Deposition of a-Si Films Using Silane Molecular Beams Excited by Heated Wire and ArF Laser

1986 ◽  
Vol 75 ◽  
Author(s):  
M. Hanabusa ◽  
T. Tsuboi ◽  
T. Sato ◽  
S. Furuno ◽  
S. Iguchi ◽  
...  

AbstractAmorphous silicon films were deposited by using silane molecular beams excited either by ArF laser beams or heated tungsten wires. Reaction mechanisms are discussed on the basis of the dependence of deposition rates on substrate temperature and, in the case of the heated-wire method, on wire temperature.

2002 ◽  
Vol 715 ◽  
Author(s):  
R. E. I. Schropp ◽  
Y. Xu ◽  
E. Iwaniczko ◽  
G. A. Zaharias ◽  
A. H. Mahan

AbstractWe have explored which deposition parameters in Hot Wire CVD have the largest impact on the quality of microcrystalline silicon (μc-Si) made at deposition rates (Rd) < 10 Å/s for use in thin film solar cells. Among all parameters, the filament temperature (Tfil) appears to be crucial for making device quality films. Using two filaments and a filament-substrate spacing of 3.2 cm, μc-Si films, using seed layers, can be deposited at high Tfil (∼2000°C) with a crystalline volume fraction < 70-80 % at Rd's < 30 Å/s. Although the photoresponse of these layers is high (< 100), they appear not to be suitable for incorporation into solar cells, due to their porous nature. n-i-p cells fabricated on stainless steel with these i-layers suffer from large resistive effects or barriers, most likely due to the oxidation of interconnected pores in the silicon layer. The porosity is evident from FTIR measurements showing a large oxygen concentration at ∼1050 cm-1, and is correlated with the 2100 cm-1 signature of most of the Si-H stretching bonds. Using a Tfil of 1750°C, however, the films are more compact, as seen from the absence of the 2100 cm-1 SiH mode and the disappearance of the FTIR Si-O signal, while the high crystalline volume fraction (< 70-80 %) is maintained. Using this Tfil and a substrate temperature of 400°C, we obtain an efficiency of 4.9 % for cells with a Ag/ZnO back reflector, with an i-layer thickness of only ∼0.7 μm. High values for the quantum efficiency extend to very long wavelengths, with values of 33 % at 800 nm and 15 % at 900 nm, which are unequalled by a-SiGe:H alloys. Further, by varying the substrate temperature to enable deposition near the microcrystalline to amorphous transition (‘edge’) and incorporating variations in H2 dilution during deposition of the bulk, efficiencies of 6.0 % have been obtained. The Rd's of these i-layers are 8-10 Å/s, and are the highest to date obtained with HWCVD for microcrystalline layers used in cells with efficiencies of ∼6 %.


1991 ◽  
Vol 220 ◽  
Author(s):  
Tatsuo Yoshinobu ◽  
Takashi Fuyuki ◽  
Hiroyuki Matsunami

ABSTRACTCarbonization dynamics of Si surfaces using a hydrocarbon gas molecular beam was investigated. In case of carbonizing atomically clean Si surfaces with C2H2, single crystalline 3C-SiC layers were obtained only In the narrow range of a substrate temperature near 780 °C. Control of surface reaction by a cap of very thin surface oxide layer and gradual increase of substrate temperature during carbonization were found to be effective in forming single crystalline 3C-SiC layers reproducibly.


1998 ◽  
Vol 55 (1-2) ◽  
pp. 143-152 ◽  
Author(s):  
Ahalapitiya Hewage Jayatissa ◽  
Fumio Sato ◽  
Nobuo Saito ◽  
Hiroyuki Ohnishi ◽  
Kuniharu Takizawa ◽  
...  

2004 ◽  
Vol 808 ◽  
Author(s):  
Maruf Hossain ◽  
Husam Abu-Safe ◽  
Marwan Barghouti ◽  
Hameed Naseem ◽  
William D. Brown

