Curing kinetics study of epoxy resin/hyperbranched poly(amideamine)s system by non-isothermal and isothermal DSC

e-Polymers ◽  
2010 ◽  
Vol 10 (1) ◽  
Author(s):  
Li Zhang ◽  
Hui Kang Yang ◽  
Guang Shi
Keyword(s):  
Kinetic Model ◽  
Epoxy Resin ◽  
Kinetic Parameters ◽  
Curing Kinetics ◽  
Scanning Calorimetry ◽  
Fitting Procedure ◽  
Hyperbranched Poly ◽  
Numerical Process ◽  
Isothermal Kinetic ◽  
Dsc Method

AbstractCuring kinetics of epoxy resin/hyperbranched poly(amide amine)s (HPAMAM) system was studied by non-isothermal and isothermal differential scanning calorimetry (DSC). Non-isothermal DSC scans indicated that H-PAMAM was an effective curing agent of epoxy resin. The apparent activation energy (E) was 54.3 kJ/mol calculated through Kissinger method, and the kinetic parameters were determined by Málek method for the kinetic analysis of the thermal treatment obtained by DSC measurement. A two-parameter (m, n) autocatalytic model (Sěsták-Berggren equation) was found to be the most adequate selected kinetic model. In addition, the predicted curves from the kinetic model fit well with the nonisothermal DSC thermogram. The isothermal DSC method was used to investigate the curing process for resin at 60, 65, 70, 75 and 80 °С, respectively. Isothermal kinetic parameters, including k1, k2, m and n, were determined based on an autocatalytic mechanism proposed by Kamal. Both models were validated for a fitting to the experimental data by the Levenberg-Marquardt method. A process to determine the initial values for the fitting procedure was also proposed. The predictions of the validated models were in good agreement with the measured data, and were therefore applicable for numerical process optimization

The Study on Curing Kinetics of Lignin Based Epoxy Resin System Using Non-Isothermal DSC Method

2013 ◽  
Vol 788 ◽  
pp. 223-227 ◽  
Author(s):  
Ming Qiang Chen ◽  
Shao Min Liu ◽  
Feng Li ◽  
Zhong Lian Yang ◽  
Ye Zhang
Keyword(s):  
Epoxy Resin ◽  
Kinetic Parameters ◽  
Raw Materials ◽  
Curing Kinetics ◽  
Reaction Model ◽  
Curing Temperature ◽  
Resin System ◽  
Curing Reaction ◽  
Epoxy Resin System ◽  
Dsc Method

The synthesis of Lignin Base Epoxy Resin was based on industrial alkali lignin, and lignin-based epoxy resin curing characteristics were analyzed using the thermal weight loss technology under the oxygen atmosphere conditions. In light of the infra-red analysis of raw materials, the curing reaction kinetic parameters of lignin-based epoxy resin system were calculated using the Kissinger-Crane and Flynn-Wall-Ozawa method, and the curing reaction kinetics model of lignin-based epoxy resin system was established. The results showed that the kinetic parameters obtained using two methods were approximate, which validated that the curing reaction was consistent with the principle of the first-order reaction model. Initial curing temperature Ti0=454.88 K, curing temperature Tp0=507.55 K, and terminal temperature Tf0=598.77 K of lignin-based epoxy resin system were obtained when the extrapolation method was applied.

Curing Kinetics and Rheology of Diglycidyiether of Bisphenol-A Modified by Poly(ethylene glycol) Flexible Chains

2010 ◽  
Vol 123-125 ◽  
pp. 411-414 ◽  
Author(s):  
Da Hu Yao ◽  
Kyung Bok Sun ◽  
Peng Li ◽  
Joong Hee Lee
Keyword(s):  
Ethylene Glycol ◽  
Bisphenol A ◽  
Epoxy Resin ◽  
Kinetic Parameters ◽  
Curing Kinetics ◽  
Poly Ethylene Glycol ◽  
Scanning Calorimetry ◽  
Exponential Factor ◽  
Curing Reaction ◽  
Poly Ethylene

