scholarly journals A Study on Heat Transfer from Small Heating Elements in an Integrated Circuit Chip.

1992 ◽  
Vol 58 (551) ◽  
pp. 2234-2240
Author(s):  
Takao NAGASAKI ◽  
Kazuyoshi FUSHINOBU ◽  
Kunio HIJIKATA ◽  
Ryo KURAZUME
Keyword(s):  
Heat Transfer ◽  
Integrated Circuit

scholarly journals Experimental Investigation of Embedded Micropin-Fins for Single-Phase Heat Transfer and Pressure Drop

2018 ◽  
Vol 140 (2) ◽  
Author(s):  
Chirag R. Kharangate ◽  
Ki Wook Jung ◽  
Sangwoo Jung ◽  
Daeyoung Kong ◽  
Joseph Schaadt ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Pressure Drop ◽  
Friction Factor ◽  
Integrated Circuit ◽  
Single Phase ◽  
Absolute Error ◽  
Heat Fluxes ◽  
Operating Conditions ◽  
Working Fluid ◽  
Pin Fin

Three-dimensional (3D) stacked integrated circuit (IC) chips offer significant performance improvement, but offer important challenges for thermal management including, for the case of microfluidic cooling, constraints on channel dimensions, and pressure drop. Here, we investigate heat transfer and pressure drop characteristics of a microfluidic cooling device with staggered pin-fin array arrangement with dimensions as follows: diameter D = 46.5 μm; spacing, S ∼ 100 μm; and height, H ∼ 110 μm. Deionized single-phase water with mass flow rates of m˙ = 15.1–64.1 g/min was used as the working fluid, corresponding to values of Re (based on pin fin diameter) from 23 to 135, where heat fluxes up to 141 W/cm2 are removed. The measurements yield local Nusselt numbers that vary little along the heated channel length and values for both the Nu and the friction factor do not agree well with most data for pin fin geometries in the literature. Two new correlations for the average Nusselt number (∼Re1.04) and Fanning friction factor (∼Re−0.52) are proposed that capture the heat transfer and pressure drop behavior for the geometric and operating conditions tested in this study with mean absolute error (MAE) of 4.9% and 1.7%, respectively. The work shows that a more comprehensive investigation is required on thermofluidic characterization of pin fin arrays with channel heights Hf < 150 μm and fin spacing S = 50–500 μm, respectively, with the Reynolds number, Re < 300.

Integrated Localized MicroCooling Using High-Displacement Piezoelectric Actuators

2015 ◽  
Vol 2015 (DPC) ◽  
pp. 002128-002165
Author(s):  
Michael Kranz ◽  
Janice Booth ◽  
Vicki LeFevre ◽  
Tracy Hudson ◽  
Brian English ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Thermal Management ◽  
Integrated Circuit ◽  
Piezoelectric Actuators ◽  
Synthetic Jets ◽  
Transfer Coefficients ◽  
Subsequent Increase ◽  
Flow Rates ◽  
Reliability Parameters ◽  
Macro Scale

RF communication and radar systems present an extreme thermal management challenge. These systems are comprised of tightly packaged, high-power components requiring a controlled temperature to meet performance and reliability parameters. In these systems, there is little space available for macro-scale air flow or other traditional cooling methods. In addition, heat generating components are typically microscale semiconductor devices fabricated on integrated circuit substrates buried deeply within the system. Localized cooling using integrated microsystems may provide a solution to these thermal management issues. One approach is the integration of miniature synthetic air jets near the heat generating components. Synthetic jets are generated using oscillating piezoelectric actuators that force air through a small nozzle at high flow rates and in close proximity to the heat generating component. The resulting jets provide vorticity within the fluid, leading to enhanced mixing with the surrounding lower temperature environment and a subsequent increase in the heat transfer coefficient. The US Army AMRDEC has been developing and operating microactuator test beds, utilizing high-displacement actuator architectures, including THUNDER and Lightweight Piezo-Composite Actuator (LIPCA) approaches, to reduce actuator size while maintaining sufficient flow rates and vorticity. This investigation has modeled and fabricated potential high-displacement miniature actuators, as well as predicted and characterized resulting jet parameters and heat transfer coefficients utilizing these actuators. This paper will present actuator designs, fabrication process, and cooling results using these high-displacement piezoelectric actuators as the drive element.

Compact Transient Thermal Model of Microfluidically Cooled Three-Dimensional Stacked Chips With Pin-Fin Enhanced Microgap

2021 ◽  
Vol 143 (3) ◽  
Author(s):  
Yuanchen Hu ◽  
Md Obaidul Hossen ◽  
Zhimin Wan ◽  
Muhannad S. Bakir ◽  
Yogendra Joshi
Keyword(s):  
Heat Transfer ◽  
Integrated Circuit ◽  
High Performance ◽  
Heat Dissipation ◽  
Three Dimensional ◽  
Heat Removal ◽  
Power Estimation ◽  
Leakage Power ◽  
Pin Fin ◽  
Pin Fins

Abstract Three-dimensional (3D) stacked integrated circuit (SIC) chips are one of the most promising technologies to achieve compact, high-performance, and energy-efficient architectures. However, they face a heat dissipation bottleneck due to the increased volumetric heat generation and reduced surface area. Previous work demonstrated that pin-fin enhanced microgap cooling, which provides fluidic cooling between layers could potentially address the heat dissipation challenge. In this paper, a compact multitier pin-fin single-phase liquid cooling model has been established for both steady-state and transient conditions. The model considers heat transfer between layers via pin-fins, as well as the convective heat removal in each tier. Spatially and temporally varying heat flux distribution, or power map, in each tier can be modeled. The cooling fluid can have different pumping power and directions for each tier. The model predictions are compared with detailed simulations using computational fluid dynamics/heat transfer (CFD/HT). The compact model is found to run 120–600 times faster than the CFD/HT model, while providing acceptable accuracy. Actual leakage power estimation is performed in this codesign model, which is an important contribution for codesign of 3D-SICs. For the simulated cases, temperatures could decrease 3% when leakage power estimation is adopted. This model could be used as electrical-thermal codesign tool to optimize thermal management and reduce leakage power.

