Optimum growth conditions for the epitaxy of GaAs on Ge by close-spaced vapor transport

1994 ◽  
Vol 72 (5-6) ◽  
pp. 225-232 ◽  
Author(s):  
G. Lalande ◽  
N. Guelton ◽  
D. Cossement ◽  
R. G. Saint-Jacques ◽  
J. P. Dodelet

GaAs epitaxial layers are grown by close-spaced vapor transport (CSVT) on (100)Ge substrates and (100)Ge substrates misoriented 1.5° and 3° toward (011). Water vapor is used as the transport agent. When the temperatures of the GaAs source (T1) and of the Ge substrate (T2) are 800 and 750 °C, respectively, the growth rate is about 3 μm h−1. When an optimum source–substrate temperature evolution is followed, it is possible to grow specular layers of GaAs/Ge that contain only a small number (< 105 cm−2) of threading dislocations. All antiphase boundaries (APBs) annihilate close to the interface (from about 230 nm for (100)Ge substrates to about 65 nm for vicinal (3° off) (100)Ge substrates). The GaAs growth occurs via the coalescence of 3D nuclei that are formed on an arsenic prelayer n-type GaAs layers are always obtained. By encapsulating the Ge substrate, it is possible to drastically decrease the autodoping resulting from the transport of Ge by water vapor in the same growth conditions as those prevailing for GaAs. After encapsulation, uncompensated doping densities ND – NA in the order of 5 × 1016 cm−3 are easily obtained for GaAs/Ge films grown from undoped semi-insulating GaAs sources. These GaAs/Ge layers can be used as bases for solar cells.

1995 ◽  
Vol 10 (4) ◽  
pp. 843-852 ◽  
Author(s):  
N. Guelton ◽  
R.G. Saint-Jacques ◽  
G. Lalande ◽  
J-P. Dodelet

GaAs layers grown by close-spaced vapor transport on (100) Ge substrates have been investigated as a function of the experimental growth conditions. The effects on the microstructure of the surface preparation, substrate misorientation, and annealing were studied using optical microscopy and transmission electron microscopy. Microtwins and threading dislocations are suppressed by oxide desorption before deposition. Single domain GaAs layers have been obtained using a 50 nm thick double domain buffer layer on an annealed Ge substrate misoriented 3°toward [011]. The mismatch strain is mainly accommodated by dissociated 60°dislocations. These misfit dislocations extend along the interface by the glide of the threading dislocations inherited from the substrate, but strong interaction with antiphase boundaries (APB's) prevents them from reaching the interface. These results are discussed and compared with previous reports of GaAs growth on Ge(100).


1994 ◽  
Vol 72 (1-2) ◽  
pp. 44-50
Author(s):  
D. Cossement ◽  
Z. Huang ◽  
G. Perron ◽  
B. Jean ◽  
J. P. Dodelet

In view of developing the close-spaced vapor transport technique (CSVT) to obtain III/V homojunction solar cells, it is necessary to finely control the growth rate of GaAs epitaxial layers. This has been performed either by controlling the water vapor pressure, [Formula: see text] injected in the reactor along with H2, in H2 + H2O ambient, or by controlling the water vapor pressure generated in situ by the reaction of H2 + CO2 in the reactor. For H2 + CO2 ambient, [Formula: see text], controls [Formula: see text] according to the following reaction: [Formula: see text]. The growth rates calculated with a diffusion controlled model are in agreement with the experimental values for both ambients, including the observation of a maximum in the evolution of the growth rate with [Formula: see text], Controlling the growth rate of GaAs by changing [Formula: see text] affects the carrier density (NA–ND) of p-type layers grown from Zn-doped GaAs sources. In both ambients (NA–ND) is a function of [Formula: see text]. Such a behavior is also obtained for the calculated carrier densities. It is the result of the transport of Zn as ZnO in CSVT. In H2 + CO2 ambient, where H2O and C are generated in situ, carbon is not incorporated as a major p-type doping impurity, contrarily to expectations, n-type GaAs layers were also obtained from Te-doped GaAs sources. In that case, the measured NA–ND values are not affected by changes in [Formula: see text] because water is not involved in the transport of Te in CSVT.


1991 ◽  
Vol 69 (3-4) ◽  
pp. 390-406 ◽  
Author(s):  
E. Koskiahde ◽  
D. Cossement ◽  
N. Guelton ◽  
R. Fillit ◽  
R. G. Saint-Jacques ◽  
...  

