Reinforcement of Cu nanoink sintered film with extended carbon nanofibers for large deformation of printed electronics

2016 ◽  
Vol 51 (7) ◽  
pp. 997-1003 ◽  
Author(s):  
Jeonghwan Kim ◽  
Akash Shankar ◽  
Jiahua Zhu ◽  
Daniel S Choi ◽  
Zhanhu Guo ◽  
...  
Keyword(s):  
Flexible Electronics ◽  
Printed Electronics ◽  
Carbon Nanofiber ◽  
Average Length ◽  
Scanning Electron Micrographs ◽  
Ambient Conditions ◽  
Metallic Nanoparticle ◽  
Electrical Measurements ◽  
Oxidized Carbon ◽  
Pure Cu

Metallic nanoparticle inks (nanoinks) have attracted great interest in the manufacturing of printed flexible electronics. However, sintering pure nanoinks in ambient conditions results in micro-cracks and pores within the sintered film, which deteriorate the mechanical and electrical characteristics of the sintered nanoinks. To alleviate these problems, we demonstrate the use of very long carbon nanofiber (average length 200 µm) to reinforce the sintered nanoink films. In this study, different weight fractions of carbon nanofiber are dispersed into the Cu nanoink to improve the mechanical bending characteristics. Scanning electron micrographs show improved dispersion of oxidized carbon nanofiber in the nanoink compared to the as-received carbon nanofiber. The composite nanoinks are stencil printed on polyethylene terephthalate film and sintered by intense pulsed light using Xe-flash. The electrical measurements show 90%, 65%, and 66% improved electrical conductivity in the composite nanoink film (0.7% of oxidized carbon nanofiber) compared to the pure Cu nanoink under the 7.5 cm, 5.0 cm, and 2.5 cm of bending radii, respectively.

Preparation of Conductive Nanosilver Ink and its Application on RFID Tags

2014 ◽  
Vol 904 ◽  
pp. 121-125 ◽  
Author(s):  
Ji Lan Fu ◽  
Ya Ling Li ◽  
Li Xin Mo ◽  
Yu Wang ◽  
Jun Ran ◽  
...  
Keyword(s):  
Flexible Electronics ◽  
Screen Printing ◽  
Surface Resistance ◽  
Large Scale ◽  
Printed Electronics ◽  
Silver Content ◽  
Rfid Tags ◽  
Rheological Characteristics ◽  
Conductive Ink ◽  
New Type

The recent dramatic progress in the printed electronics and flexible electronics, due to the universality of the substrates including the foldable and stretchable substrates, has opened a new prospect in the field of future electronics. In this paper, silver nanospheres in large-scale are synthesized, the nanosilver ink with 63.88% silver content are prepared and a new type of highly conductive and far identify distance RFID tags are manufactured. Especially there are no resin and other additives containing in our conductive ink which satisfy the rheological characteristics and process of screen printing. The tags exhibit the best radiation performance own to there is no high temperature sintering in need. The surface resistance of the tags could be 80 mΩ/, and the identify distance reach to 6.0m. Keywords:silver nanoparticles, conductive ink, RFID tags

Cr3C2 Nanoparticle-Embedded Carbon Nanofiber for Artificial Synthesis of NH3 through N2 Fixation under Ambient Conditions

2019 ◽  
Vol 11 (39) ◽  
pp. 35764-35769 ◽  
Author(s):  
Guangsen Yu ◽  
Haoran Guo ◽  
Shanhu Liu ◽  
Liang Chen ◽  
Abdulmohsen Ali Alshehri ◽  
...  
Keyword(s):  
N2 Fixation ◽  
Carbon Nanofiber ◽  
Ambient Conditions

scholarly journals Reactive Sintering of Cu Nanoparticles at Ambient Conditions for Printed Electronics

ACS Omega ◽  
2020 ◽  
Vol 5 (22) ◽  
pp. 13416-13423 ◽  
Author(s):  
Xiaofeng Dai ◽  
Teng Zhang ◽  
Hongbin Shi ◽  
Yabing Zhang ◽  
Tao Wang
Keyword(s):  
Printed Electronics ◽  
Reactive Sintering ◽  
Cu Nanoparticles ◽  
Ambient Conditions

Oxidized carbon nanofiber/polymer composites prepared by chaotic mixing

Carbon ◽  
2007 ◽  
Vol 45 (10) ◽  
pp. 2079-2091 ◽  
Author(s):  
Guillermo A. Jimenez ◽  
Sadhan C. Jana
Keyword(s):  
Polymer Composites ◽  
Carbon Nanofiber ◽  
Chaotic Mixing ◽  
Oxidized Carbon

Shape Memory Actuation by Resistive Heating in Polyurethane Composites of Carbonaceous Conductive Fillers

2008 ◽  
Vol 1129 ◽  
Author(s):  
I. Sedat Gunes ◽  
Guillermo A Jimenez ◽  
Sadhan C Jana
Keyword(s):  
Shape Memory ◽  
Carbon Nanofiber ◽  
Soft Segment ◽  
Memory Function ◽  
Linear Thermal Expansion ◽  
Positive Temperature Coefficient ◽  
Positive Temperature ◽  
Resistive Heating ◽  
Oxidized Carbon ◽  
High Level