Multiscale Investigation on Interfacial Properties of Cu/Al Structures in Electronic Packaging

2013 ◽  
Vol 455 ◽  
pp. 60-65
Author(s):  
Li Qiang Zhang ◽  
Dong Jing Liu ◽  
Li Jia Yu ◽  
Yan Fang Zhao ◽  
Xiao Ming Yuan ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Integrated Circuit ◽  
Interfacial Crack ◽  
Interfacial Properties ◽  
Interfacial Heat Transfer ◽  
Macroscopic Scale ◽  
Ic Packaging ◽  
Non Equilibrium Molecular Dynamics ◽  
Design And Manufacture ◽  
Interface Structures

With the development of micro/nanoelectronic technology and the miniaturization of IC (Integrated Circuit) packaging, the interfacial characteristics of the nanoscale interface structure in IC packaging become more and more serious on the whole performance of IC or devices. The FEM (finite element method) is used to estimate the thermodynamics properties of the Al-Cu interface structures at the macroscopic scale. Meanwhile, the NEMD (non-equilibrium molecular dynamics) method is used to investigate the interfacial heat transfer at the nanoscale. In the macroscopic scale, the deformation and nanocracks always appear at the outside edge of interface between Cu solder and Al pad due to the dissimilar thermal expand expansion coefficients. In the nanoscale, there is diffusion between different atoms at the interface, the diffusion thickness increases with the temperature increasing. The diffusion between Al and Cu atoms enhances the heat transfer with the temperature increasing. The results reveal the mechanism of the interfacial heat transfer and interfacial crack, which also supply a multiscale analysis method to evaluate the interfacial properties in the IC packaging, which is helpful to design and manufacture of IC assembly.

Hydrodynamic Characterisation of Micro-Gap Geometries for Photonics Cooling Applications

2017 ◽  
Author(s):  
Marian Carroll ◽  
Jeff Punch ◽  
Eric Dalton ◽  
Niamh Richardson
Keyword(s):  
Heat Transfer ◽  
Pressure Drop ◽  
Integrated Circuit ◽  
System Integration ◽  
Low Pressure ◽  
Heat Fluxes ◽  
Thermal Design ◽  
Microfluidic Channels ◽  
Data Traffic ◽  
Micro Particle Image Velocimetry

Contemporary Photonic Integrated Circuit (PIC) packages within the communications network infrastructure have reached a thermal limit. Integrated packages involving microfluidic channels are an appealing development to improve the thermal design of future PIC packages, to significantly improve the removal of heat fluxes in order to sustain the expected enhanced data traffic growth. The Thermally Integrated Smart Photonics Systems (TIPS) project aims to develop and demonstrate a thermally enabled integrated platform that is scalable, to meet the predicted data traffic demands. Full system integration requires an integrated pumping solution, therefore a primary heat exchanger that can deliver the required thermal performance with a low pressure drop (ΔP) is needed. A channel containing a single array of cylindrical posts offers a low pressure drop, similar to a large hydraulic diameter minichannel. Local destabilization of the flow would provide heat transfer enhancement. In particular, non-Newtonian fluids have been shown to exhibit significant mixing in such configurations. Micro Particle-Image Velocimetry (μPIV) measurements were taken for Newtonian and viscoelastic fluids within this channel. Instabilities associated with the viscoelastic fluid were recorded immediately upstream of the post array. This flow exhibited almost a four-fold increase in mixing at comparable flow rates to the Newtonian fluid tested. This suggests that the Nusselt number enhancement associated with such flows could increase the heat transfer rates quite significantly in microchannels containing obstructions.

Sequential Reflow-Process Optimization to Reduce Die-Attach Solder Voids

2015 ◽  
Vol 137 (2) ◽  
Author(s):  
Youmin Yu ◽  
Victor Chiriac ◽  
Yingwei Jiang ◽  
Zhijie Wang
Keyword(s):  
Heat Transfer ◽  
Theoretical Prediction ◽  
Integrated Circuit ◽  
Sequential Optimization ◽  
Solder Paste ◽  
Lead Frame ◽  
Reflow Process ◽  
Sequential Method ◽  
Die Attach ◽  
Solder Reflow

Solder voids are detrimental to the thermal, mechanical, and reliability performance of integrated circuit (IC) packages and must be controlled within certain specifications. A sequential method of optimizing solder-reflow process to reduce die-attach solder voids in power quad flat no-lead (QFN) packages is presented. The sequential optimization consists, in turn, of theoretical prediction, heat transfer comparison, and experimental validation. First, the theoretical prediction uses calculations to find the optimal pause location and time for a lead frame strip (with dies bonded to it by solder paste) to receive uniform heat transfer during the solder-reflow stage. Next, reflow profiles at different locations on the lead frame strip are measured. Heat transfer during the reflow stage at these locations is calculated from the measured reflow profiles and is compared to each other to confirm the theoretical prediction. Finally, only a minimal number of actual trials are conducted to verify the predicted and confirmed optimal process. Since the theoretical prediction and heat transfer comparison screens out most of the unnecessary trials which must be conducted in common design of experiment (DoE) and trial-and-error methods, the sequential optimization method saves significant time and cost.

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