Epitaxial layers of GaAs on (100) GaAs substrates can be grown by close-spaced vapor transport using water vapor as the transporting agent. The parameters for the transport are [Formula: see text], ΔT′ = 45 °C, and δ = 0.03 cm (where [Formula: see text] is the temperature of the graphite heating the substrate; ΔT′, the temperature difference between the graphite heating the source and the one heating the substrate; and δ, the thickness of the spacer separating the GaAs source and the substrate). Mirrorlike epitaxial layers of GaAs are obtained with these parameters when water vapor, at a partial pressure of 4.58 Torr (1 Torr = 133.3 Pa), is introduced with H2 at the beginning of the temperature rise of the reactor. The dimensions of the epitaxial layer are only limited by the size of the reactor. Using the same growth conditions, it is not possible to obtain mirrorlike films of GaAs on (100) Ge substrates. Instead, the layers are dull grey (sample no. 1). It is however not a polycrystalline deposition since the pole figures, obtained by X-ray diffraction, reveal only four crystallographic orientations; {100} the main one, {221} the secondary one, and {021} + {112} two minor contributions. Mirrorlike films of GaAs on (100) Ge substrates of less than 1 cm2 have been obtained with [Formula: see text], ΔT′ = 25 °C, and δ = 0.03 cm. With these conditions, the growth rate is 0.25 ± 0.08 μm min−1. The time evolution of [Formula: see text] and ΔT′, from room temperature up to the equilibrium temperature also influences the surface morphology of GaAs films on Ge while this was not the case for GaAs films on GaAs substrates. When the Ge substrate is larger than 1 cm2, the centre of the film becomes textured but the edges remain mirrorlike (sample no. 2). Pole figures obtained for the center and the edges of sample no. 2 are similar. They are characterized by one large diffraction due to the {100} orientation. A few random crystallographic orientations and sometimes the {221} orientation, however, bearly emerge from the background of these pole figures. Also transmission electron microscopy does not reveal any major difference between the center and the edges of sample no. 2. The density of threading dislocations is the same for both regions, varying from 108 cm−2, close (2–3 μm) to the interface, to 107 cm−2 in the thickness of the film. No misfit dislocations were observed. Antiphase boundaries are present in both regions as well. The only difference between the centre and the edges of sample no. 2 involves microtwin bundles: in the center region, there are two microtwin bundles per micrometre of interface, extending up to 6 μm in the GaAs film while on the edges, there is one bundle per micrometre with an extension of only one micrometre into the epitaxial layer. Mirrorlike GaAs films can be obtained on (100) Ge substrates of at least 1 in (1 in = 2.5 cm) in diameter by increasing δ to 0.2 cm and by injecting water vapor in the reactor only when [Formula: see text] reached 650 °C; the other deposition parameters remain the same as for sample no. 2. In these conditions, the growth rate of GaAs is 0.075 ± 0.020 μm min−1. By using a transport model based on thermodynamics, it is demonstrated that the flux intensity of GaAs transported from the source to the substrate, as well as the eventual presence of GeO as a nucleation site for GaAs on Ge, are both important for the morphology of the epitaxial layer.


1999 ◽  
Vol 557 ◽  
Author(s):  
G. Ganguly ◽  
G. Lin ◽  
L.F. Chen ◽  
M. He ◽  
G. Wood ◽  
...  

AbstractWe have studied the effects of external growth parameters during the deposition of the i-layers of a-Si p-i-n solar cells using dc plasma decomposition of silane-hydrogen mixtures at growth rates of up to 3A/s. The loss of initial performance with increasing growth rate is mainly due to a loss of short-circuit current. The relative degradation of efficiency upon extended light soaking also increases with growth rate, and is mainly due to a decrease in the fill factor. Systematic comparisons of the performance and its degradation with changes in growth conditions reveal that these two components of the total degradation have distinct origins.


Crystals ◽  
2021 ◽  
Vol 11 (11) ◽  
pp. 1436
Author(s):  
Danyang Fu ◽  
Qikun Wang ◽  
Gang Zhang ◽  
Zhe Li ◽  
Jiali Huang ◽  
...  

We developed a two-dimensional (2D) transport model to investigate mass transport during bulk AlN crystal growth via the physical vapor transport (PVT) process using the finite element method (FEM), taking the powder source porosity, buoyancy, and vapor diffusion into account. The porosity effects of the powder source on mass transport under various growth conditions were investigated in detail. The simulation results show that the porosity of the powder source significantly affects the mass transport process during AlN sublimation growth. When the porosity of the powder source decreases, the growth rate becomes more uniform along the seed deposition surface, although the sublimation rate and crystal growth rate decrease, which can be attributed to the reduced specific surface area of the powder source and the reduced flow rate of Al vapor in the powder source. A flat growth interface can be achieved at a porosity of 0.2 under our specific growth conditions, which in turn facilitate the growth of high-quality AlN crystals and better yield. The decomposition of the powder source and the transport of Al vapor in the growth chamber can be suppressed by increasing the pressure. In addition, the AlN growth rate variation along the deposition surface can be attributed to the Al vapor pressure gradient caused by the temperature difference in the growth chamber.


1996 ◽  
Vol 450 ◽  
Author(s):  
A D Johnson ◽  
R Jefferies ◽  
G J Pryce ◽  
J A Beswick ◽  
T Ashley ◽  
...  

ABSTRACTWe report on the optimum growth conditions for Molecular Beam Epitaxy (MBE) growth of InSb onto InSb (111)A and (111)B substrates. It was found that for (111)A substrates the optimum epilayer morphology was obtained for growth temperatures above 385°C and with a Sb:In ratio of 1.5:1. In contrast, for the (111)B surface, best morphology was found for growth temperatures above 385°C but with V:III ratio of ∼7.0:1. In both cases the dopant incorporation was found to be the same as the (100) surface and did not particularly depend either on V:III ratio or substrate temperature. We also describe the device characteristics of InAlSb light emitting diodes (LEDs) grown lattice matched onto ternary InGaSb(111)A substrates using the optimized growth conditions obtained.


