Preparation of The Double-Sided YBa2Cu3O7-δ Thin Film by Hot-Wall Type Mocvd

1997 ◽  
Vol 474 ◽  
Author(s):  
Y. Ito ◽  
M. Iwata ◽  
Y. Yoshida ◽  
Y. Takai ◽  
I. Hirabayashi
Keyword(s):  
Gas Flow ◽  
Single Phase ◽  
Ybco Film ◽  
Chemical Vapor ◽  
Organic Chemical ◽  
Axis Orientation ◽  
Ybco Films ◽  
Metal Organic ◽  
Organic Chemical Vapor Deposition ◽  
Source Materials

ABSTRACTA hot-wall type metal organic chemical vapor deposition (MOCVD) apparatus has been developed for the deposition of the YBa2Cu3O7-δ (YBCO) films using liquid metal organic sources on arbitrary shaped substrates. By improving the reactor shape and gas flow of the source materials, we succeeded in fabricating the double-sided YBCO films for electronic and microwave devices and the YBCO-coated conductor on oxide fiber for power applications. Tc(zero)'s of the YBCO film on both sides of the LaAlO3 (100) substrate were 90K and 86K, respectively. The films on the facet of the single crystalline SrTiO3 fiber showed the single phase c-axis orientation with biaxially alignment in the a / b plane.

Effects of Cu/Ba Ratio in Precursor on MOCVD-Deposited YBa2Cu3O7-x Films on YYC Buffered Ni-W Alloy Tape

2014 ◽  
Vol 1082 ◽  
pp. 95-99
Author(s):  
Fei Zhang ◽  
Jie Xiong ◽  
Rui Peng Zhao ◽  
Yan Xue ◽  
Bo Wan Tao
Keyword(s):  
Vapor Deposition ◽  
Ybco Film ◽  
Chemical Vapor ◽  
Organic Chemical ◽  
X Ray Diffraction ◽  
Ybco Films ◽  
X Ray ◽  
Metal Organic ◽  
Organic Chemical Vapor Deposition ◽  
Alloy Tape

To study the effects of Cu/Ba ratio of precursor on YBa2Cu3O7-x (YBCO) film, we have employed the technique of metal-organic chemical vapor deposition to prepare 500 nm thick YBCO films on CeO2/YSZ/Y2O3 (YYC) buffered Ni-W alloy tapes at series of Cu/Ba ratios of precursor. The analysis obtained from X-ray diffraction and scanning electron microscope revealed that the YBCO films crystallized better and became more continuous and denser as Cu/Ba ratio increased from 0.81 to 1.00, yielding that the critical current density (Jc) of YBCO films at 77K and 0T rose from 1.0 MA/cm2 to 1.4 MA/cm2. Moreover, the energy dispersive spectroscopy indicated that the increase in Cu/Ba ratio of precursor made the Cu/Ba ratio of the YBCO film matrix closer to the theoretical value of 1.5. However, for the Cu/Ba ratio of precursor in the range of 1.00~1.21, the crystallization and texture deteriorated severely and many unexpected precipitates of Ba-Cu-O and Cu-O arose, resulting in the dramatic drop of Jc from 1.4 MA/cm2 to 0.1 MA/cm2.

Novel Design of MOCVD Reactor with Three Radial Inward Flows for Epitaxial Growth of GaN Thin Films

2011 ◽  
Vol 308-310 ◽  
pp. 1037-1040
Author(s):  
Liao Qiao Yang ◽  
Jian Zheng Hu ◽  
Zun Miao Chen ◽  
Jian Hua Zhang ◽  
Alan G. Li
Keyword(s):  
Gas Flow ◽  
Chemical Vapor ◽  
Growth Conditions ◽  
Organic Chemical ◽  
Operating Pressure ◽  
Axisymmetric Mode ◽  
Mocvd Reactor ◽  
Metal Organic ◽  
Organic Chemical Vapor Deposition ◽  
D Model

In this paper, a novel super large metal organic chemical vapor deposition (MOCVD) reactor with three inlets located on the periphery of reactor was proposed and numerical evaluation of growth conditions for GaN thin film was characterized. In this design, the converging effects of gas flow in the radial direction could counterbalance the dissipation of metal organics source. CFD was used for the mathematical solution of the fluid flow, temperature and concentration fields. A 2-D model utilizing axisymmetric mode to simulate the gas flow in a MOCVD has been developed. The growth of GaN films using TMGa as a precursor, hydrogen as carrier gas was investigated. The effects of flow rates, mass fraction of various species, operating pressure, and gravity were analyzed and discussed, respectively. The numerical simulation results show all the fields distributions were in an acceptable range.

