Microstructural Stability Of a NiAI-Mo Eutectic Alloy

1998 ◽  
Vol 552 ◽  
Author(s):  
M. T. Kush ◽  
J. W. Holmes ◽  
R. Gibala

ABSTRACTThe microstructural stability of a directionally-solidified NiA1–9 at.% Mo quasi-binary alloy was investigated under conditions of thermal cycling between the temperatures 973 K and 1473 K utilizing time-temperature heating and cooling profiles which approximate potential engine applications. Two different microstructures were examined: a cellular microstructure in which the faceted secondphase Mo rods in the NiAl matrix formed misaligned cell boundaries which separated aligned cells approximately 0.4 mm in width and 5–25 mm in length, and a nearly fault-free fully columnar microstructure well aligned along the [001] direction. Both microstructures resisted coarsening under thermal cycling, but plastic deformation induced by thermal stresses introduced significant specimen shape changes. Surprisingly, the cellular microstructure, for which the cell boundary region apparently acts as a deformation buffer, exhibited better resistance to thermal fatigue than the more fault-free and better aligned columnar microstructure.

1996 ◽  
Vol 460 ◽  
Author(s):  
M. T. Kush ◽  
J. W. Holmes ◽  
R. Gibala

ABSTRACTThe quasi-binary eutectic NiAl-9% Mo with faceted molybdenum fibers was subjected to both thermal annealing conditions and to annealing under thermal cycling conditions to determine the microstructural stability of this alloy. The static temperature tests were run at 0.85TM - 0.97TM in an argon gas atmosphere. The thermal cycling tests were performed between temperatures of 700°C and 1200°C by induction heating disk-shaped specimens in an argon gas atmosphere using time-temperature heating and cooling profiles to approximate potential engine applications. To quantify microstructural changes, the fiber size and size distribution and number of fibers per unit area were measured as a function of time at temperature. The overall results demonstrate that the directionally solidified eutectic NiAl-9Mo subjected to thermal fatigue conditions exhibits cell boundary coarsening and large shape changes, whereas the microstructure under static stress-free annealing is stable.


1998 ◽  
Vol 552 ◽  
Author(s):  
M. T. Kush ◽  
J. W. Holmes ◽  
R. Gibala

ABSTRACTSingle crystals of [001]-oriented NiAI single crystals were subjected to thermal fatigue by a method which employs induction heating of disk-shaped specimens heated in an argon atmosphere. Several time-temperature heating and cooling profiles were used to produce different thermal strain histories in specimens cycled between 973 K and 1473 K. After thermal cycling, pronounced shape changes in the form of diametrical elongations along <100> directions with accompanying increases in thickness at and near the <100> specimen axes were observed. The deformations were analyzed in terms of operative slip systems in tension and compression, ratchetting (cyclic strain accumulation), and the elastic properties of NiAl. The experimental results correlate best with thermal stresses associated with the large elastic anisotropy of NiAl.


2022 ◽  
Vol 104 ◽  
pp. 269-284
Author(s):  
Wenrui An ◽  
Satoshi Utada ◽  
Xiaotong Guo ◽  
Stoichko Antonov ◽  
Weiwei Zheng ◽  
...  

2021 ◽  
Author(s):  
Navindra Wijeyeratne ◽  
Firat Irmak ◽  
Ali P. Gordon

Abstract Nickel-base superalloys (NBSAs) are extensively utilized as the design materials to develop turbine blades in gas turbines due to their excellent high-temperature properties. Gas turbine blades are exposed to extreme loading histories that combine high mechanical and thermal stresses. Both directionally solidified (DS) and single crystal NBSAs are used throughout the industry because of their superior tensile and creep strength, excellent low cycle fatigue (LCF), high cycle fatigue (HCF), and thermomechanical fatigue (TMF) capabilities. Directional solidification techniques facilitated the solidification structure of the materials to be composed of columnar grains in parallel to the &lt;001&gt; direction. Due to grains being the sites of failure initiation the elimination of grain boundaries compared to polycrystals and the alignment of grain boundaries in the normal to stress axis increases the strength of the material at high temperatures. To develop components with superior service capabilities while reducing the development cost, simulating the material’s performance at various loading conditions is extremely advantageous. To support the mechanical design process, a framework consisting of theoretical mechanics, numerical simulations, and experimental analysis is required. The absence of grain boundaries transverse to the loading direction and crystallographic special orientation cause the material to exhibit anisotropic behavior. A framework that can simulate the physical attributes of the material microstructure is crucial in developing an accurate constitutive model. The plastic flow acting on the crystallographic slip planes essentially controls the plastic deformation of the material. Crystal Visco-Plasticity (CVP) theory integrates this phenomenon to describe the effects of plasticity more accurately. CVP constitutive models can capture the orientation, temperature, and rate dependence of these materials under a variety of conditions. The CVP model is initially developed for SX material and then extended to DS material to account for the columnar grain structure. The formulation consists of a flow rule combined with an internal state variable to describe the shearing rate for each slip system. The model presented includes the inelastic mechanisms of kinematic and isotropic hardening, orientation, and temperature dependence. The crystallographic slip is accounted for by including the required octahedral, cubic, and cross slip systems. The CVP model is implemented through a general-purpose finite element analysis software (i.e., ANSYS) as a User-Defined Material (USERMAT). Uniaxial experiments were conducted in key orientations to evaluate the degree of elastic and inelastic anisotropy. The temperature-dependent modeling parameter is developed to perform non-isothermal simulations. A numerical optimization scheme is utilized to develop the modeling constant to improve the calibration of the model. The CVP model can simulate material behavior for DS and SX NBSAs for monotonic and cyclic loading for a range of material orientations and temperatures.


