Nanoindentation and Microstructural Evolution Studies of DC Magnetron Sputtered Chromium Nitride Thin Films

2001 ◽  
Vol 672 ◽  
Author(s):  
A.B. Agarwal ◽  
B.A. Rainey ◽  
S.M. Yalisove ◽  
J.C. Bilello
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Elastic Modulus ◽  
Flow Rate ◽  
Chromium Nitride ◽  
Nitrogen Flow ◽  
Nitrogen Flow Rate ◽  
Flow Rates ◽  
Chromium Nitrides ◽  
Deposited Films

ABSTRACTNanoindentation experiments have been performed to assess the mechanical behavior of chromium nitride (CrxNy) thin films sputtered in different deposition geometries and with varying Ar and N2 pressures. The hardness and elastic modulus of chromium nitrides are of great interest with regard to their applications. In the present work, two different deposition geometries, i.e. multi-substrate and confocal, were used to sputter (DC magnetron) a CrxNy layer on Si (100) wafers at varying nitrogen flow rates. The results of the nanoindentation experiments indicate that, over a similar argon and nitrogen regime, the CrxNy films grown in a multi- substrate geometry exhibit higher hardness and elastic modulus on the average than those grown in the confocal geometry. Furthermore, it was found that in the multi-substrate geometry the hardness and elastic modulus of the films were significantly higher than those in the confocally deposited films for a specific regime of the nitrogen flow rate (10-14 sccm). Finally, observations of the mechanical properties trends could be correlated with a higher degree of anisotropic stress for films grown in the multi-substrate in comparison to the confocal geometry.

scholarly journals Effect of nitrogen flow rate on the mechanical properties of CVD-deposited SiCN thin films

2019 ◽  
Vol 42 (5) ◽  
Author(s):  
Dhruva Kumar ◽  
Ranjan Kr Ghadai ◽  
Soham Das ◽  
Ashis Sharma ◽  
Bibhu P Swain
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Flow Rate ◽  
Nitrogen Flow ◽  
Nitrogen Flow Rate ◽  
Sicn Thin Films

The Effect of Ta and N Content on Mechanical Properties of DC Magnetron Sputtered fen and Fetan thin films

1996 ◽  
Vol 436 ◽  
Author(s):  
Hong Deng ◽  
M. Kevin Minor ◽  
John A. Barnard
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Young’S Modulus ◽  
Flow Rate ◽  
Young's Modulus ◽  
Nitrogen Flow ◽  
Nitrogen Flow Rate ◽  
N Content ◽  
Hardness Values ◽  
Penetration Depths

AbstractThis paper reports nanoindentation studies of the effect of Ta and N content on the mechanical properties of magnetically soft high moment FeN and FeTaN thin films prepared by dc magnetron sputtering. The FeTaN films were deposited on oxidized silicon (100) substrates with a series of FeTa targets in which the Ta content varies from 0 to 25wt%. The hardness (H) and Young's modulus (E) were measured by the Nano Indenter at nine indenter penetration depths: 20, 30, 40, 50, 60, 80, 100, 120 and 200 nm. The inherent hardness values of these films (no substrate effect) can be determined at penetration depths ranging from 20 to 60 nm for the 500 nm thick film used in the study. It was found that for the films deposited from the pure Fe target when the nitrogen flow rate increases from 0 to about 0.5 sccm the hardness of the film increases. However, a decreasing trend in hardness of these films was observed on further increasing the nitrogen flow rate. On the other hand, for the films prepared from the targets with the Ta content in the range of 5–15wt%, the hardness increases whenever Ta and N contents increase. These effects are clearly illustrated by 3-D and contour hardness and Young's modulus maps in this paper.

scholarly journals Structure and Properties of Nanocrystalline (TiZr)xN1−xThin Films Deposited by DC Unbalanced Magnetron Sputtering