Copper Films Prepared by Metal Organic Chemical Vapor Deposition (MOCVD) Process Using Copper (Acetylacetonate) and Water Vapor as Reactants: The Impact of Water Vapor

1992 ◽  
Vol 282 ◽  
Author(s):  
Yu-Neng Chang
Keyword(s):  
Water Vapor ◽  
Partial Pressure ◽  
Gas Flow ◽  
Chemical Vapor ◽  
Organic Chemical ◽  
Gas Flow Rate ◽  
Cu Films ◽  
Metal Organic ◽  
Carrier Gas Flow ◽  
Organic Chemical Vapor Deposition

ABSTRACTBy using the strong reductive potential of copper acetylacetone (Cu(acac)2) when Cu(acac)2) was thermally decomposed, copper metal films were prepared by metal organic chemical vapor deposition (MOCVD) process using sublimed Cu(acac)2 vapor and water vapor as reactants, at one atmosphere pressure. According to thermodynamic calculations, Cu films could be prepared by MOCVD process with a high ratio of partial pressures for water vapor and Cu(acac)2 vapor (PH2O/Pcu(acac)2>30) In this paper, the impacts of MOCVD processing parameters such as watervapor partial pressure, total carrier gas flow rate, and precursor partial pressure on film composition and microstructure were investigated. Deposition temperature is the primary processing parameter affecting film stoichiometry. In a specific deposition temperature window, from 370°C to 400°C, polycrystalline Cu films with Cu [111] preferential orientation were deposited. ER and XRD results indicated that films deposited at temperature lower than 350°C contain copper oxide phase with poor crystal structure. By comparing the values of X-ray Auger Electron Spectroscopy (XAES) and Auger parameter (αAu) from photoelectrons of Cu films and standards from reference compounds, die principle oxidation state of copper in these films was determined as Cu(0). The deposition results indicated that a water vapor partial pressure above 10 torr is necessary to produce Cu films. As indicated by SEM, Increasing the carrier gas flow rate, above 600 sccm, can reduce the average temperature profile in the thermal boundary layer above the substrate surface, retard the gas phase reaction rate, presumably eliminate the homogeneous nucleation, and deposit smooth Cu films.

RuO2 films by metal-organic chemical vapor deposition

1993 ◽  
Vol 8 (10) ◽  
pp. 2644-2648 ◽  
Author(s):  
Jie Si ◽  
Seshu B. Desu
Keyword(s):  
Thin Films ◽  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Gas Flow ◽  
Chemical Vapor ◽  
Film Structure ◽  
Organic Chemical ◽  
Dilute Gas ◽  
Metal Organic ◽  
Organic Chemical Vapor Deposition

Pure and conducting RuO2 thin films were successfully deposited on Si, SiO2/Si, and quartz substrates at temperatures as low as 550 °C by a hot wall metal-organic chemical vapor deposition (MOCVD). Bis(cyclopentadienyl)ruthenium, Ru(C5H5)2, was used as the precursor. An optimized MOCVD process for conducting RuO2 thin films was established. Film structure was dependent on MOCVD process parameters such as bubbler temperature, dilute gas flow rates, deposition temperature, and total pressure. Either pure RuO2, pure Ru, or a RuO2 + Ru mixture was obtained under different deposition conditions. As-deposited pure RuO2 films were specular, crack-free, and well adhered on the substrates. The Auger electron spectroscopy depth profile showed good composition uniformity across the bulk of the films. The MOCVD RuO2 thin films exhibited a resistivity as low as 60 μω-cm. In addition, the reflectance of RuO2 in the NIR region had a metallic character.

Deep Impurities in AlGaAs Grown by MOCVD Using Different Hydrogen and Nitrogen as Carrier Gases

1995 ◽  
Vol 378 ◽  
Author(s):  
J. C. Chen ◽  
Z. C. Huang ◽  
Bing Yang ◽  
H. K. Chen ◽  
K. J. Lee
Keyword(s):  
Chemical Vapor ◽  
Organic Chemical ◽  
Background Concentrations ◽  
Order Of Magnitude ◽  
Metal Organic ◽  
Carrier Gases ◽  
P Type ◽  
Organic Chemical Vapor Deposition ◽  
Source Materials ◽  
Concentration Of Impurities

AbstractA study was carried out to characterize the deep impurities in AlxGa1-x As grown by metal-organic chemical vapor deposition (MOCVD) using different carrier gases. Since AlxGai1-x As is very sensitive to any impurities, especially moisture and oxygen, in the growth process, the concentration of impurities in AlxGai1-xAs can serve as a measure of the purity of carrier gases. The undoped AlGaAs layers grown by using H2 have n-type background concentrations from 3×1015 to 10×1015/cc. The concentrations of oxygen-related traps (Ec−0.53 and 0.7 eV) are 0.2−9×1013 and 3.4−5×1014/cc for Pd- and Li-purified H2, respectively. Low-temperature photoluminescence (PL) measurements show better PL efficiency in samples grown by using Pd- purified H2. AlxGa1-xAs grown by using N2 is p-type (p∼6×1016/cc) with an oxygen-related trap and two hole traps. The concentration of oxygen-related trap is more than one order of magnitude higher than that of AlGaAs using Pd-purified H2. The memory effect due to impurities from carrier gas left in source materials is also studied.

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