scholarly journals Physico-chemical Processes at the Interface of Heterostructures Ag-Pd – Sn-Pb

2021 ◽  
Vol 22 (3) ◽  
pp. 477-480
Author(s):  
Ya.I. Lepikh ◽  
T.I. Lavrenova ◽  
P.O. Snigur
Keyword(s):  
Integrated Circuits ◽  
Film Material ◽  
Physicochemical Processes ◽  
Microelectronic Devices ◽  
Operational Characteristics ◽  
Physico Chemical ◽  
Material Element ◽  
Silver Palladium ◽  
Contact Switch ◽  
Electrophysical Parameters

Physicochemical processes taking place at the interface of film elements (conductors) of hybrid integrated circuits, thick-film sensors and other microelectronic devices (MED) based on silver-palladium pastes and elements of standard soldering materials have been studied. Physicochemical mechanisms of processes of the material element mutual dissolution at the interface are proposed and analyzed. Conclusions are made that these processes affect the degradation of the electrophysical parameters and contact switch connections operational characteristics. It is established that the degradation main cause (partial or complete destruction of the contact connections on substrate ceramics (glass) Ag-Pd – Sn-Pb) is the functional film material significant dissolution in the Sn-Pb melt.

PHYSICAL PROPERTIES OBTAINED FROM MEASURED THERMAL PROFILES IN THE FILM/SUBSTRATE BIMATERIAL SYSTEM

2006 ◽  
Vol 13 (05) ◽  
pp. 557-565 ◽  
Author(s):  
R. D. MALDONADO ◽  
A. I. OLIVA ◽  
H. G. RIVEROS
Keyword(s):  
Atmospheric Pressure ◽  
Thermal Evaporation ◽  
Thermal Contact ◽  
Electrical Current ◽  
Film Material ◽  
Microelectronic Devices ◽  
Global Character ◽  
Film Substrate ◽  
Good Agreement ◽  
Bimaterial System

The microelectronic devices are formed by a substrate that supports the functional thin film material. The thermal, electrical, and mechanical properties of the system depend strongly on the interfacial properties between a film and a substrate. The interfacial nature in a film/substrate system originates the thermal contact resistance (R tc ). We discuss the thermal and the electrical behavior in a film/substrate system (bimaterial system) making emphasis on the R tc of the interface. Au /glass samples with different thicknesses were prepared by thermal evaporation for experimentation. The bimaterial system was heated by a DC electrical current to obtain thermal profiles. Film and substrate thermal profiles acquired with high resolution combined with a developed bimaterial model are used as an alternative method to estimate the R tc value at atmospheric pressure, the electrical resistivity ρ, and the thermal resistive coefficient α r in the bimaterial system. The calculated R tc values ranged from 7.7 × 10-4 to 1.2 × 10-3 m2 K/W for the Au /glass system, in good agreement with previously reported values. The ρ values obtained from the thermal profile data present a more reliable value due to the global character than the local values measured by the four-probe technique. Dependence on film thickness was also found in the α r coefficient determination.

scholarly journals Mortars for 3D printing

2018 ◽  
Vol 143 ◽  
pp. 02013
Author(s):  
Olga Demyanenko ◽  
Ekaterina Sorokina ◽  
Natalya Kopanitsa ◽  
Yurij Sarkisov
Keyword(s):  
3D Printing ◽  
Cement Paste ◽  
Chemical Interaction ◽  
Early Age ◽  
Hardened Cement ◽  
Hardened Cement Paste ◽  
Operational Characteristics ◽  
Physico Chemical ◽  
Key Factor ◽  
Technical Specifications

The paper is aimed at developing scientifically proven compositions of mortars for 3D printing modified by a peat-based admixture with improved operational characteristics. The paper outlines the results of experimental research on hardened cement paste and concrete mixture with the use of modifying admixture MT-600 (thermally modified peat). It is found that strength of hardened cement paste increases at early age when using finely dispersed admixtures, which is the key factor for formation of construction and technical specifications of concrete for 3D printing technologies. The composition of new formations of hardened cement paste modified by MT-600 admixture were obtained, which enabled to suggest the possibility of their physico-chemical interaction while hardening.

