Inverted E shaped dipole antenna with corrugated substrate for mm-wave applications

Frequenz ◽  
2020 ◽  
Vol 0 (0) ◽  
Author(s):  
Paikhomba Loktongbam ◽  
Chaitali Koley ◽  
Debasish Pal ◽  
Ayan Kumar Bandyopadhyay
Keyword(s):  
Resonant Frequency ◽  
Equivalent Circuit ◽  
Frequency Band ◽  
High Efficiency ◽  
Impedance Matching ◽  
Equivalent Circuit Model ◽  
Beam Width ◽  
Dipole Antenna ◽  
Design Parameters ◽  
On Chip

AbstractThis paper presents a novel E armed dipole antenna for System On Chip (SOC) applications in the Sub-THz frequency band. The antenna is printed on a corrugated silicon substrate which suppresses surface waves and provides high efficiency and gain. The corrugated substrate also provides a better impedance matching. The antenna has a simulated gain of 5.4 dBi and 3 dB beam-width of 83.5 degree. The proposed antenna also has a very high radiation efficiency of 90%. Antenna resonates at 141.8 GHz and has an approximate −10 dB bandwidth of 1 GHz. To investigate the effects of different design parameters, some parametric analysis has been carried out and results have been shown. An equivalent circuit model has been reported. The equivalent circuit has been used to find the resonant frequency of the proposed dipole. The deviation of simulated and calculated resonant frequency is less than 0.5% which is well within the acceptable limits for antennas operating in mm-wave and sub-THz frequency band. This antenna is well suited for SOC, radar on-chip, high gain arrays, etc.

scholarly journals Broadband Dual-Polarized Loop Cross-Dipole Antenna for 5G Base Station Applications

Electronics ◽  
2020 ◽  
Vol 9 (10) ◽  
pp. 1574
Author(s):  
Chenyang Liao ◽  
Bin Wang ◽  
Congcong Zhu ◽  
Honggang Hao ◽  
Bo Yin
Keyword(s):  
Impedance Matching ◽  
Equivalent Circuit Model ◽  
Beam Width ◽  
Dipole Antenna ◽  
Base Station ◽  
Flow Diagram ◽  
Cross Polarization ◽  
Dual Polarized ◽  
Half Power ◽  
Good Agreement

A broadband dual-polarized base station antenna is proposed in this paper. The antenna consists of loop cross-dipoles, Y-shaped coupling feeding lines, and a metal box reflector. An equivalent circuit model including a signal flow diagram is established to analyze the mechanism of the proposed antenna in detail. Moreover, the Y-shaped coupling feeding lines are introduced to control the coupling with the antenna to achieve broadband and good impedance matching. The prototype of the antenna is fabricated and measured. The measured results show that the antenna with simple structures can operate at the band of 3.2–5.22 GHz (48%) with high port-to-port isolation (35 dB) and stable gain (9 ± 1 dBi). The measured results show good agreement with simulated results, especially in cross-polarization discrimination ratio (>27 dB) and the half power beam width (61° ± 3° at the E-plane, 68° ± 3° at the H-plane). In summary, the proposed antenna could be a good candidate for 5G sub-6 GHz base station applications.

scholarly journals Design of a Novel Miniaturized Frequency Selective Surface Based on 2.5-Dimensional Jerusalem Cross for 5G Applications

2018 ◽  
Vol 2018 ◽  
pp. 1-6 ◽  
Author(s):  
Peng Zhao ◽  
Yihang Zhang ◽  
Rongrong Sun ◽  
Wen-Sheng Zhao ◽  
Yue Hu ◽  
...  
Keyword(s):  
Resonant Frequency ◽  
Equivalent Circuit ◽  
Equivalent Circuit Model ◽  
Frequency Selective Surface ◽  
Size Reduction ◽  
Two Dimensional ◽  
Physical Insight ◽  
Frequency Selective ◽  
Significant Size ◽  
Insight Into

A compact frequency selective surface (FSS) for 5G applications has been designed based on 2.5-dimensional Jerusalem cross. The proposed element consists of two main parts: the successive segments of the metal traces placed alternately on the two surfaces of the substrate and the vertical vias connecting traces. Compared with previous published two-dimensional miniaturized elements, the transmission curves indicate a significant size reduction (1/26 wavelengths at the resonant frequency) and exhibit good angular and polarization stabilities. Furthermore, a general equivalent circuit model is established to provide direct physical insight into the operating principle of this FSS. A prototype of the proposed FSS has been fabricated and measured, and the results validate this design.