2005 ◽  
Vol 2 (4) ◽  
pp. 269-280 ◽  
Author(s):  
Lafir Ali ◽  
Y. C. Chan ◽  
M.O. Alam

The reliability of ACF (Anisotropic conductive film) interconnection is a serious concern especially under thermal loading condition. This paper focuses on the online contact resistance behavior of the ACF joint for bumpless flip-chip on flex packages during different thermal cycling conditions. In this work, flip chips of 11×3 mm2 having bare aluminum pad were used. Real time contact resistance (i.e. live measurement contact resistance variation with temperature) was measured by four points probe method when the packages were inside thermal shock chamber. Tests for three different thermal cycling profiles (125°C to −55°C, 140°C to −40°C and 150°C to −65°C) were carried out. The samples bonded at temperature 180°C and pressure of 2.42Mpa was used. The initial contact resistance of the bumpless samples was 0.4Ω. Contact resistance increased with the number of thermal cycles, however the effect was severe when the temperature variation was above the glass transition temperature (Tg) of the ACF matrix (131°C). Differences in co-efficient of thermal expansion (CTE) between the chip and the substrate generated thermal stresses during temperature fluctuation, which caused the pad of the substrate to slide over the Al pad of the chip. Thus variation of the contact resistance was also observed along the interconnection position in the package, i.e. corner joint showed higher value of increase in contact resistance than the middle position. Even though flex substrate was used in this study; the sliding effect was severe at the corner Al pads of the chip, where cumulative forces generated due to the thermal stress. Results show that for thermal cycling profile 140°C to −40°C, online contact resistance increased to 1.2 Ω in corner joint, whereas for the middle joints the contact resistance just increased to 0.5 Ω. Glass transition temperature (Tg) of the ACF material plays an important role on the high temperature contact resistance. For every thermal cycling profile, there is an incubation period that would have significant impact in the application of ACF. After the incubation period the contact resistance increases rapidly and the joints are no longer reliable.


Electronics ◽  
2020 ◽  
Vol 9 (4) ◽  
pp. 620 ◽  
Author(s):  
Bernardo Cougo ◽  
Lenin Morais ◽  
Gilles Segond ◽  
Raphael Riva ◽  
Hoan Tran Duc

This paper presents the influence of different pulse width modulation (PWM) methods on losses and thermal stresses in SiC power modules used in a three-phase inverter. The variation of PWM methods directly impacts instantaneous losses on these semiconductors, consequently resulting in junction temperature swing at the fundamental frequency of the converter’s output current. This thermal cycling can significantly reduce the lifetime of these components. In order to determine semiconductor losses, one needs to characterize SiC devices to calculate the instantaneous power. The characterization methodology of the devices, the calculation of instantaneous power and temperature of SiC dies, and the influence of the different PWM methods are presented. A 15-kVA inverter is built in order to obtain experimental results to confirm the characterization and loss calculation, and we show the best PWM methods to increase efficiency and reliability of the three-phase inverter for specific aircraft applications.


2017 ◽  
Vol 122 ◽  
pp. 62-67 ◽  
Author(s):  
Nadège Vetterli ◽  
Matthias Sulzer ◽  
Urs-Peter Menti

Author(s):  
T. N. Drebushchak ◽  
Yu.A. Kryukov ◽  
A. I. Rogova ◽  
E. V. Boldyreva

In the title compound, [MeC5H4NCONHCH2C6H5]I or C14H15N2O+·I−, a cation and an anion form an ionic pair linked by a strong N—H...I hydrogen bond. In the crystal, ionic pairs linked by weak C—H...I hydrogen bonds form infinite ribbons along the crystallographicaaxis. Polymorphism screening varying crystallization solvents (water, acetone 90%–water, ethanol 90%–water, 2-propanol 90%–water, DMF, DMSO, methanol, acetonitrile) and conditions (solution temperature, heating and cooling protocols) did not reveal any other polymorphs than the one reported in this work.


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