The curing reaction of the system bisphenol-A glycidol ether epoxy resin modified by poly (ethylene glycol) (PEO) and flexible amine (D-230) as curing agent has been studied by means of differential scanning calorimetry (DSC) and thermal scanning rheometry. The curing kinetic parameters have been calculated from the non-thermal DSC curve. The kinetic analysis suggests that the two-parameter autocatalytic model is more appropriate to describe the kinetics of the curing reaction of the system. Increasing the PU content leads to an increase in the heat of curing and has a little effect on the kinetic parameters apparent activation energy (Ea), pre-exponential factor (A), and order of the reaction (m and n). The rheological properties were measured by isothermal curing evolution. Introduction of PEO flexible chains delayed the polymerization. It has been confirmed that the introduction of PEO chains in the structure of the epoxy resin increases the mobility of the molecular segment of the epoxy networks and results in the decrease in glass transition temperature.

An improved simplified approach for curing kinetics of epoxy resins by nonisothermal differential scanning calorimetry

2017 ◽  
Vol 30 (3) ◽  
pp. 303-311 ◽  
Author(s):  
Chao Chen ◽  
Yanxia Li ◽  
Yizhuo Gu ◽  
Min Li ◽  
Zuoguang Zhang
Keyword(s):  
Differential Scanning Calorimetry ◽  
Epoxy Resin ◽  
Kinetic Parameters ◽  
Epoxy Resins ◽  
Curing Kinetics ◽  
Scanning Calorimetry ◽  
Simplified Approach ◽  
Curing Kinetic ◽  
Autocatalytic Curing ◽  
Kinetics Of

The curing kinetics of two different types of commercial epoxy resins were investigated by means of nonisothermal differential scanning calorimetry (DSC) in this work. The complex curve of measured heat flow of CYCOM 970 epoxy resin was simplified with the method of resolution of peak. Two typical autocatalytic curing reaction curves were gained and the kinetic parameters of the curing process were demonstrated by combination of those two reactions. The Kissinger method was adopted to obtain the values of the activation energy. The parameters of curing kinetic model were acquired according to the fitting of Kamal model. Isothermal DSC curve of CYCOM 970 epoxy resin obtained using the experimental data shows a good agreement with that theoretically calculated. Then, 603 epoxy resin was investigated by the simplified method and the kinetic parameters were received through the same procedure. The nonisothermal DSC curve tested according to the recommended cure cycle of 603 epoxy resin is also consistent with the calculated results. This improved simplified approach provides an effective method to analyze the curing kinetics of the epoxy resins with complex DSC curves as similar to this study.

scholarly journals Curing Kinetics and Mechanism Research of E44/T31 Insulation Paint

2019 ◽  
Vol 25 (4) ◽  
pp. 478-484
Author(s):  
Haoqing XU ◽  
Yuan FANG ◽  
Aizhao ZHOU ◽  
Pengming JIANG ◽  
Shi SHU ◽  
...  
Keyword(s):  
Epoxy Resin ◽  
Epoxy Group ◽  
Curing Kinetics ◽  
Curing Temperature ◽  
Scanning Calorimetry ◽  
Curing Reaction ◽  
Rate Versus ◽  
Reaction Orders ◽  
Dsc Method ◽  
Kinetics Of