Investigation of e-textile dipole antenna performance based on embroidery parameters

2021 ◽  
pp. 004051752110134
Author(s):  
Daniel Agu ◽  
Rachel J Eike ◽  
Allyson Cliett ◽  
Dawn Michaelson ◽  
Rinn Cloud ◽  
...  
Keyword(s):  
Frequency Band ◽  
Impedance Matching ◽  
Dipole Antenna ◽  
Water Soluble ◽  
Wearable Sensor ◽  
Dipole Antennas ◽  
Antenna Performance ◽  
Large Production ◽  
Lower Transmission ◽  
The Ideal

E-textile antennas have the potential to be the premier on-body wearable sensor. Embroidery techniques, which can be applied to produce e-textile antennas, assist in large production volumes and fast production speeds. This paper focuses on the effects of three commonly used embroidery parameters, namely stitch type, conductive thread location, and stabilizer, on the performance of embroidered dipole antennas in order to determine the ideal embroidery combination for optimal antenna performance. Fifty-four dipole antenna samples were fabricated and measured at the industrial, scientific, and medical (ISM) frequency band of 2.45 GHz. The results of this study show that machine-embroidered antenna designs with satin stitches resonate at a lower frequency and exhibit a lower transmission gain compared with those made with contour stiches, and the conductive thread location in the bobbin location plus the use of a water-soluble stabilizer can help improve impedance matching.

A Simple Equivalent Circuit Model for Plasma Dipole Antenna

2015 ◽  
Vol 43 (12) ◽  
pp. 4092-4098 ◽  
Author(s):  
Mona M. Badawy ◽  
Hend Abd El-Azem Malhat ◽  
Saber Helmy Zainud-Deen ◽  
Kamal Hassan Awadalla
Keyword(s):  
Equivalent Circuit ◽  
Equivalent Circuit Model ◽  
Dipole Antenna ◽  
Circuit Model

Analysis of a Pot-Like Ultrasonic Sensor with an Anisotropic Beam Pattern

2010 ◽  
Vol 26 (3) ◽  
pp. 373-384 ◽  
Author(s):  
C.-C. Cheng ◽  
C.-Y. Lin ◽  
J.-H. Ho ◽  
C.-S. Chen ◽  
J. Shieh ◽  
...  
Keyword(s):  
Resonant Frequency ◽  
Fourier Transforms ◽  
Numerical Models ◽  
Beam Width ◽  
Ultrasonic Sensor ◽  
Beam Pattern ◽  
Design Parameters ◽  
Far Field ◽  
Vertical Beam ◽  
Vibrating Plate

AbstractWe investigated the design parameters of a compact pot-like ultrasonic sensor which possesses a highly anisotropic beam pattern. As the sensor size is small due to its application constraint, the parameters are thus highly coupled to one another. We analyzed the respective effects of the parameters in the case where there is a vertical beam width reduction. The parameters investigated include resonant frequency, vibrating plate width-expanded angle, and ratio of thickness discontinuity of the vibrating plate. Numerical models developed by combining finite-element analysis and spatial Fourier transforms were adopted to predict the far-field radiating beam pattern of the various design configurations. The displacement distribution of the vibrating plate was measured using a microscopic laser Doppler vibrometer and the far-field pressure beam patterns were measured using a standard microphone in a semianechoic environment. The three configurations we used to validate the simulation model resulted in an H-V ratio of 2.67, 2.68 and 3.13, respectively which all agreed well with the numerical calculations. We found that by increasing the operating resonant frequency from 40kHz to 58kHz, the vertical far-field beam width of an ultrasonic sensor can be reduced by 31.62%. We found that the vertical beam width can be significantly reduced when the ratio of the thickness discontinuity of the vibrating plate decreases from 1 to 0.4 and is incorporated with its optimal width-expanded angle of the vibrating plate. It appears that an ultrasonic sensor with this type of anisotropic beam pattern can be ideally adopted for today's automotive applications.

