Control of Enhanced Optical Absorption in μc-Si

1997 ◽  
Vol 467 ◽  
Author(s):  
A. Kaan Kalkan ◽  
Stephen J. Fonash

ABSTRACTThe influence of grain size on the enhanced optical absorption of μc-Si has been investigated using films of various grain sizes prepared by solid phase crystallization. We show that we can control this grain size and therefore the degree of absorption changes. For grain sizes below a threshold range significant absorption enhancement can be seen in the photon energy range of 1 to ∼3 eV and the absorption characteristics of these films show that the dominant mode of optical transitions is indirect. A correlation between first order Raman peak broadening and enhanced absorption was found suggesting both effects are related to confinement. A simple model was developed to see how confinement in the crystallites could influence indirect optical transitions.

2000 ◽  
Vol 15 (7) ◽  
pp. 1630-1634 ◽  
Author(s):  
A. Rodríguez ◽  
J. Olivares ◽  
C. González ◽  
J. Sangrador ◽  
T. Rodríguez ◽  
...  

The crystallization kinetics and film microstructure of poly-SiGe layers obtained by solid-phase crystallization of unimplanted and C- and F-implanted 100-nm-thick amorphous SiGe films deposited by low-pressure chemical vapor deposition on thermally oxidized Si wafers were studied. After crystallization, the F- and C-implanted SiGe films showed larger grain sizes, both in-plane and perpendicular to the surface of the sample, than the unimplanted SiGe films. Also, the (111) texture was strongly enhanced when compared to the unimplanted SiGe or Si films. The crystallized F-implanted SiGe samples showed the dendrite-shaped grains characteristic of solid-phase crystallized pure Si. The structure of the unimplanted SiGe and C-implanted SiGe samples consisted of a mixture of grains with well-defined contour and a small number of quasi-dendritic grains. These samples also showed a very low grain-size dispersion.


1995 ◽  
Vol 403 ◽  
Author(s):  
C. M. Yang ◽  
Harry A. Atwater

AbstractSelective solid phase crystallization for control of grain size and location in polycrystalline thin Ge films on amorphous silicon dioxide substrates is described. The approach consists of selective solid phase crystal nucleation via an alloy reaction at predefined nucleation sites, which consist of metal islands deposited on top of the amorphous Ge film, followed by lateral solid phase epitaxial growth. Grain sizes as large as 30 μm have been achieved in 50 nm thick Ge films at temperatures less than 475 °C.


Author(s):  
Ryo Oishi ◽  
Koji ASAKA ◽  
Bolotov Leonid ◽  
Noriyuki Uchida ◽  
Masashi Kurosawa ◽  
...  

Abstract A simple method to form ultra-thin (< 20 nm) semiconductor layers with a higher mobility on a 3D-structured insulating surface is required for next-generation nanoelectronics. We have investigated the solid-phase crystallization of amorphous Ge layers with thicknesses of 10−80 nm on insulators of SiO2 and Si3N4. We found that decreasing the Ge thickness reduces the grain size and increases the grain boundary barrier height, causing the carrier mobility degradation. We examined two methods, known effective to enhance the grain size in the thicker Ge (>100 nm). As a result, a relatively high Hall hole mobility (59 cm2/Vs) has been achieved with a 20-nm-thick polycrystalline Ge layer on Si3N4, which is the highest value among the previously reported works.


1997 ◽  
Vol 485 ◽  
Author(s):  
Claudine M. Chen ◽  
Harry A. Atwater

AbstractWith a selective nucleation and solid phase epitaxy (SNSPE) process, grain sizes of 10 μm have been achieved to date at 620°C in 100 nrm thick silicon films on amorphous SiO2, with potential for greater grain sizes. Selective nucleation occurs via a thin film reaction between a patterned array of 20 rnm thick indium islands which act as heterogeneous nucleation sites on the amorphous silicon starting material. Crystal growth proceeds by lateral solid phase epitaxy from the nucleation sites, during the incubation time for random nucleation. The largest achievable grain size by SNSPE is thus approximately the product of the incubation time and the solid phase epitaxy rate. Electronic dopants, such as B, P, and Al, are found to enhance the solid phase epitaxy rate and affect the nucleation rate.