Improved Performance of Field Emission Vacuum Microelectronic Devices for Integrated Circuits

2016 ◽  
Vol 63 (9) ◽  
pp. 3753-3760 ◽  
Author(s):  
Erich J. Radauscher ◽  
Kristin Hedgepath Gilchrist ◽  
Shane T. Di Dona ◽  
Zachary E. Russell ◽  
Jeffrey R. Piascik ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Field Emission ◽  
Microelectronic Devices ◽  
Vacuum Microelectronic ◽  
Improved Performance

scholarly journals Advances in Low Cost Silver-Containing Thick Film Conductors

1981 ◽  
Vol 9 (1) ◽  
pp. 67-85 ◽  
Author(s):  
Barry E. Taylor ◽  
John J. Felten ◽  
Samuel J. Horowitz ◽  
John R. Larry ◽  
Richard M. Rosenberg
Keyword(s):  
High Temperature ◽  
Integrated Circuits ◽  
Thick Film ◽  
High Speed ◽  
High Performance ◽  
Low Cost ◽  
High Volume ◽  
Film Material ◽  
Advantages And Disadvantages ◽  
Thick Film Technology

Extensive use of thick film materials to manufacture resistor networks and hybrid integrated circuits has come about because of economic, processing and functional advantages over other technologies in the high volume production of miniaturized circuits. Inherent in the adoption of thick film technology for increasingly diverse applications has been the ability of thick film material suppliers to provide progressive performance improvements at lower cost concurrent with circuit manufacturer's needs. Since the first major commercial thick film adoption in the early sixties, when IBM adopted platinum gold conductors and palladium silver resistors in their 360 computers, rapid technological advances over the last decade have produced an increasing variety of hybrid circuits and networks. The wide adoption of thick film technology in all segments of the electronic industry has placed increasing demands on performance and processing latitude. This paper outlines the development of low cost silver-bearing conductors and describes the evolution of technology improvements to present day systems. The initial segment reviews the deficiencies of early Pd/Ag conductors, particularly solder leach resistance and degradation of soldered adhesion following high temperature storage, and focuses on the first Pd/Ag system which overcame these problems. Extension of this technology and subsequent improvements in both binders and vehicles to fulfill adhesion requirements to Al2O3substrates of varying chemistries and to meet demands for high speed printing are also described. The second segment gives an overview of the present understanding of thick film conductor composites from a mechanistic point of view. The various types of binder systems commonly employed in conductors are discussed in terms of how they effect a bond between the sintered metal and the substrate, and the advantages and disadvantages of each type. Metallurgical aspects of conductor/solder connections are considered and their effects on bond reliability following exposure to high temperature discussed. Rheological considerations of paste design are presented and related to printing performance. The final segment focuses on newer low cost, high performance material systems that have evolved over the past two years. The technologies of each system are reviewed in terms of metallurgy, binder and vehicle. Important functional properties are presented to illustrate cost/performance tradeoffs. Special emphasis is given to recently developed high Ag containing conductors which have outstanding soldered adhesion even after 1000 hours of storage at 150℃.

scholarly journals Electron-Beam Deposition of Aluminum Nitride and Oxide Ceramic Coatings for Microelectronic Devices

Coatings ◽  
2021 ◽  
Vol 11 (6) ◽  
pp. 645
Author(s):  
Yury G. Yushkov ◽  
Efim M. Oks ◽  
Andrey V. Tyunkov ◽  
Alexey Y. Yushenko ◽  
Denis B. Zolotukhin
Keyword(s):  
Electron Beam ◽  
Integrated Circuits ◽  
Aluminum Nitride ◽  
Ceramic Coatings ◽  
Electron Beam Evaporation ◽  
Oxide Ceramic ◽  
Interaction Picture ◽  
Monolithic Microwave Integrated Circuits ◽  
Microelectronic Devices ◽  
Oxide Ceramic Coatings