Scalable wideband equivalent circuit model for silicon-based on-chip transmission lines

2017 ◽  
Vol 38 (6) ◽  
pp. 065004
Author(s):  
Hansheng Wang ◽  
Weiliang He ◽  
Minghui Zhang ◽  
Lu Tanh
Keyword(s):  
Equivalent Circuit ◽  
Transmission Lines ◽  
Equivalent Circuit Model ◽  
Circuit Model ◽  
On Chip ◽  
Silicon Based

scholarly journals Spatial Equivalent Circuit Model for Simulation of On-Chip Thermoelectric Harvesters

Micromachines ◽  
2020 ◽  
Vol 11 (6) ◽  
pp. 574
Author(s):  
Simon Lineykin ◽  
Moshe Sitbon ◽  
Alon Kuperman
Keyword(s):  
Equivalent Circuit ◽  
Three Dimensional ◽  
Equivalent Circuit Model ◽  
Behavioral Model ◽  
Original Method ◽  
Electrical Circuits ◽  
Thermal Transients ◽  
Point Tracking ◽  
Power Point ◽  
On Chip

Interest in autonomous low-power energy sources has risen with the development and widespread use of devices with very low energy consumption. Interest in thermoelectric harvesters has increased against this background. Thermoelectric harvesters, especially harvesters on-chip, have peculiar properties related to the thermal route, thermal transients, and spatial temperature distribution within the chip. A behavioral model of the harvester is required for engineers to successfully develop voltage converters with maximum power point tracking and energy storage units. There are accurate models based on the finite element method, but these models are usually not compatible with simulators of electrical circuits, and therefore are not convenient for designers. Existing equivalent circuit models fit this requirement, but usually do not consider many parameters. This article proposes an original method that allows simulating spatial thermoelectric processes by analogy with the finite difference method, using electrical circuits simulations software. The study proposes a complete methodology for building the model and examples of simulations of one-, two- and three-dimensional problems, as well as examples of simulation of macro problems in the presence of external thermal and electrical devices, such as heatsink and electrical load.

scholarly journals A Broadband THz On-Chip Transition Using a Dipole Antenna with Integrated Balun

Electronics ◽  
2018 ◽  
Vol 7 (10) ◽  
pp. 236 ◽  
Author(s):  
Wonseok Choe ◽  
Jinho Jeong
Keyword(s):  
Integrated Circuits ◽  
Insertion Loss ◽  
Low Cost ◽  
Three Dimensional ◽  
Equivalent Circuit Model ◽  
Dipole Antenna ◽  
Impedance Match ◽  
Inp Substrate ◽  
On Chip ◽  
High Dielectric

A waveguide-to-microstrip transition is an essential component for packaging integrated circuits (ICs) in rectangular waveguides, especially at millimeter-wave and terahertz (THz) frequencies. At THz frequencies, the on-chip transitions, which are monolithically integrated in ICs are preferred to off-chip transitions, as the former can eliminate the wire-bonding process, which can cause severe impedance mismatch and additional insertion loss of the transitions. Therefore, on-chip transitions can allow the production of low cost and repeatable THz modules. However, on-chip transitions show limited performance in insertion loss and bandwidth, more seriously, this is an in-band resonance issue. These problems are mainly caused by the substrate used in the THz ICs, such as an indium phosphide (InP), which exhibits a high dielectric constant, high dielectric loss, and high thickness, compared with the size of THz waveguides. In this work, we propose a broadband THz on-chip transition using a dipole antenna with an integrated balun in the InP substrate. The transition is designed using three-dimensional electromagnetic (EM) simulations based on the equivalent circuit model. We show that in-band resonances can be induced within the InP substrate and also prove that backside vias can effectively eliminate these resonances. Measurement of the fabricated on-chip transition in 250 nm InP heterojunction bipolar transistor (HBT) technology, shows wideband impedance match and low insertion loss at H-band frequencies (220–320 GHz), without in-band resonances, due to the properly placed backside vias.

Sign in / Sign up

Export Citation Format

Share Document