Investigating a Novel Layer-By-Layer Coating Electrode Manufacturing Process for High Energy Batteries

Through a layer-by-layer coating strategy, a “buffer zone” created between the coating layers plays a critical role in retarding polysulfide diffusion.

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Epitaxial growth manner and structure of superconducting oxide films

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100173145 ◽

1990 ◽

Vol 48 (4) ◽

pp. 2-3

Author(s):

Yoshichika Bando ◽

Takahito Terashima ◽

Kenji Iijima ◽

Kazunuki Yamamoto ◽

Kazuto Hirata ◽

...

Keyword(s):

Ultrathin Films ◽

Film Surface ◽

High Energy ◽

Epitaxial Films ◽

Layer By Layer ◽

Initial Growth ◽

In Situ Growth ◽

High Quality ◽

Activated Reactive Evaporation

The high quality thin films of high-Tc superconducting oxide are necessary for elucidating the superconducting mechanism and for device application. The recent trend in the preparation of high-Tc films has been toward “in-situ” growth of the superconducting phase at relatively low temperatures. The purpose of “in-situ” growth is to attain surface smoothness suitable for fabricating film devices but also to obtain high quality film. We present the investigation on the initial growth manner of YBCO by in-situ reflective high energy electron diffraction (RHEED) technique and on the structural and superconducting properties of the resulting ultrathin films below 100Å. The epitaxial films have been grown on (100) plane of MgO and SrTiO, heated below 650°C by activated reactive evaporation. The in-situ RHEED observation and the intensity measurement was carried out during deposition of YBCO on the substrate at 650°C. The deposition rate was 0.8Å/s. Fig. 1 shows the RHEED patterns at every stage of deposition of YBCO on MgO(100). All the patterns exhibit the sharp streaks, indicating that the film surface is atomically smooth and the growth manner is layer-by-layer.

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Compact back-scattered electrons' energy analyzer for standard SEM

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100170177 ◽

1994 ◽

Vol 52 ◽

pp. 488-489

Author(s):

S. Likharev ◽

A. Kramarenko ◽

V. Vybornov

Keyword(s):

Depth Resolution ◽

High Energy ◽

Primary Beam ◽

Layer By Layer ◽

Energy Analyzer ◽

High Energy Part ◽

Small Window ◽

Energy Part ◽

Wide Range ◽

High Voltage Supply

At present time the interest is growing considerably for theoretical and experimental analysis of back-scattered electrons (BSE) energy spectra. It was discovered that a special angle and energy nitration of BSE flow could be used for increasing a spatial resolution of BSE mode, sample topography investigations and for layer-by layer visualizing of a depth structure. In the last case it was shown theoretically that in order to obtain suitable depth resolution it is necessary to select a part of BSE flow with the directions of velocities close to inverse to the primary beam and energies within a small window in the high-energy part of the whole spectrum.A wide range of such devices has been developed earlier, but all of them have considerable demerit: they can hardly be used with a standard SEM due to the necessity of sufficient SEM modifications like installation of large accessories in or out SEM chamber, mounting of specialized detector systems, input wires for high voltage supply, screening a primary beam from additional electromagnetic field, etc. In this report we present a new scheme of a compact BSE energy analyzer that is free of imperfections mentioned above.

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Transmission Electron Microscopy characterization of epitaxial III-V semiconductor thin films grown on Si(100) by ion-assisted deposition

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100176563 ◽

1990 ◽

Vol 48 (4) ◽

pp. 686-687

Author(s):

L. Hultman ◽

C.-H. Choi ◽

R. Kaspi ◽

R. Ai ◽

S.A. Barnett

Keyword(s):