2010 ◽  
Vol 44-47 ◽  
pp. 4151-4153 ◽  
Author(s):  
Rui Min Jin ◽  
Ding Zhen Li ◽  
Lan Li Chen ◽  
Xiang Ju Han ◽  
Jing Xiao Lu

Amorphous silicon films prepared by PECVD on glass substrate has been crystallized by rapid thermal annealing (RTA) at the same temperature for different time. From X-ray diffraction (XRD) and scanning electronic microscope (SEM), it is found that the grain size is biggest crystallized at 720°C for 8 min, an average grain size of 28nm or so is obtained. The thin film is smoothly and perfect structure.


2008 ◽  
Vol 23 (2) ◽  
pp. 418-426 ◽  
Author(s):  
J. Farjas ◽  
P. Roura

The kinetics and microstructure of solid-phase crystallization under continuous heating conditions and random distribution of nuclei are analyzed. An Arrhenius temperature dependence is assumed for both nucleation and growth rates. Under these circumstances, the system has a scaling law such that the behavior of the scaled system is independent of the heating rate. Hence, the kinetics and microstructure obtained at different heating rates differ only in time and length scaling factors. Concerning the kinetics, it is shown that the extended volume evolves with time according to αex = [exp(κCt′)]m+1, where t′ is the dimensionless time. This scaled solution not only represents a significant simplification of the system description, it also provides new tools for its analysis. For instance, it has been possible to find an analytical dependence of the final average grain size on kinetic parameters. Concerning the microstructure, the existence of a length scaling factor has allowed the grain-size distribution to be numerically calculated as a function of the kinetic parameters.


1996 ◽  
Vol 448 ◽  
Author(s):  
Eui-Hoon Hwang ◽  
Jae-Sang Ro

AbstractA novel method for the fabrication of poly-Si films with a large grain size is reported using solid phase crystallization (SPC) of LPCVD amorphous Si films by nucleation interface control. The reference films used in this study were 1000 Ǻ -thick a-Si films deposited at 500°C at a total pressure of 0.35 Torr using Si2H6/He. Since the deposition condition changes the incubation time, i.e. nucleation rate, and since nucleation occurs dominantly at a-Si/SiO2 interface, we devised the following deposition techniques for the first time in order to obtain the larger gain size. A very thin a-Si layer (~ 50 Ǻ) with the deposition conditions having long incubation time is grown first and then the reference films (~ 950 Ǻ) are grown successively. Various composite films with different combinations were tested. The crystallization kinetics of composite films was observed to be determined by the deposition conditions of a thin a-Si layer at the a-Si/SiO2 interface. Nucleation interface was also observed to be modified by interrupted gas supply resulting in the enhancement of the grain size.


2007 ◽  
Vol 989 ◽  
Author(s):  
Jordi Farjas ◽  
Pere Roura ◽  
Pere Roca i Cabarrocas

AbstractThe grain size of thermally crystallized a-Si films is controlled by the nucleation, rN, and growth, rG, rates according to the standard Avrami's theory. Despite this evidence, most papers devoted to improve the crystallized grain size analyze their results with a qualitative reference to this theory. In this paper, we will show that one can identify the standard set of rN and rG values for a-Si and that experiments show that deviations from this standard values always result in a smaller grain size. It is also shown that one cannot expect any substantial improvement with non-conventional heat treatments. Finally, it is argued that a larger grain size is expected from a-Si films containing, in their as-grown state, a controlled density of embedded nanocrystals.


2002 ◽  
Vol 715 ◽  
Author(s):  
Xiang-Zheng Bo ◽  
Nan Yao ◽  
J. C. Sturm

AbstractSolid phase crystallization (SPC) of a-Si: H at 600°C was investigated by transmission electron microscopy (TEM) and Raman spectroscopy in a cantilever structure, where the underlying SiO2 was removed prior to the crystallization. The absence of the underlying oxide leads to both a higher grain size and a lower intragranular defect density. The grain size increases from 0.6 μm in regions with the underlying oxide to 3.0 μm without the underlying oxide, and the intragranular defect density decreases one order of magnitude from ∼ 1011 cm-2 to ∼ 1010 cm-2. The improvements in material quality without the lower a-Si/SiO2 interface are thought to be due to a lower nucleation rate and a lower tensile stress with an easier silicon atomic rearrangement at the lower silicon interface.


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