Epoxy resin insulation paint was prepared with epoxy resin (E44) as binder and with proper inorganic fillers and curing agent (T31) as additives. The isothermal curing reaction process of paint was studied by the differential scanning calorimetry method (DSC), and the curves of curing reaction rate versus time of paint were obtained. The curing reaction kinetics was investigated by using the phenomenological method, and the corresponding parameters of the n-order model, autocatalytic model and Kamal model were determined by fitting the experimental data, respectively. According to the values of R2 and the sum of square due to error (SSE), a suitable curing reaction kinetic model was determined. The curing reaction mechanism of paint was ascertained by the dynamic temperature DSC method and IR spectroscopy (FTIR) method. The results show that the Kamal model can be used to describe the curing kinetics of epoxy resin paint, and the total reaction orders increase from 1.30 to 2.14. The two rate constants increase with the increase of the curing temperature. The activation energy is 90.5832 kJ/mol and 68.3733 kJ/mol respectively, and the pre-exponential factors are 6.521 × 1015 s-1 and 6.3807 × 109 s-1. The curing reaction of paint consists of two steps: the first step is the addition reaction of epoxy group and primary amine or secondary amine; the second step is the etherification reaction of epoxy group and phenolic hydroxyl or alcoholic hydroxyl. Epoxy resin insulation paint was prepared with epoxy resin (E44) as binders and with proper inorganic fillers and curing agent (T31) as additives. The isothermal curing reaction process of paint was studied by differential scanning calorimetry method (DSC), and the curves of curing reaction rate versus time of paint were obtained. The curing reaction kinetics was studied by using the phenomenological method, the corresponding parameters of the n-order model, autocatalytic model and Kamal model were determined by fitting the experimental data, respectively. According to the values of R2 and the sum of square due to error (SSE), a suitable curing reaction kinetic model was determind. The curing reaction mechanism of paint was ascertained by dynamic temperature DSC method and IR spectrogram (FTIR) method. The results show that the kamal model can be used to describe the curing kinetics of epoxy resin paint, the total reaction orders increase from 1.30 to 2.14. The results also show that the two rate constants increase with increasing curing temperature, The activation energies are 90.5832 kJ/mol and 68.3733 kJ/mol, and the pre-exponential factor are 6.521×1015 s-1 and 6.3807×109 s-1. The curing reaction of paint in two steps, the first step is the addition reaction of epoxy group and primary amine or secondary amine. The second step is the etherification reaction of epoxy group and phenolic hydroxyl or alcoholic hydroxyl.

Study on Curing Kinetics of MEP-15/593/660 System

2014 ◽  
Vol 988 ◽  
pp. 31-35
Author(s):  
Jia Le Song ◽  
Chan Chan Li ◽  
Zhi Mi Zhou ◽  
Chao Qiang Ye ◽  
Wei Guang Li
Keyword(s):  
Activation Energy ◽  
Differential Scanning Calorimetry ◽  
Kinetic Parameters ◽  
Curing Kinetics ◽  
Conversion Ratio ◽  
Scanning Calorimetry ◽  
Degree Of Cure ◽  
Curing Kinetic ◽  
The Relationship ◽  
Kinetics Of

Curing kinetics of MEP-15/593 system and MEP-15/593/660 system is studied by means of differential scanning calorimetry (DSC). Curing kinetic parameters are evaluated and the relationship between diluent 660 and the curing properties is investigated. The results show that the diluent 660 can not only reduce viscosity and activation energy, but also improve the degree of cure and conversion ratio.

scholarly journals Amino-Functionalized Lead Phthalocyanine-Modified Benzoxazine Resin: Curing Kinetics, Thermal, and Mechanical Properties

Polymers ◽  
2019 ◽  
Vol 11 (11) ◽  
pp. 1855 ◽  
Author(s):  
Li-wu Zu ◽  
Bao-chang Gao ◽  
Zhong-cheng Pan ◽  
Jun Wang ◽  
Abdul Qadeer Dayo ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Impact Strength ◽  
Kinetic Parameters ◽  
Curing Kinetics ◽  
Dynamic Mechanical Properties ◽  
Mechanical Analysis ◽  
Curing Temperature ◽  
Scanning Calorimetry ◽  
Thermal Stabilities ◽  
Dynamic Mechanical