Electron Microscopy ◽

Transmission Electron Microscopy ◽

Ion Irradiation ◽

High Energy ◽

Nucleation Mechanism ◽

Layer By Layer ◽

Extended Defect ◽

Island Formation ◽

Si Substrates ◽

Transmission Electron

III-V semiconductor films nucleate by the Stranski-Krastanov (SK) mechanism on Si substrates. Many of the extended defects present in the films are believed to result from the island formation and coalescence stage of SK growth. We have recently shown that low (-30 eV) energy, high flux (4 ions per deposited atom), Ar ion irradiation during nucleation of III-V semiconductors on Si substrates prolongs the 1ayer-by-layer stage of SK nucleation, leading to a decrease in extended defect densities. Furthermore, the epitaxial temperature was reduced by >100°C due to ion irradiation. The effect of ion bombardment on the nucleation mechanism was explained as being due to ion-induced dissociation of three-dimensional islands and ion-enhanced surface diffusion.For the case of InAs grown at 380°C on Si(100) (11% lattice mismatch), where island formation is expected after ≤ 1 monolayer (ML) during molecular beam epitaxy (MBE), in-situ reflection high-energy electron diffraction (RHEED) showed that 28 eV Ar ion irradiation prolonged the layer-by-layer stage of SK nucleation up to 10 ML. Otherion energies maintained layer-by-layer growth to lesser thicknesses. The ion-induced change in nucleation mechanism resulted in smoother surfaces and improved the crystalline perfection of thicker films as shown by transmission electron microscopy and X-ray rocking curve studies.

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Blade Segment with a 3D Lattice of Diamond Grits Fabricated via an Additive Manufacturing Process

Chinese Journal of Mechanical Engineering ◽

10.1186/s10033-020-00496-6 ◽

2020 ◽

Vol 33 (1) ◽

Author(s):

Bin Chen ◽

Peng Chen ◽

Yongjun Huang ◽

Xiangxi Xu ◽

Yibo Liu ◽

...

Keyword(s):

Additive Manufacturing ◽

Service Life ◽

Manufacturing Process ◽

Cutting Speed ◽

Inspection System ◽

Layer By Layer ◽

Filling Rate ◽

Pressure System ◽

Manufacturing Equipment ◽

Diamond Blade

Abstract Diamond tools with orderly arrangements of diamond grits have drawn considerable attention in the machining field owing to their outstanding advantages of high sharpness and long service life. This diamond super tool, as well as the manufacturing equipment, has been unavailable to Chinese enterprises for a long time due to patents. In this paper, a diamond blade segment with a 3D lattice of diamond grits was additively manufactured using a new type of cold pressing equipment (AME100). The equipment, designed with a rotary working platform and 16 molding stations, can be used to additively manufacture segments with diamond grits arranged in an orderly fashion, layer by layer; under this additive manufacturing process, at least 216000 pcs of diamond green segments with five orderly arranged grit layers can be produced per month. The microstructure of the segment was observed via SEM and the diamond blade fabricated using these segments was compared to other commercial cutting tools. The experimental results showed that the 3D lattice of diamond grits was formed in the green segment. The filling rate of diamond grits in the lattice could be guaranteed to be above 95%; this is much higher than the 90% filling rate of the automatic array system (ARIX). When used to cut stone, the cutting amount of the blade with segments made by AME100 is two times that of ordinary tools, with the same diamond concentration. When used to dry cut reinforced concrete, its cutting speed is 10% faster than that of ARIX. Under wet cutting conditions, its service life is twice that of ARIX. By applying the machine vision online inspection system and a special needle jig with a negative pressure system, this study developed a piece of additive manufacturing equipment for efficiently fabricating blade segments with a 3D lattice of diamond grits.

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Rheed Studies of a-Axis Oriented DyBa2Cu3O7 Films Grown by All-MBE

MRS Proceedings ◽

10.1557/proc-502-221 ◽

1997 ◽

Vol 502 ◽

Author(s):

Ivan Bozovic ◽

J. N. Eckstein ◽

Natasha Bozovic ◽

J. O'Donnell

Keyword(s):

Phase Transitions ◽

Secondary Phase ◽

Atomic Layer ◽

High Energy ◽

Layer By Layer ◽

Growth Modes ◽

Flow Surface ◽

Surface Phase Transitions

ABSTRACTReal-time, in-situ surface monitoring by reflection high-energy electron diffraction (RHEED) has been the key enabling component of atomic-layer-by-layer molecular beam epitaxy (ALL-MBE) of complex oxides. RHEED patterns contain information on crystallographic arrangements and long range order on the surface; this can be made quantitative with help of numerical simulations. The dynamics of RHEED patterns and intensities reveal a variety of phenomena such as nucleation and dissolution of secondary-phase precipitates, switching between growth modes (layer-by-layer, step-flow), surface phase transitions (surface reconstruction, roughening, and even phase transitions induced by the electron beam itself), etc. Some of these phenomena are illustrated here, using as a case study our recent growth of atomically smooth a-axis oriented DyBa2Cu3O7 films.