2016 ◽  
Vol 2016 ◽  
pp. 1-12 ◽  
Author(s):  
Yu-Wei Lin ◽  
Chia-Wei Lu ◽  
Ge-Ping Yu ◽  
Jia-Hong Huang
Keyword(s):  
Thin Films ◽  
Residual Stress ◽  
Magnetron Sputtering ◽  
Flow Rate ◽  
Nitrogen Flow ◽  
Structure And Properties ◽  
X Ray Diffraction ◽  
Nitrogen Flow Rate ◽  
Unbalanced Magnetron Sputtering ◽  
Unbalanced Magnetron

This study aims to investigate the effects of nitrogen flow rate (0–2.5 sccm) on the structure and properties of TiZrN films. Nanocrystalline TiZrN thin films were deposited on Si (001) substrates by unbalanced magnetron sputtering. The major effects of the nitrogen flow rate were on the phase, texture, N/(Ti + Zr) ratio, thickness, hardness, residual stress, and resistivity of the TiZrN films. The nitrogen content played an important role in the phase transition. With increasing nitrogen flow rate, the phase changed from mixed TiZr and TiZrN phases to a single TiZrN phase. The X-ray diffraction results indicated that (111) was the preferred orientation for all TiZrN specimens. The N/(Ti + Zr) ratio of the TiZrN films first increased with increasing nitrogen flow rate and then stabilized when the flow rate further increased. When the nitrogen flow rate increased from 0.4 to 1.0 sccm, the hardness and residual stress of the TiZrN thin film increased, whereas the electrical resistivity decreased. None of the properties of the TiZrN thin films changed with nitrogen flow rate above 1.0 sccm because the films contained a stable single phase (TiZrN). At high nitrogen flow rates (1.0–2.5 sccm), the average hardness and resistivity of the TiZrN thin films were approximately 36 GPa and 36.5 μΩ·cm, respectively.

GROWTH STRUCTURE EFFECT ON THE CORROSION RESISTANCE AND MECHANICAL PROPERTIES OF CrNx COATING

2019 ◽  
Vol 27 (01) ◽  
pp. 1950091 ◽  
Author(s):  
JIAOJIAO DU ◽  
HAIBIN ZHOU ◽  
CAIXIA SUN ◽  
HAIJIANG KOU ◽  
ZHONGWEI MA ◽  
...  
Keyword(s):  
Corrosion Resistance ◽  
Corrosion Behavior ◽  
Flow Rate ◽  
Steel Substrate ◽  
Face Centered Cubic ◽  
Nitrogen Flow ◽  
Nitrogen Flow Rate ◽  
Flow Rates ◽  
Sputtering Deposition ◽  
Growth Structure

A new approach was adopted to improve the corrosion behavior of the chromium nitride (CrNx) hard coating through magnetron sputtering deposition at different nitrogen flow rates. The influence of the nitrogen flow rates on the chemical composition, microstructure, mechanical property and corrosion behavior in artificial seawater of the CrNx coatings was investigated. The results show that with the increase of the nitrogen flow rates, the growth structure of the coatings varied from dense granular growth to coarse columnar growth. Increasing the nitrogen flow rates was helpful to decrease the Cr/N ratio and induce the phase transforming from mixed hexagonal Cr2N and face-centered cubic CrN to single CrN. However, the coatings under different nitrogen flow rates significantly improved the corrosion resistance and hardness of the steel substrate. Furthermore, at high nitrogen flow rate, the coating had high corrosion velocity and low protective capability against the substrate corrosion due to the fast corrosion channels acted by the columnar grain boundaries. While at the middle nitrogen flow rate, the coating with CrN phase, densely granular growth structure and moderate grain size resulted in excellent corrosion resistance and highest hardness.

scholarly journals Effect of Material and Process Variables on Characteristics of Nitridation-Induced Self-Formed Aluminum Matrix Composites—Part 2: Effect of Nitrogen Flow Rates and Processing Temperatures

