Growth of GaN on Lithium Gallate Substrates for Development of a GaN Thin Compliant Substrate

1997 ◽  
Vol 482 ◽  
Author(s):  
W. A. Doolittle ◽  
T. Kropewnicki ◽  
C. Carter-Coman ◽  
S. Stock ◽  
P. Kohl ◽  
...  

AbstractThe GaN on LGO system is the near perfect template (due to extremely high etch selectivity) for developing a viable thin film/compliant GaN substrate. Herein, we report on our efforts to grow GaN on LGO, including improvement of the microscopic surface morphology using pre-growthpretreatments. We also report on the first transferred thin film GaN substrate grown on LGO, transferred off of LGO, and mounted on GaAs. With this approach, (InAl)GaN alloys can be grown on thin GaN films, implementing a truly “compliant” substrate for the nitride alloy system. In addition, the flexibility of bonding to low cost Si, metal or standard ceramic IC packages is an attractive alternative to SiC and HVPE GaN substrates for optimizing cost verses thermal conductivity concerns. We have demonstratedhigh quality growth of GaN on LGO. X-Ray rocking curves of 145 arc-seconds are obtained with only a 0.28 μm thick film. We present data on the out of plane crystalline quality of GaN/LGO material. Likewise, we show 2 orders of magnitude improvement in residual doping concentration and factors of 4 improvement in electron mobility as compared to the only previously reported electrical data. We show substantial vendor to vendor and intra-vendor LGO material quality variations. We have also quantified the desorption of Ga and Li from the surface of LGO at typical growth temperatures using in situ desorption mass spectroscopy and XPS.

MRS Advances ◽  
2016 ◽  
Vol 1 (37) ◽  
pp. 2635-2640 ◽  
Author(s):  
Adele Moatti ◽  
Reza Bayati ◽  
Srinivasa Rao Singamaneni ◽  
Jagdish Narayan

ABSTRACTBi-epitaxial VO2 thin films with [011] out-of-plane orientation were integrated with Si(100) substrates through TiO2/TiN buffer layers. At the first step, TiN is grown epitaxially on Si(100), where a cube-on-cube epitaxy is achieved. Then, TiN was oxidized in-situ ending up having epitaxial r-TiO2. Finally, VO2 was deposited on top of TiO2. The alignment across the interfaces was stablished as VO2(011)║TiO2(110)║TiN(100)║Si(100) and VO2(110) /VO2(010)║TiO2(011)║TiN(112)║Si(112). The inter-planar spacing of VO2(010) and TiO2(011) equal to 2.26 and 2.50 Å, respectively. This results in a 9.78% tensile misfit strain in VO2(010) lattice which relaxes through 9/10 alteration domains with a frequency factor of 0.5, according to the domain matching epitaxy paradigm. Also, the inter-planar spacing of VO2(011) and TiO2(011) equals to 3.19 and 2.50 Å, respectively. This results in a 27.6% compressive misfit strain in VO2(011) lattice which relaxes through 3/4 alteration domains with a frequency factor of 0.57. We studied semiconductor to metal transition characteristics of VO2/TiO2/TiN/Si heterostructures and established a correlation between intrinsic defects and magnetic properties.


2021 ◽  
Author(s):  
Nusrat Jahan Surovy

Ultrasound imaging is a widely used noninvasive imaging technique for biomedical and other applications. Piezoelectric devices are commonly used for the generation and detection of ultrasound in these applications. However, implementation of two-dimensional arrays of piezoelectric transducers for 3D ultrasound imaging is complex and expensive. Optical Fabry-Perot interferometry is an attractive alternative to the piezoelectric devices for detection of ultrasound. In this method a thin film etalon is constructed and used. Light reflected from the two surfaces of this thin film produces an intensity which depends on the film thickness. When ultrasound is incident on the film, it changes the thickness of the film and consequently modulates the light intensity on the film. In our work, we made two types of etalon (Finesse 2) for our experiment. We detected lower frequency ultrasound (0.5 MHz or 1 MHz) using the build etalon. We determined a linear relationship between the strength of the optical signals and the exerted pressure on a film by the ultrasound. The dependence of the etalon performance on the light wavelength was demonstrated indirectly by measuring the signal at various light incidence angle. Simulation results are also presented. Lastly, we proposed the optimum design of this detection system based on the simulation results. This method of ultrasound detection can be a potential low-cost approach for 3D ultrasound imaging.


