusses a specific case study involving electrical overstress in a personal computer that impacted the motherboard of the system. The case study resulted in a solution to increase quality on motherboards in the context of electrical overstress prevention.

Advanced IR-OBIRCH Analysis Technique for High Isb Failure Analysis

2010 ◽  
Author(s):  
Kuo Hsiung Chen ◽  
Wen Sheng Wu ◽  
Yu Hsiang Shu ◽  
Jian Chan Lin
Keyword(s):  
Failure Analysis ◽  
Failure Mechanisms ◽  
Fault Localization ◽  
Resistance Change ◽  
The Real ◽  
Analysis Techniques ◽  
Analysis Technique ◽  
Leakage Failure ◽  
Failure Site

Abstract IR-OBIRCH (Infrared Ray – Optical Beam Induced Resistance Change) is one of the main failure analysis techniques [1] [2] [3] [4]. It is a useful tool to do fault localization on leakage failure cases such as poor Via or contact connection, FEoL or BEoL pattern bridge, and etc. But the real failure sites associated with the above failure mechanisms are not always found at the OBIRCH spot locations. Sometimes the real failure site is far away from the OBIRCH spot and it will result in inconclusive PFA Analysis. Finding the real failure site is what matters the most for fault localization detection. In this paper, we will introduce one case using deep sub-micron process generation which suffers serious high Isb current at wafer donut region. In this case study a BEoL Via poor connection is found far away from the OBIRCH spots. This implies that layout tracing skill and relation investigation among OBIRCH spots are needed for successful failure analysis.

Impacts of Sample Preparation Methodology on TEM Failure Analysis of Advanced Semiconductor Devices

2011 ◽  
Author(s):  
Yongkai Zhou ◽  
Jie Zhu ◽  
Han Wei Teo ◽  
ACT Quah ◽  
Lei Zhu ◽  
...  
Keyword(s):  
Sample Preparation ◽  
Failure Analysis ◽  
Case Studies ◽  
Thickness Measurement ◽  
Interface Roughness ◽  
Silicide Formation ◽  
Cross Sectional ◽  
Inspection Method ◽  
Low Mass

Abstract In this paper, two failure analysis case studies are presented to demonstrate the importance of sample preparation procedures to successful failure analyses. Case study 1 establishes that Palladium (Pd) cannot be used as pre-FIB coating for SiO2 thickness measurement due to the spontaneously Pd silicide formation at the SiO2/Si interface. Platinum (Pt) is thus recommended, in spite of the Pt/SiO2 interface roughness, as the pre-FIB coating in this application. In the second case study, the dual-directional TEM inspection method is applied to characterize the profile of the “invisible” tungsten residue defect. The tungsten residue appears invisible in the planeview specimen due to the low mass-thickness contrast. It is then revealed in the cross-sectional TEM inspection.

Creative Approach Using Lock-in Thermography in Fault Localization of ASIC Devices

2018 ◽  
Author(s):  
Andrew Sabate ◽  
Rommel Estores
Keyword(s):  
Low Power ◽  
Failure Analysis ◽  
Thermal Imaging ◽  
Fault Localization ◽  
Thermal Activity ◽  
Root Cause ◽  
Material Preparations ◽  
Imaging Application ◽  
Set Up ◽  
Lock In

Abstract The advent of lock-in thermal imaging application on semiconductor failure analysis added capability to localize failures through thermal activity (emission) of the die. When coupled with creative electrical set-up and material preparations, lock-in thermography (LIT) [1, 2] application gives more possibility in exploring the failure of the device using low power settings. This gives higher probability of preserving the defect which leads to a more conclusive root cause determination.

Lock-in Thermography for Flip-Chip Package Failure Analysis

2012 ◽  
Author(s):  
Lihong Cao ◽  
Manasa Venkata ◽  
Jeffery Huynh ◽  
Joseph Tan ◽  
Meng-Yeow Tay ◽  
...  
Keyword(s):  
Sample Preparation ◽  
Failure Analysis ◽  
Case Studies ◽  
Flip Chip ◽  
Organic Substrate ◽  
Fault Isolation ◽  
Lock In

Abstract This paper describes the application of lock-in thermography (LIT) for flip-chip package-level failure analysis. LIT successfully detected and localized short failures related to both die/C4 bumps and package defects inside the organic substrate. The detail sample preparation to create short defects at different layers, LIT fault isolation methodology, and case studies performed with LIT are also presented in this paper.