ABSTRACTThe effect of substrate temperature and interface oxide layer on aluminum induced crystallization (AIC) of amorphous silicon (a-Si) is investigated. The effect of substrate temperature on the AIC process was studied by changing the deposition temperate of a-Si from 200 to 300°C in a Al/a-Si/glass configuration. To study the effect of interface oxide on AIC, samples with a-Si/Al/glass, a-Si/Al-oxide/Al/glass, and Al/Si-oxide/a-Si/glass configurations were prepared at a fixed substrate temperature. The samples were annealed in the temperature range from 300°C to 525°C for different periods of time. The X-ray diffraction (XRD) patterns confirmed the crystallization of the a-Si films in the various configurations. From the analysis, we report that crystallization of a-Si happen at 350°C annealing temperature in the Al/a-Si/glass configuration. However, with or without the presence of Si-oxide at the interface, crystallization saturated after annealing for 20 minutes at 400°C. On the other hand, when Al-oxide is present at the interface, higher annealing temperatures and longer annealing times are required to saturate the crystallization of a-Si. Environmental Scanning Electron Microscope (ESEM) and Energy Dispersive X-Ray (EDX) mapping were used to study the surface morphology as well as the layer sequence after crystallization. This analysis revealed that Si-Al layer-exchange happens regardless of the deposited film configuration.


1982 ◽  
Vol 18 (6) ◽  
pp. 1580-1582 ◽  
Author(s):  
N. Terada ◽  
Y. Hoshi ◽  
M. Naoe ◽  
S. Yamanaka

2000 ◽  
Vol 609 ◽  
Author(s):  
W.M.M. Kessels ◽  
A.H.M. Smets ◽  
J.P.M. Hoefnagels ◽  
M.G.H. Boogaarts ◽  
D.C. Schram ◽  
...  

ABSTRACTFrom investigations on the SiH3 and SiH radical density and the surface reaction probability in a remote Ar-H2-SiH4 plasma, it is unambiguously demonstrated that the a-Si:H film quality improves significantly with increasing contribution of SiH3 and decreasing contribution of very reactive (poly)silane radicals. Device quality a-Si:H is obtained at deposition rates up to 100 Å/s for conditions where film growth is governed by SiH3 (contribution ∼90%) and where SiH has only a minor contribution (∼2%). Furthermore, for SiH3 dominated film growth the effect of the deposition rate on the a-Si:H film properties with respect to the substrate temperature is discussed.


1995 ◽  
Vol 397 ◽  
Author(s):  
H. Jin Song ◽  
James S. Im

ABSTRACTBased on the artificially controlled super-lateral growth approach, we have developed a novel excimer-laser-based high-substrate-temperature method for producing single-crystal Si islands on SiO2. By irradiating a photolithographically preconfigured sample, complete melting of an Si film is induced only at precisely predesignated locations within patterned and physically isolated islands. An intentionally incompletely melted section within each island initiates lateral growth of crystalline grains. A “bottleneck” portion of the island permits only one of the laterally growing grains to propagate into the main portion of the island. The low nucleation-to-growth-rate ratios that are attainable with high substrate temperatures (1000–1200 °C) can lead to nearly unlimited lateral growth distances; with a proper combination of the substrate temperature and the island dimension, the main area of an island—up to 50×50 μm2 in area—is readily converted into a large single-crystal region.


2017 ◽  
Vol 895 ◽  
pp. 28-32 ◽  
Author(s):  
Hua Cheng ◽  
Di Wang ◽  
Feng Li Li

Micro-Si films were deposited using Ar diluted SiH4 gaseous mixture by electron cyclotron resonance plasma-enhanced chemical vapor deposition (ECR-PECVD). The effects of the substrate temperature on microstructure and electrical conductivity of micro-Si film were investigated. The results show that, with the increasing of substrate temperature, crystallinity and grain size increased monotonously, of which a competing balance would determine the electrical conductivity of micro-Si films. Based on these results, relatively small grain size and appropriate crystallinity would be beneficial to improve the electrical properties of micro-Si films.


Vacuum ◽  
1992 ◽  
Vol 43 (11) ◽  
pp. 1079-1081
Author(s):  
YH Shen ◽  
ZJ Xing

1993 ◽  
Vol 320 ◽  
Author(s):  
Kyung-Ho Park ◽  
Y. Kumagai ◽  
F. Hasegawa

ABSTRACTMicro structures and interface structures of epitaxially grown PtSi and over-capping Si films on Si(111) substrates prepared by MBE were studied by RHEED, HREM, SEM and XRD. An epitaxially grown Si layer on the PtSi layer, which was fabricated by coevaporation of Pt and Si with the stoichiometric ratio (Pt/Si=l/1), was obtained as a Si(111)/PtSi(010)/Si(111) double heterostructure at the substrate temperature of 400°C. On the other hand, it was found that the PtSi layer transformed into epitaxial columns and/or walls when a Si over-capping layer was grown on the PtSi layer at a substrate temperature of 600°C or higher. These columns and/or walls were surrounded by a Si matrix which showed epitaxial relations to the Si substrate with stacking faults.


Sign in / Sign up

Export Citation Format

Share Document