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Evaluation of Parts Produced by a Novel Additive Manufacturing Process

Applied Mechanics and Materials ◽

10.4028/www.scientific.net/amm.315.63 ◽

2013 ◽

Vol 315 ◽

pp. 63-67 ◽

Cited By ~ 1

Author(s):

Muhammad Fahad ◽

Neil Hopkinson

Keyword(s):

Additive Manufacturing ◽

Rapid Prototyping ◽

Manufacturing Process ◽

High Speed ◽

Three Dimensional ◽

Coordinate Measuring Machine ◽

Layer By Layer ◽

Nylon 12 ◽

Measuring Machine ◽

End Use

Rapid prototyping refers to building three dimensional parts in a tool-less, layer by layer manner using the CAD geometry of the part. Additive Manufacturing (AM) is the name given to the application of rapid prototyping technologies to produce functional, end use items. Since AM is relatively new area of manufacturing processes, various processes are being developed and analyzed for their performance (mainly speed and accuracy). This paper deals with the design of a new benchmark part to analyze the flatness of parts produced on High Speed Sintering (HSS) which is a novel Additive Manufacturing process and is currently being developed at Loughborough University. The designed benchmark part comprised of various features such as cubes, holes, cylinders, spheres and cones on a flat base and the build material used for these parts was nylon 12 powder. Flatness and curvature of the base of these parts were measured using a coordinate measuring machine (CMM) and the results are discussed in relation to the operating parameters of the process.The result show changes in the flatness of part with the depth of part in the bed which is attributed to the thermal gradient within the build envelope during build.

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The Art of Tungsten Etching in Semiconductor Chips

Microscopy Today ◽

10.1017/s1551929500063902 ◽

1999 ◽

Vol 7 (2) ◽

pp. 24-25

Author(s):

Lisa Litz-Montanaro

Keyword(s):

Manufacturing Process ◽

Chemical Etching ◽

Layer By Layer ◽

Ion Milling ◽

Etching Technique ◽

Semiconductor Structures ◽

Wet Chemical ◽

Wet Chemical Etching ◽

Semiconductor Chips ◽

Complex Semiconductor

In the course of both physical and failure analysis of semiconductor chips (i.e., verifying what you actually deposited as a layer, vs, what caused the circuit to fail), it is essential to have appropriate deprocessing tools at your disposal in order to evaluate complex semiconductor structures, Deprocessing techniques are developed for each product manufactured and involve multi-step procedures that reveal the layer-by-layer secrets of the chip, These techniques require constant tweaking in duration and procedure as the manufacturing process imposes changes and as the architecture of the semiconductor changes. While there are many tools that assist in these analytical pursuits, such as RIE (reactive ion etching - a dry etching technique), ion milling, and microcleaving, the wet chemical etching of tungsten is sometimes more reproducible than RIE techniques.

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Constraints and limitations of concrete 3D printing in architecture

Journal of Engineering Design and Technology ◽

10.1108/jedt-11-2020-0456 ◽

2021 ◽

Vol ahead-of-print (ahead-of-print) ◽

Author(s):

Chien-Ho Ko

Keyword(s):

3D Printing ◽

Manufacturing Process ◽

Computer Aided Design ◽

Research Approach ◽

Layer By Layer ◽

Content Type ◽

Improve Design ◽

Study Results ◽

Computer Aided ◽

Property Control

Purpose Additive manufacturing of concrete (AMoC) is an emerging technology for constructing buildings. However, due to the nature of the concrete property and constructing buildings in layers, constraints and limitations are encountered while applying AMoC in architecture. This paper aims to analyze the constraints and limitations that may be encountered while using AMoC in architecture. Design/methodology/approach A descriptive research approach is used to conduct this study. First, basic notions of AMoC are introduced. Then, challenges of AMoC, including hardware, material property, control and design, are addressed. Finally, strategies that may be used to overcome the challenges are discussed. Findings Factors influencing the success of AMoC include hardware, material, control methods, manufacturing process and design. Considering these issues in the early design phase is crucial to achieving a successful computer-aided design (CAD)/computer-aided manufacturing (CAM) integration to bring CAD and CAM benefits into the architecture industry. Originality/value In three-dimensional (3D) printing, objects are constructed layer by layer. Printing results are thus affected by the additive method (such as toolpath) and material properties (such as tensile strength and slump). Although previous studies attempt to improve AMoC, most of them focus on the manufacturing process. However, a successful application of AMoC in architecture needs to consider the possible constraints and limitations of concrete 3D printing. So far, research on the potential challenges of applying AMoC in architecture from a building lifecycle perspective is still limited. The study results of this study could be used to improve design and construction while applying AMoC in architecture.

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