Scan Chain Debug Using Dynamic Lock-In Thermography

2011 ◽  
Author(s):  
L. Forli ◽  
B. Picart ◽  
A. Reverdy ◽  
R. Schlangen
Keyword(s):  
Failure Analysis ◽  
Efficient Solution ◽  
Use Cases ◽  
Thermal System ◽  
Complementary Technique ◽  
Scan Chain ◽  
Lock In

Abstract In this paper, we demonstrate that lock-in thermography (LIT) appears as a key and complementary technique for Failure Analysis across different use cases. Even if the failure requires a complex emulation setup, thanks to a specific capability of our thermal system, this kind of failure can be addressed. In our FA case study, we will show that LIT is a most efficient solution to address a bridge defect located inside a complex logic area, and furthermore that LIT highlights the defect itself and not only the consequences of the defect.

Challenges of System Level Failure Analysis of Electronics in the Automotive Industry

2017 ◽  
Author(s):  
Bence Hevesi
Keyword(s):  
Failure Analysis ◽  
Case Studies ◽  
Automotive Industry ◽  
Root Cause Analysis ◽  
Fault Isolation ◽  
System Level ◽  
Cause Analysis ◽  
Root Cause ◽  
Analysis Workflow

Abstract In this paper, different failure analysis (FA) workflows are showed which combines different FA approaches for fast and efficient fault isolation and root cause analysis in system level products. Two case studies will be presented to show the importance of a well-adjusted failure analysis workflow.

Case Studies of the Use of Image Processing in Metrology and Failure Analysis

2005 ◽  
Author(s):  
Kartik Ramanujachar
Keyword(s):  
Image Processing ◽  
Failure Analysis ◽  
Case Studies ◽  
Nearest Neighbor ◽  
Image Data ◽  
Cumulative Distribution ◽  
Information Theoretic ◽  
Atomic Force ◽  
Processing Techniques

Abstract This paper describes the use of image processing techniques in metrology and failure analysis with the help of three case studies. The first study concerns a technique that significantly automates the process and hence enables both a rapid and accurate extraction of cumulative distribution function for transistor CD through the use of edge detection and quantification of image intensities. The second study is about utilizing a cross correlation algorithm and an appropriately chosen sample and image to estimate the "on image" spatial resolution of an scanning electron microscope. The last case study uses image data acquired with an atomic force microscope. The paper describes how information theoretic concepts like entropy and mutual information combined with image segmentation and nearest neighbor extraction can be used to isolate those regions of the AFM scan that can potentially benefit from further analysis.

Enhanced Failure Analysis on Open TSV Interconnects

2012 ◽  
Author(s):  
F. Altmann ◽  
C. Schmidt ◽  
J. Beyersdorfer ◽  
M. Simon-Najasek ◽  
C. Große ◽  
...  
Keyword(s):  
Electron Beam ◽  
High Resolution ◽  
Failure Analysis ◽  
Preparation Technique ◽  
Target Preparation ◽  
Material Analysis ◽  
Highly Efficient ◽  
Lock In

Abstract In this paper different methods and novel tools for failure localisation and high resolution material analysis for open TSV interconnects will be discussed. The paper shows the application of enhanced methods for the localisation of sidewall shorts in open TSV structures by adapted Photoemission Microscopy (PEM), Lock-in Thermography (LIT) and Electron Beam Absorbed Imaging (EBAC). In addition, a new highly efficient target preparation technique is presented, which allows the combination of Laser and FIB milling, in order to access TSV sidewall defects. Finally the use of this technique is demonstrated in a failure analysis case study.

Metallurgical Failure Analysis-Few Case Studies

2012 ◽  
Vol 710 ◽  
pp. 695-700
Author(s):  
Sushant K. Manwatkar ◽  
M. Swathi Kiranmayee ◽  
Abhay Kumar Jha ◽  
P. Ramesh Narayanan ◽  
K. Sreekumar ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Case Studies ◽  
Material Science ◽  
Material Selection ◽  
Fatigue Loading ◽  
The Other ◽  
Induced Stress ◽  
Analytical Tools ◽  
Causes Of Failure

Advancement in material science has reached great heights both in terms of development and properties but still failures continue to happen. Failure is often accompanied by economic and human loss. Failures generally occur due to error of knowledge, error of performance and error of intent which comprises improper design and/or material selection, deficiency in processing and assembly. Failure analyst plays an important role in evaluating the causes of failure by using various analytical tools to arrive at the conclusion and suggests remedies to avoid its reoccurrence. This paper highlights the important steps in failure analysis with a few case studies demonstrated. Case studies include the failure of plumbing tube used in engine gimbal control system of liquid propulsion system, where failure was initiated due to process deficiency and its propagation was facilitated under fatigue loading. In the other case study discussed, failure of steel fasteners was due to hydrogen induced stress corrosion cracking (HISCC).

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