(Invited) Ru-Based Binary or Ternary Thin Films By Atomic Layer
Deposition for a Seedless Cu Interconnects
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2015 ◽
Vol 33
(1)
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pp. 01A133
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2011 ◽
Vol 14
(5)
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pp. D57
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2015 ◽
Vol 764-765
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pp. 138-142
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