Materials ◽  
2020 ◽  
Vol 13 (5) ◽  
pp. 1213
Author(s):  
Dae-Young Kim ◽  
Pil-Ryung Cha ◽  
Ho-Seok Nam ◽  
Hyun-Joo Choi ◽  
Kon-Bae Lee
Keyword(s):  
Matrix Composite ◽  
Flow Rate ◽  
Volume Fraction ◽  
Aluminum Matrix ◽  
Aluminum Matrix Composite ◽  
Aluminum Matrix Composites ◽  
Processing Temperature ◽  
Nitrogen Flow ◽  
Nitrogen Flow Rate ◽  
Flow Rates

The nitridation-induced self-formed aluminum matrix composite (NISFAC) process is based on the nitridation reaction, which can be significantly influenced by the characteristics of the starting materials (e.g., the chemical composition of the aluminum powder and the type, size, and volume fraction of the ceramic reinforcement) and the processing variables (e.g., process temperature and time, and flow rate of nitrogen gas). Since these variables do not independently affect the nitridation behavior, a systematic study is necessary to examine the combined effect of these variables upon nitridation. In this second part of our two-part report, we examine the effect of nitrogen flow rates and processing temperatures upon the degree of nitridation which, in turn, determines the amount of exothermic reaction and the amount of molten Al in the nitridation-induced self-formed aluminum matrix composite (NISFAC) process. When either the nitrogen flow rate or the set temperature was too low, high-quality composites were not obtained because the level of nitridation was insufficient to fill the powder voids with molten Al. Hence, since the filling of the voids in the powder bed by molten Al is essential to the NISFAC process, the conditions should be optimized by manipulating the nitrogen flow rate and processing temperature.

scholarly journals Material Structure and Mechanical Properties of Silicon Nitride and Silicon Oxynitride Thin Films Deposited by Plasma Enhanced Chemical Vapor Deposition

Surfaces ◽  
2018 ◽  
Vol 1 (1) ◽  
pp. 59-72 ◽  
Author(s):  
Zhenghao Gan ◽  
Changzheng Wang ◽  
Zhong Chen
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Fracture Toughness ◽  
Silicon Nitride ◽  
Flow Rate ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
Silicon Oxynitride ◽  
Flow Rates ◽  
Silicon Nitride Films

Silicon nitride and silicon oxynitride thin films are widely used in microelectronic fabrication and microelectromechanical systems (MEMS). Their mechanical properties are important for MEMS structures; however, these properties are rarely reported, particularly the fracture toughness of these films. In this study, silicon nitride and silicon oxynitride thin films were deposited by plasma enhanced chemical vapor deposition (PECVD) under different silane flow rates. The silicon nitride films consisted of mixed amorphous and crystalline Si3N4 phases under the range of silane flow rates investigated in the current study, while the crystallinity increased with silane flow rate in the silicon oxynitride films. The Young’s modulus and hardness of silicon nitride films decreased with increasing silane flow rate. However, for silicon oxynitride films, Young’s modulus decreased slightly with increasing silane flow rate, and the hardness increased considerably due to the formation of a crystalline silicon nitride phase at the high flow rate. Overall, the hardness, Young modulus, and fracture toughness of the silicon nitride films were greater than the ones of silicon oxynitride films, and the main reason lies with the phase composition: the SiNx films were composed of a crystalline Si3N4 phase, while the SiOxNy films were dominated by amorphous Si–O phases. Based on the overall mechanical properties, PECVD silicon nitride films are preferred for structural applications in MEMS devices.

Influence of the nitrogen flow rate on the order and structure of PECVD boron nitride thin films

2009 ◽  
Vol 355 (31-33) ◽  
pp. 1622-1629 ◽  
Author(s):  
M. Anutgan ◽  
T. Aliyeva Anutgan ◽  
E. Ozkol ◽  
I. Atilgan ◽  
B. Katircioglu
Keyword(s):  
Thin Films ◽  
Boron Nitride ◽  
Flow Rate ◽  
Nitrogen Flow ◽  
Nitrogen Flow Rate
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