AbstractThe dependence of electrical resistivity on specimen temperature and imposed tensile strains was determined for shape memory polyurethane (SMPU) composites of carbon nanofiber (CNF), oxidized carbon nanofiber (ox-CNF), and carbon black (CB). The SMPU composites with crystalline soft segments were synthesized from diphenylmethane diisocyanate, 1,4-butanediol, and poly(caprolactone)diol in a low-shear chaotic mixer and in an internal mixer. The materials synthesized in the chaotic mixer showed higher soft segment crystallinity and lower electrical percolation thresholds. The soft segment crystallinity reduced in the presence of CNF and ox-CNF; although the reduction was lower in the case of ox-CNF. The composites of CB showed pronounced positive temperature coefficient (PTC) effects which in turn showed a close relationship with non-linear thermal expansion behavior. The composites of CNF and ox-CNF did not exhibit PTC effects due to low levels of soft segment crystallinity. The resistivity of composites of CNF and ox-CNF showed weak dependence on strain, while that of composites of CB increased by several orders of magnitude with imposed tensile strain. A corollary of this study was that a high level of crystallinity may cause a PTC effect and prevent any actuation through resistive heating. However, a carefully tailored compound which has reduced crystallinity and which requires minimum amount of filler may prevent PTC phenomenon and could supply necessary electrical conductivity over the operating temperature range, while offering enough soft segment crystallinity and rubberlike properties for excellent shape memory function.

Conductive silver inks and their applications in printed and flexible electronics

RSC Advances ◽  
2015 ◽  
Vol 5 (95) ◽  
pp. 77760-77790 ◽  
Author(s):  
Venkata Krishna Rao R. ◽  
Venkata Abhinav K. ◽  
Karthik P. S. ◽  
Surya Prakash Singh
Keyword(s):  
Flexible Electronics ◽  
Printed Electronics ◽  
Conductive Inks

Conductive inks have been widely investigated in recent years due to their popularity in printed electronics (PE) and flexible electronics (FE).

scholarly journals PEDOT: PSS Thermoelectric Generators Printed on Paper Substrates

2019 ◽  
Vol 9 (2) ◽  
pp. 14 ◽  
Author(s):  
Henrik Andersson ◽  
Pavol Šuly ◽  
Göran Thungström ◽  
Magnus Engholm ◽  
Renyun Zhang ◽  
...  
Keyword(s):  
Flexible Electronics ◽  
Printed Electronics ◽  
Low Cost ◽  
Conductive Polymer ◽  
Dissimilar Materials ◽  
Electrical Energy ◽  
Thermoelectric Generators ◽  
Power Sources ◽  
Power Electronic Circuits ◽  
Paper Substrates

Flexible electronics is a field gathering a growing interest among researchers and companies with widely varying applications, such as organic light emitting diodes, transistors as well as many different sensors. If the circuit should be portable or off-grid, the power sources available are batteries, supercapacitors or some type of power generator. Thermoelectric generators produce electrical energy by the diffusion of charge carriers in response to heat flux caused by a temperature gradient between junctions of dissimilar materials. As wearables, flexible electronics and intelligent packaging applications increase, there is a need for low-cost, recyclable and printable power sources. For such applications, printed thermoelectric generators (TEGs) are an interesting power source, which can also be combined with printable energy storage, such as supercapacitors. Poly(3,4-ethylenedioxythiophene)-poly(styrenesulfonate), or PEDOT:PSS, is a conductive polymer that has gathered interest as a thermoelectric material. Plastic substrates are commonly used for printed electronics, but an interesting and emerging alternative is to use paper. In this article, a printed thermoelectric generator consisting of PEDOT:PSS and silver inks was printed on two common types of paper substrates, which could be used to power electronic circuits on paper.

scholarly journals High-performance printed electronics based on inorganic semiconducting nano to chip scale structures

2020 ◽  
Vol 7 (1) ◽  
Author(s):  
Abhishek Singh Dahiya ◽  
Dhayalan Shakthivel ◽  
Yogeenth Kumaresan ◽  
Ayoub Zumeit ◽  
Adamos Christou ◽  
...  
Keyword(s):  
Flexible Electronics ◽  
High Performance ◽  
Printed Electronics ◽  
Functional Materials ◽  
Transfer Printing ◽  
Semiconducting Materials ◽  
Large Area ◽  
Contact Printing ◽  
Scale Structures ◽  
Silicon Based

Abstract The Printed Electronics (PE) is expected to revolutionise the way electronics will be manufactured in the future. Building on the achievements of the traditional printing industry, and the recent advances in flexible electronics and digital technologies, PE may even substitute the conventional silicon-based electronics if the performance of printed devices and circuits can be at par with silicon-based devices. In this regard, the inorganic semiconducting materials-based approaches have opened new avenues as printed nano (e.g. nanowires (NWs), nanoribbons (NRs) etc.), micro (e.g. microwires (MWs)) and chip (e.g. ultra-thin chips (UTCs)) scale structures from these materials have been shown to have performances at par with silicon-based electronics. This paper reviews the developments related to inorganic semiconducting materials based high-performance large area PE, particularly using the two routes i.e. Contact Printing (CP) and Transfer Printing (TP). The detailed survey of these technologies for large area PE onto various unconventional substrates (e.g. plastic, paper etc.) is presented along with some examples of electronic devices and circuit developed with printed NWs, NRs and UTCs. Finally, we discuss the opportunities offered by PE, and the technical challenges and viable solutions for the integration of inorganic functional materials into large areas, 3D layouts for high throughput, and industrial-scale manufacturing using printing technologies.

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