2009 ◽  
Vol 60-61 ◽  
pp. 357-360 ◽  
Author(s):  
Han Chen ◽  
Hua Rong ◽  
Ming Wang

The stress gradient of a deposited thin-film is a mechanical parameter that affects the performance of MEMS devices, so in-situ measuring stress gradient of a thin-film is great significant. A new in-situ measuring method based on a center-anchored circular plate is presented. The Mirau interferometer has been used to measure the out-of-plane height at the edge of circular plate, then the curvature radius of the plate and the stress gradient of the film can be calculated. The measuring method has been verified by CoventorWare. The accuracy of the presented measuring method is ideal. The advantages of the method also have been discussed.


2005 ◽  
Vol 483-485 ◽  
pp. 1051-1056
Author(s):  
A. Krost ◽  
Armin Dadgar ◽  
F. Schulze ◽  
R. Clos ◽  
K. Haberland ◽  
...  

Due to the lack of GaN wafers, so far, group-III nitrides are mostly grown on sapphire or SiC substrates. Silicon offers an attractive alternative because of its low cost, large wafer area, and physical benefits such as the possibility of chemical etching, lower hardness, good thermal conductivity, and electrical conducting or isolating for light emitting devices or transistor structures, respectively. However, for a long time, a technological breakthrough of GaN-on-silicon has been thought to be impossible because of the cracking problem originating in the huge difference of the thermal expansion coefficients between GaN and silicon which leads to tensile strain and cracking of the layers when cooling down. However, in recent years, several approaches to prevent cracking and wafer bowing have been successfully applied. Nowadays, device-relevant thicknesses of crackfree group-III-nitrides can be grown on silicon. To reach this goal the most important issues were the identification of the physical origin of strains and its engineering by means of in situ monitoring during metalorganic vapor phase epitaxy.


Sensors ◽  
2020 ◽  
Vol 20 (16) ◽  
pp. 4577
Author(s):  
Florentin Delaine ◽  
Bérengère Lebental ◽  
Hervé Rivano

The drastically increasing availability of low-cost sensors for environmental monitoring has fostered a large interest in the literature. One particular challenge for such devices is the fast degradation over time of the quality of their data. Therefore, the instruments require frequent calibrations. Traditionally, this operation is carried out on each sensor in dedicated laboratories. This is not economically sustainable for dense networks of low-cost sensors. An alternative that has been investigated is in situ calibration: exploiting the properties of the sensor network, the instruments are calibrated while staying in the field and preferably without any physical intervention. The literature indicates there is wide variety of in situ calibration strategies depending on the type of sensor network deployed. However, there is a lack for a systematic benchmark of calibration algorithms. In this paper, we propose the first framework for the simulation of sensor networks enabling a systematic comparison of in situ calibration strategies with reproducibility, and scalability. We showcase it on a primary test case applied to several calibration strategies for blind and static sensor networks. The performances of calibration are shown to be tightly related to the deployment of the network itself, the parameters of the algorithm and the metrics used to evaluate the results. We study the impact of the main modelling choices and adjustments of parameters in our framework and highlight their influence on the results of the calibration algorithms. We also show how our framework can be used as a tool for the design of a network of low-cost sensors.


Author(s):  
Wengao Pan ◽  
Xiaoliang Zhou ◽  
Qingping Lin ◽  
Jie Chen ◽  
Lei Lu ◽  
...  

Thin film transistors (TFT) with low cost, high mobility and low processing temperature are key enablers for practical application, which are always contradictory. In this work, we achieved high performance...


RSC Advances ◽  
2016 ◽  
Vol 6 (5) ◽  
pp. 4108-4115 ◽  
Author(s):  
Lianbo Zhao ◽  
Yunxiang Di ◽  
Chang Yan ◽  
Fangyang Liu ◽  
Zhu Cheng ◽  
...  

The semiconductor SnS is a promising candidate for low cost earth-abundant photovoltaic absorbing layers and presents some interesting challenges in single phase material preparation.


Author(s):  
Giancarla Alberti ◽  
Camilla Zanoni ◽  
Lisa Rita Magnaghi ◽  
Raffaela Biesuz

Environmental contamination affects human health and reduces the quality of life. Therefore, the monitoring of water and air quality is important, ensuring that all areas are acquiescent with the current legislation. Colorimetric sensors deliver quick, naked-eye detection, low-cost, and adequate determination of environmental analytes. In particular, disposable sensors are cheap and easy-to-use devices for single-shot measurements. Due to increasing requests for in situ analysis or resource-limited zones, disposable sensors’ development has increased. This review provides a brief insight into low-cost and disposable colorimetric sensors currently used for environmental analysis. The advantages and disadvantages of different colorimetric devices for environmental analysis are discussed.


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