Effects of P Content on Morphology of Nanocrystals Induced by FIB Irradiation in Ni-P Amorphous Alloy

2006 ◽  
Vol 960 ◽  
Author(s):  
Koji Sato ◽  
Chiemi Ishiyama ◽  
Masato Sone ◽  
Yakichi Higo

ABSTRACTWe studied the effects of phosphorus (P) on Ni nanocrystalline morphology formed by focused ion beam (FIB) irradiation for Ni-P amorphous alloy thin films. The P content in the amorphous alloy was varied from 8 to 12 wt.%. The nanocrystals induced by the FIB irradiation for Ni-11.8, 8.9, 7.9 wt.% amorphous alloy had an f.c.c. structure and showed unique crystallographic orientation relationships to the geometry of the focused ion beam, that is, {111}f.c.c. parallel to the irradiated plane and <110>f.c.c. parallel to the projected ion beam direction, respectively. The Ni nanocrystals precipitated like aggregates with decreasing of the P content. These results represent that the P content does not affect crystallographic orientation relationships, while influences the precipitation distribution of Ni nanocrystals generated by the FIB irradiation.

2002 ◽  
Vol 739 ◽  
Author(s):  
Takuya Kamikawa ◽  
Ryuichi Tarumi ◽  
Kazuki Takashima ◽  
Yakichi Higo

ABSTRACTWe have succeeded to form three-dimensionally orientated nano-sized crystals in a Ni-P amorphous alloy under focused ion beam (FIB) irradiation. The FIB micro-fabrication was performed on an electroless deposited Ni-P amorphous alloy and thin films with a thickness of 100 nm were prepared. Transmission electron microscopy (TEM) observation for irradiated areas revealed the formation of crystallographically orientated nano-sized crystals (NCs) in the irradiated region. The grain size of NCs was less than 10 nm in diameter. Electron diffraction analysis showed that the formed NCs have a face-centered-cubic (f.c.c.) structure and the following orientation relationships among the specimen, the NCs and the FIB direction: irradiated plane // {111}f.c.c. and ion beam direction // <110>f.c.c..


1999 ◽  
Vol 594 ◽  
Author(s):  
R. Spolenak ◽  
C. A. Volkert ◽  
K. Takahashi ◽  
S. Fiorillo ◽  
J. Miner ◽  
...  

AbstractIt is well known that the mechanical properties of thin films depend critically on film thickness However, the contributions from film thickness and grain size are difficult to separate, because they typically scale with each other. In one study by Venkatraman and Bravman, Al films, which were thinned using anodic oxidation to reduce film thickness without changing grain size, showed a clear increase in yield stress with decreasing film thickness.We have performed a similar study on both electroplated and sputtered Cu films by using chemical-mechanical polishing (CMP) to reduce the film thickness without changing the grain size. Stress-temperature curves were measured for both the electroplated and sputtered Cu films with thicknesses between 0.1 and 1.8 microns using a laser scanning wafer curvature technique. The yield stress at room temperature was found to increase with decreasing film thickness for both sets of samples. The sputtered films, however, showed higher yield stresses in comparison to the electroplated films. Most of these differences can be attributed to the different microstructures of the films, which were determined by focused ion beam (FIB) microscopy and x-ray diffraction.


2012 ◽  
Vol 717-720 ◽  
pp. 889-892 ◽  
Author(s):  
Hamidreza Zamani ◽  
Seung Wan Lee ◽  
Amir Avishai ◽  
Christian A. Zorman ◽  
R. Mohan Sankaran ◽  
...  

We report on experimental explorations of using focused ion beam (FIB) nanomachining of different types of silicon carbide (SiC) thin membranes, for making robust, high-quality stencil masks for new emerging options of nanoscale patterning. Using thin films and membranes in polycrystalline SiC (poly-SiC), 3C-SiC, and amorphous SiC (a-SiC) with thicknesses in the range of t~250nm−1.6μm, we have prototyped a series of stencil masks, with nanoscale features routinely down to ~100nm.