Phenol-diaminodiphenylmethane-based benzoxazine (P-ddm)/phthalocyanine copolymer was prepared by using P-ddm resin as matrix and 3,10,17,24-tetra-aminoethoxy lead phthalocyanine (APbPc) as additive. Fourier-transform infrared (FTIR), differential scanning calorimetry (DSC), dynamic mechanical analysis (DMA), and thermogravimetric analysis (TGA) were used to investigate the curing behavior, curing kinetics, dynamic mechanical properties, thermal stability, and impact strength of the prepared copolymers. The kinetic parameters for the P-ddm/APbPc blend curing processes were examined by utilizing the iso-conversional, Flynn–Wall–Ozawa, and Málek methods. The P-ddm/APbPc blends exhibit two typical curing processes, and DSC results confirmed that the blending of APbPc monomer can effectively reduce the curing temperature of P-ddm resin. The autocatalytic models also described the non-isothermal curing reaction rate well, and the appropriate kinetic parameters of the curing process were obtained. The DMA and impact strength experiments proved that the blending of APbPc monomer can significantly improve the toughness and stiffness of P-ddm resin, the highest enhancements were observed on 25 wt.% addition of APbPc, the recorded values for the storage modulus and impact strength were 1003 MPa and 3.60 kJ/m2 higher, respectively, while a decline of 24.6 °C was observed in the glass transition temperature values. TGA curves indicated that the cured copolymers also exhibit excellent thermal stabilities.

scholarly journals The Curing Kinetics of E-Glass Fiber/Epoxy Resin Prepreg and the Bending Properties of Its Products

Materials ◽  
2021 ◽  
Vol 14 (16) ◽  
pp. 4673
Author(s):  
Lvtao Zhu ◽  
Zhenxing Wang ◽  
Mahfuz Bin Rahman ◽  
Wei Shen ◽  
Chengyan Zhu
Keyword(s):  
Glass Fiber ◽  
Epoxy Resin ◽  
Composite Laminates ◽  
Curing Kinetics ◽  
Curing Temperature ◽  
Scanning Calorimetry ◽  
Three Point Bending ◽  
Reinforced Composite ◽  
Curing Kinetic ◽  
Kinetics Of

The curing kinetics can influence the final macroscopic properties, particularly the three-point bending of the fiber-reinforced composite materials. In this research, the curing kinetics of commercially available glass fiber/epoxy resin prepregs were studied by non-isothermal differential scanning calorimetry (DSC). The curing kinetic parameters were obtained by fitting and the apparent activation energy Ea of the prepreg, the pre-exponent factor, and the reaction order value obtained. A phenomenological nth-order curing reaction kinetic model was established according to Kissinger equation and Crane equation. Furthermore, the optimal curing temperature of the prepregs was obtained by the T-β extrapolation method. A vacuum hot pressing technique was applied to prepare composite laminates. The pre-curing, curing, and post-curing temperatures were 116, 130, and 153 °C respectively. In addition, three-point bending was used to test the specimens’ fracture behavior, and the surface morphology was analyzed. The results show that the differences in the mechanical properties of the samples are relatively small, indicating that the process settings are reasonable.

scholarly journals Studies on Curing Kinetics and Tensile Properties of Silica-Filled Phenolic Amine/Epoxy Resin Nanocomposite

Polymers ◽  
2019 ◽  
Vol 11 (4) ◽  
pp. 680 ◽  
Author(s):  
Ting Zheng ◽  
Xiaodong Wang ◽  
Chunrui Lu ◽  
Xiaohong Zhang ◽  
Yi Ji ◽  
...  
Keyword(s):  
Epoxy Resin ◽  
Tensile Properties ◽  
Curing Kinetics ◽  
Tensile Fracture ◽  
Resin System ◽  
Scanning Calorimetry ◽  
Nano Sio2 ◽  
Model Free ◽  
Uniform Dispersion ◽  
Epoxy Resin System

In this study, the curing kinetics of the phenolic amine/epoxy resin system were investigated by nonisothermal differential scanning calorimetry (DSC). The model-free isoconversional method of Ozawa–Flynn–Wall reveals a dependence of Eα (activation energy) on conversion (α), which interprets the autocatalytic curing reaction mechanism of the phenolic amine/epoxy resin system. Studies on the effects of nano-SiO2 particles on the tensile properties and tensile fracture face morphology of nanocomposites show that the uniform dispersion of SiO2 nanoparticles plays an important role in promoting the tensile performance of nanocomposites. Additionally, increases of 184.1% and 217.2% were achieved by adding 1.5% weight parts of nano-SiO2 in composites for the tensile strength and tensile modulus, respectively.

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