Mechanism of Cu removal during CMP in H2O2-glycine based slurries
Hydroxyl radical generation has been observed during Cu CMP using hydrogen peroxide-glycine based slurries. While the Cu dissolution/polish rates increased with increasing glycine concentration, the copper dissolution rate decreased with increasing peroxide concentration indicating the occurrence of both dissolution and passive film formation during CMP. This is further confirmed by both in situ and ex situ electrochemical experiments.
2019 ◽
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1996 ◽
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