Measurement of the Effect of Temperature on Stress Distribution and Deformation in Multilayer Optical Thin Film Structures

1994 ◽  
Vol 356 ◽  
Author(s):  
Cynthia G. Madras ◽  
P. Y. Wong ◽  
I. N. Miaoulis ◽  
L. M. Goldman

AbstractThis study investigates methods of predicting the deformation and stress distribution in multilayer optical thin film structures. The thin film layers include materials of various thermal expansion coefficients, elastic moduli, and melting temperatures. Each layer is deposited at a different temperature, causing complex thermal and deposition stresses throughout the structure. In addition, since the deposition temperatures of some of the layers are high (>600°C), stress relaxation and plastic flow may occur in materials with low melting temperatures. A combination of theoretical predictions and experimental measurements is used to measure and quantify the deformation caused by residual and thermal stresses in the films as well as any plastic deformation that may have occurred. Results from a model using multilayer plate bending theory to determine the elastic deformation of the device due to thermal stresses are reported. These predictions, as well as a more common method of predicting film stress and curvature, are compared to experimentally measured curvature changes as a function of temperature in the samples. However, when plastic deformation begins to occur at high temperatures, the residual stress and degree of deformation are no longer predictable based on elastic theory alone, and have to be measured experimentally. Plastic deformation in the substrate is discussed as a cause of a high observed curvature following sample heating.

2008 ◽  
Vol 75 (2) ◽  
Author(s):  
X. Feng ◽  
Y. Huang ◽  
A. J. Rosakis

Current methodologies used for the inference of thin film stress through curvature measurements are strictly restricted to uniform film stress and system curvature states over the entire system of a single thin film on a substrate. By considering a circular multilayer thin film/substrate system subjected to nonuniform temperature distributions, we derive relations between the stresses in each film and temperature, and between the system curvatures and temperature. These relations featured a “local” part that involves a direct dependence of the stress or curvature components on the temperature at the same point, and a “nonlocal” part, which reflects the effect of temperature of other points on the location of scrutiny. We also derive relations between the film stresses in each film and the system curvatures, which allow for the experimental inference of such stresses from full-field curvature measurements in the presence of arbitrary nonuniformities. These relations also feature a “nonlocal” dependence on curvatures making full-field measurements of curvature a necessity for the correct inference of stress. The interfacial shear tractions between the films and between the film and substrate are proportional to the gradient of the first curvature invariant, and can also be inferred experimentally.


2006 ◽  
Vol 74 (6) ◽  
pp. 1225-1233 ◽  
Author(s):  
Y. Huang ◽  
A. J. Rosakis

Current methodologies used for the inference of thin film stress through curvature measurements are strictly restricted to stress and curvature states that are assumed to remain uniform over the entire film/substrate system. By considering a circular thin film/substrate system subject to nonuniform and nonaxisymmetric temperature distributions, we derive relations between the film stresses and temperature, and between the plate system’s curvatures and the temperature. These relations featured a “local” part that involves a direct dependence of the stress or curvature components on the temperature at the same point, and a “nonlocal” part that reflects the effect of temperature of other points on the location of scrutiny. Most notably, we also derive relations between the polar components of the film stress and those of system curvatures which allow for the experimental inference of such stresses from full-field curvature measurements in the presence of arbitrary nonuniformities. These relations also feature a “nonlocal” dependence on curvatures making full-field measurements of curvature a necessity for the correct inference of stress. Finally, it is shown that the interfacial shear tractions between the film and the substrate are related to the gradients of the first curvature invariant and can also be inferred experimentally.


1997 ◽  
Vol 476 ◽  
Author(s):  
Wei-Tsu Tseng ◽  
Li-Wen Chen ◽  
G.-C. Tu

AbstractVariations in stress and grain size of Ti- and TiN- capped Al thin films passivated by fluorinated silicon dioxide (SiOF) during repetitive thermal cycling are investigated. The amount of stress relaxation, elastic and plastic behavior of these thin film structures are compared. Ti and TiN cap layers strengthen the single Al film significantly while the presence of SiOF induces plastic deformation of metal layers. Less grain growth is associated with a dielectric passivated Al film. The penetration of fluorine into Al upon annealing can be reduced by a TiN barrier layer.


2012 ◽  
Author(s):  
Ming Fang ◽  
JingPing Li ◽  
HongBo He ◽  
Zhengxiu Fan ◽  
Qilin Xiao ◽  
...  

2021 ◽  
pp. 108128652110312
Author(s):  
E. Nart ◽  
Y. Alinia ◽  
M. A. Güler

In this study, the stress analysis for an orthotropic thin film bonded to an orthotropic elastic substrate is addressed using both the analytical and finite element methods. The analytical method employs the integrodifferential formulation with the aid of membrane assumption. Utilizing the finite element method, the effect of orientation of the material principal directions are studied. The loading scenarios include a temperature gradient imposed on the film and a far-field uniaxial tension on the substrate. The results of current study indicate that the ratio of the film to the substrate stiffness plays a leading role in the film stress distribution. For the mechanical loading applied to the substrate, a soft thin film attached to a relatively stiffer substrate is preferred. The film can tolerate the induced thermal stresses as it is bonded to a softer host structure. The rotation angle of material orthotropy directions significantly affects the stress singularity near the film edges up to a certain extent.


2019 ◽  
Vol 682 ◽  
pp. 109-120 ◽  
Author(s):  
Wjatscheslaw Sakiew ◽  
Stefan Schrameyer ◽  
Marco Jupé ◽  
Philippe Schwerdtner ◽  
Nick Erhart ◽  
...  

Sign in / Sign up

Export Citation Format

Share Document