2012 ◽  
Vol 520 (6) ◽  
pp. 2073-2076 ◽  
Author(s):  
Xu Song ◽  
Kong Boon Yeap ◽  
Jing Zhu ◽  
Jonathan Belnoue ◽  
Marco Sebastiani ◽  
...  

2013 ◽  
Vol 20 (1) ◽  
pp. 42-49 ◽  
Author(s):  
Jiangbo Lu ◽  
Maarten B.J. Roeffaers ◽  
Evelyne Bartholomeeusen ◽  
Bert F. Sels ◽  
Dominique Schryvers

AbstractScanning electron microscopy, focused ion beam (FIB), and transmission electron microscopy are combined to study the intergrowth of 90° rotational components and of ramps in coffin-shaped ZSM-5 crystals. The 90° rotational boundaries with local zig-zag features between different intergrowth components are observed in the main part of crystal. Also a new kind of displacement boundary is described. At the displacement boundary there is a shift of the unit cells along the boundary without a change in orientation. Based on lamellae prepared with FIB from different positions of the ramps and crystal, the orientation relationships between ramps and the main part of the crystal are studied and the three-dimensional morphology and growth mechanism of the ramp are illustrated.


2021 ◽  
Author(s):  
Qasim Imtiaz ◽  
Andac Armutlulu ◽  
Felix Donat ◽  
Muhammad Awais Naeem ◽  
Christoph Müller

Chemical looping combustion (CLC) is a promising alternative to the conventional combustion-based, fossil fuel conversion processes. In CLC, a solid oxygen carrier is used to transfer oxygen from air to a carbonaceous fuel. This indirect combustion route allows for effective CO<sub>2</sub> capture since a sequestrable stream of CO<sub>2 </sub>is inherently produced without any need for energy-intensive CO<sub>2</sub> separation. From a thermodynamic point of view, CuO is arguably one of the most promising oxygen carrier candidates for CLC. However, the main challenge associated with the use of CuO for CLC is its structural instability at the typical operating temperatures of chemical looping processes, leading to severe thermal sintering and agglomeration. To minimize irreversible microstructural changes during CLC operation, CuO is commonly stabilized by a high Tammann temperature ceramic, e.g., Al<sub>2</sub>O<sub>3</sub>, MgAl<sub>2</sub>O<sub>4</sub>, etc. However, it has been observed that a high Tammann temperature support does not always provide a high resistance to agglomeration. This work aims at identifying descriptors that can be used to characterize accurately the agglomeration tendency of CuO-based oxygen carriers. CuO-based oxygen carriers supported on different metal oxides were synthesized using a Pechini method. The cyclic redox stability and agglomeration tendency of the synthesized materials was evaluated using both a thermo-gravimetric analyser and a lab-scale fluidized bed reactor at 900 °C using 10 vol. % H<sub>2</sub> in N<sub>2</sub> as the fuel and air for re-oxidation. In order to study the diffusion of Cu(O) during redox reactions, well-defined model surfaces comprising thin films of Cu/CuO and two different supports, viz. ZrO<sub>2</sub> or MgO, were prepared via magnetron sputtering. Energy dispersive X-ray (EDX) spectroscopy on focused ion beam (FIB)-cut cross-sections of the thin films revealed that Cu atoms have a tendency to diffuse outward through most of the films of the support material under redox conditions. The support that inhibits the outward movement of Cu(O), i.e. avoiding the presence of low melting Cu on the oxygen carrier surface, is found to provide the highest agglomeration resistance. The support MgO was found to possesses such diffusion characteristics.


2005 ◽  
Vol 42 (4) ◽  
pp. 172-187 ◽  
Author(s):  
Michael Rogers ◽  
Gerald Kothleitner ◽  
Antje Berendes ◽  
Wolfgang Bock ◽  
Bernd O. Kolbesen

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