2009 ◽  
Vol 1165 ◽  
Author(s):  
Vasilios Palekis ◽  
Deidra Ranel Hodges ◽  
Don L Morel ◽  
Lee Stefanakos ◽  
Chris S Ferekides

AbstractCadmium telluride (CdTe) is a leading thin film photovoltaic (PV) material due to its near ideal band gap of 1.45 eV and its high optical absorption coefficient. The typical CdTe thin film solar cell is of the superstrate configuration where a window layer (CdS), the absorber (CdTe), and a back contact are deposited onto a glass slide coated with a transparent electrode. Substrate CdTe solar cells where the above listed films are deposited in reverse order are not common. In this study, the growth of CdTe thin films deposited on foil substrates by the close-spaced sublimation (CSS) has been investigated for the purpose of fabricating substrate based CdTe solar cells. The CdTe films were deposited at substrate temperatures (TSUB) in the range of 300 to 600°C, and source temperatures (TSRC) in the 600 to 650°C range. The effect of the substrate-source temperature variations on the growth rate, film structure and morphology were studied using XRD and SEM. It was found that for low substrate temperature and as the growth rate increases, grain size was the same but the films appeared to be more uniform and more densely packed with less or no pinholes. The growth rate increased as the source temperature increased. The substrate temperature clearly influences the grain growth and the preferred orientation. As the substrate temperature increased the growth rate decreased and the grain size varied from 2 to 6 μm. XRD analysis showed that with the increase in substrate temperature film orientation changes from preferential along the (111) direction to a mix of (111) (220) and (311).


Author(s):  
A.N. Alexeev ◽  
B.A. Borisov ◽  
V.P. Chaly ◽  
D.M. Demidov ◽  
A.L. Dudin ◽  
...  

The growth rate evolution versus V/III ratio and substrate temperature was studied by means of optical reflectivity during MBE of GaN layers using NH3 as nitrogen source. The GaN desorption becomes observable at temperatures above 800°C and causes the reduction of growth rate accompanied with the surface roughening at temperatures above 850-870°C. Unlike GaAs, which evaporates in accordance with the action mass law, the desorption rate of GaN is found to be almost independent of V/III ratio within the N-rich growth conditions. The activation energy for GaN desorption during the growth is found to be (3.2±0.1)eV. This value is very close to the activation energy for free evaporation. At V/III ratio values exceeding 200 the GaN growth rate reduction caused by violation of the molecular flow regime is observed. The Mg-doped samples grown under these extreme conditions tend to have improved acceptor activation and thus p-type conductivity.


2011 ◽  
Vol 679-680 ◽  
pp. 269-272 ◽  
Author(s):  
Michael Dudley ◽  
Huan Huan Wang ◽  
Fang Zhen Wu ◽  
Sha Yan Byrapa ◽  
Balaji Raghothamachar ◽  
...  

Synchrotron White Beam X-ray Topography studies are presented of dislocation behavior and interactions in a new generation of seventy-six millimeter diameter, 4H-SiC wafers grown using Physical Vapor Transport under specially designed low stress conditions. Such low stress growth conditions have enabled reductions of dislocation density by two or three orders of magnitude compared to the lowest previously reported levels [1]. In this paper, detailed topography analysis will be presented of the deflection of threading dislocations with Burgers vectors of c and c+a onto the basal plane leading to reductions of the density of such dislocations down to levels of ~187 cm-2. The deflection of the latter type of dislocations produces complex faulted defect configurations and models for their creation are presented and discussed.


Author(s):  
T. S. Kuan

Recent electron diffraction studies have found ordered phases in AlxGa1-xAs, GaAsxSb1-x, and InxGa1-xAs alloy systems, and these ordered phases are likely to be found in many other III-V ternary alloys as well. The presence of ordered phases in these alloys was detected in the diffraction patterns through the appearance of superstructure reflections between the Bragg peaks (Fig. 1). The ordered phase observed in the AlxGa1-xAs and InxGa1-xAs systems is of the CuAu-I type, whereas in GaAsxSb1-x this phase and a chalcopyrite type ordered phase can be present simultaneously. The degree of order in these alloys is strongly dependent on the growth conditions, and during the growth of these alloys, high surface mobility of the depositing species is essential for the onset of ordering. Thus, the growth on atomically flat (110) surfaces usually produces much stronger ordering than the growth on (100) surfaces. The degree of order is also affected by the presence of antiphase boundaries (APBs) in the ordered phase. As shown in Fig. 2(a), a perfectly ordered In0.5Ga0.5As structure grown along the <110> direction consists of alternating InAs and GaAs monolayers, but due to local growth fluctuations, two types of APBs can occur: one involves two consecutive InAs monolayers and the other involves two consecutive GaAs monolayers.


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