This work presents the results of the coating deposition by electron-beam evaporation of aluminum nitride and aluminum oxide targets in nitrogen and oxygen atmospheres in the forevacuum range (5–30 Pa). The method we employed is a combination of the electron-beam and plasma methods, since in the mentioned pressure range, the electron beam creates plasma that essentially changes the interaction picture of both the electron beam with the ceramic target and the flux of evaporated material with a substrate. We show a possibility of depositing such coatings on monolithic microwave integrated circuits passivated by Si3N4 dielectric.

scholarly journals REFRACTORY CLAY RAW MATERIALS OF REPUBLIC OF BELARUS FOR PRODUCTION OF THE PORCELAIN TILE

2019 ◽  
Vol 62 (12) ◽  
pp. 39-44
Author(s):  
Hanna N. Shymanskaya ◽  
Evgeniya M. Dyatlova ◽  
Rostislav Yu. Popov
Keyword(s):  
Raw Materials ◽  
Import Substitution ◽  
Chemical Properties ◽  
Xrd Analysis ◽  
Sem Analysis ◽  
Refractory Clay ◽  
Production Costs ◽  
Operational Characteristics ◽  
Physico Chemical ◽  
Porcelain Tiles

The possibility of replacing imported refractory clays and kaolines, which are part of porcelain stoneware mix, with refractory clay materials of the Republic of Belarus, in particular quartz-pyrophyllite-kaolinite rock and kaolin of “Dedovka” and “Sitnitsa” deposits, was explored. Porcelainised stoneware body formulations of JSC “Keramin” (Minsk, Republic of Belarus) was taken as the basis. It was found that physico-chemical properties and operational characteristics of porcelain tiles comply with the requirements of EN 14411: 2014, when adding 2.5–15.0 wt.% quartz-pyrophyllite-kaolinite rock. Incorporation of quartz-pyrophyllite-kaolinite rock in percentage higher than 15.0 wt.% resulted in reduction in the total amount of the vitreous phase of porcelain stoneware, thus increasing water absorption, apparent porosity as well as reduces flexural strength and bulk density. The main crystalline phases in the synthesized materials were quartz and mullite. It was also revealed that imported kaolines could be completely replaced by kaolines of “Dedovka” and “Sitnitsa” deposits. In this, required physico-chemical properties and operational characteristics of porcelain tiles was maintained. SEM analysis revealed that specimens synthesized using considered kaolines show quite dense microstructures, with a high degree of vitrification. The gas phase in these materials was practically absent, the presence of only individual small irregular pores was found. XRD analysis indicated that the major phases were mullite, quartz, microcline and hematite. It was hematite that gives the obtained porcelain stoneware samples a dark gray color scheme. Thus, the use of domestic refractory clay raw materials provides import substitution and declining production costs.

Application of PEM and OBIRCH to Defect Localization of Integrated Circuits

2014 ◽  
Vol 904 ◽  
pp. 277-281
Author(s):  
Jian Wen Lian ◽  
Xiao Ling Lin ◽  
Ruo He Yao
Keyword(s):  
Integrated Circuits ◽  
Failure Mechanisms ◽  
Photon Emission ◽  
Fault Isolation ◽  
Resistance Change ◽  
Microelectronic Devices ◽  
Application Condition ◽  
Defect Localization ◽  
Metal Interconnects ◽  
Fault Characterization

With the increasing integration and complexity of microelectronic devices, fault isolation has been challenged. Photon Emission Microscopy (PEM) and Optical Beam Induced Resistance Change (OBIRCH) are effective tools for defect localization and fault characterization in failure analysis. In this paper, the principles and different application condition of PEM and OBIRCH are discussed. PEM is very helpful for locating defects emitting photon, but can not detect the defects which have no photon emitting, such as shorted metal interconnects; OBIRCH as a complementary, has a high success rate for locating resistance defects. Two cases with failure mechanisms illuminated are presented to show the different application of PEM and OBIRCH.

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