An Optical Diffraction Microphone with Active Grating Diaphragm

2005 ◽  
Vol 872 ◽  
Author(s):  
Kazuhiro Suzuki ◽  
Hideyuki Funaki ◽  
Yujiro Naruse
Keyword(s):  
Electrostatic Force ◽  
Complementary Metal Oxide Semiconductor ◽  
Metal Oxide Semiconductor ◽  
Optical Diffraction ◽  
Oxide Semiconductor ◽  
Cmos Process ◽  
Sound Waves ◽  
Micro Electro Mechanical Systems ◽  
Light Waves ◽  
Arbitrary Frequency

AbstractWe present a new conceptual active optical microphone based on complementary metal-oxide semiconductor (CMOS) - micro electro mechanical systems (MEMS) micromachining techniques. The diaphragm of the microphone has a diffracting grating fabricated by the CMOS process with only a small number of post-processes. The active microphone actuates the diaphragm on an arbitrary frequency by electrostatic force, and detects sound waves by the light waves. From the verification experiment result, this active microphone was able to perform advanced functions, such as the amplifier effect and the detection of phase information of sound waves.

scholarly journals Universal Filter Based on Compact CMOS Structure of VDDDA

Sensors ◽  
2021 ◽  
Vol 21 (5) ◽  
pp. 1683
Author(s):  
Winai Jaikla ◽  
Fabian Khateb ◽  
Tomasz Kulej ◽  
Koson Pitaksuttayaprot
Keyword(s):  
Metal Oxide ◽  
Dynamic Range ◽  
Complementary Metal Oxide Semiconductor ◽  
Metal Oxide Semiconductor ◽  
Experimental Results ◽  
Oxide Semiconductor ◽  
Cmos Process ◽  
Voltage Gain ◽  
Universal Filter ◽  
Mos Transistor

This paper proposes the simulated and experimental results of a universal filter using the voltage differencing differential difference amplifier (VDDDA). Unlike the previous complementary metal oxide semiconductor (CMOS) structures of VDDDA that is present in the literature, the present one is compact and simple, owing to the employment of the multiple-input metal oxide semiconductor (MOS) transistor technique. The presented filter employs two VDDDAs, one resistor and two grounded capacitors, and it offers low-pass: LP, band-pass: BP, band-reject: BR, high-pass: HP and all-pass: AP responses with a unity passband voltage gain. The proposed universal voltage mode filter has high input impedances and low output impedance. The natural frequency and bandwidth are orthogonally controlled by using separated transconductance without affecting the passband voltage gain. For a BP filter, the root mean square (RMS) of the equivalent output noise is 46 µV, and the third intermodulation distortion (IMD3) is −49.5 dB for an input signal with a peak-to peak of 600 mV, which results in a dynamic range (DR) of 73.2 dB. The filter was designed and simulated in the Cadence environment using a 0.18-µm CMOS process from Taiwan semiconductor manufacturing company (TSMC). In addition, the experimental results were obtained by using the available commercial components LM13700 and AD830. The simulation results are in agreement with the experimental one that confirmed the advantages of the filter.

Millimeter-wave dual-mode and dual-band switchable Gilbert up-conversion mixer in 65-nm CMOS process

2021 ◽  
pp. 1-5
Author(s):  
Fang Zhu ◽  
Guo Qing Luo
Keyword(s):  
Millimeter Wave ◽  
Complementary Metal Oxide Semiconductor ◽  
Local Oscillator ◽  
Metal Oxide Semiconductor ◽  
Oxide Semiconductor ◽  
Dual Band ◽  
Cmos Process ◽  
Pumping Power ◽  
Dual Mode ◽  
Dc Power

Abstract In this paper, a millimeter-wave (MMW) dual-mode and dual-band switchable Gilbert up-conversion mixer in a commercial 65-nm complementary metal oxide semiconductor (CMOS) process is presented. By simply changing the bias, the proposed CMOS Gilbert up-conversion mixer can be switched between subharmonic and fundamental operation modes for MMW dual-band applications. With a low local oscillator pumping power of 3 dBm and low dc power consumption of 6 mW, the proposed CMOS Gilbert up-conversion mixer exhibits a measured conversion gain of −0.5 ± 1.5 dB from 37 to 50 GHz and 2.5 ± 1.5 dB from 17.5 to 32 GHz for the subharmonic and fundamental modes, respectively.

scholarly journals A Regulated Temperature-Insensitive High-Voltage Charge Pump in Standard CMOS Process for Micromachined Gyroscopes

Sensors ◽  
2019 ◽  
Vol 19 (19) ◽  
pp. 4149
Author(s):  
Xiang Li ◽  
Rui Li ◽  
Chunge Ju ◽  
Bo Hou ◽  
Qi Wei ◽  
...  
Keyword(s):  
Metal Oxide ◽  
High Voltage ◽  
Output Voltage ◽  
Charge Pump ◽  
Complementary Metal Oxide Semiconductor ◽  
Metal Oxide Semiconductor ◽  
Oxide Semiconductor ◽  
Cmos Process ◽  
Temperature Changes ◽  
Adjustable Range

Micromachined gyroscopes require high voltage (HV) for actuation and detection to improve its precision, but the deviation of the HV caused by temperature fluctuations will degrade the sensor’s performance. In this paper, a high-voltage temperature-insensitive charge pump is proposed. Without adopting BCD (bipolar-CMOS-DMOS) technology, the output voltage can be boosted over the breakdown voltage of n-well/substrate diode using triple-well NMOS (n-type metal-oxide-semiconductor) transistors. By controlling the pumping clock’s amplitude continuously, closed-loop regulation is realized to reduce the output voltage’s sensitivity to temperature changes. Besides, the output level is programmable linearly in a large range by changing the reference voltage. The whole circuit has been fabricated in a 0.18- μ m standard CMOS (complementary metal-oxide-semiconductor) process with a total area of 2.53 mm 2 . Measurements indicate that its output voltage has a linear adjustable range from around 13 V to 16.95 V, and temperature tests show that the maximum variations of the output voltage at − 40 ∼ 80 ∘ C are less than 1.1%.

scholarly journals Magnetic Micro Sensors with Two Magnetic Field Effect Transistors Fabricated Using the Commercial Complementary Metal Oxide Semiconductor Process

Sensors ◽  
2020 ◽  
Vol 20 (17) ◽  
pp. 4731
Author(s):  
Wei-Ren Chen ◽  
Yao-Chuan Tsai ◽  
Po-Jen Shih ◽  
Cheng-Chih Hsu ◽  
Ching-Liang Dai
Keyword(s):  
Magnetic Field ◽  
Metal Oxide ◽  
Field Effect ◽  
Field Effect Transistors ◽  
Magnetic Field Effect ◽  
Complementary Metal Oxide Semiconductor ◽  
Metal Oxide Semiconductor ◽  
Oxide Semiconductor ◽  
Cmos Process ◽  
Micro Sensor

The fabrication and characterization of a magnetic micro sensor (MMS) with two magnetic field effect transistors (MAGFETs) based on the commercial complementary metal oxide semiconductor (CMOS) process are investigated. The magnetic micro sensor is a three-axis sensing type. The structure of the magnetic microsensor is composed of an x/y-MAGFET and a z-MAGFET. The x/y-MAGFET is employed to sense the magnetic field (MF) in the x- and y-axis, and the z-MAGFET is used to detect the MF in the z-axis. To increase the sensitivity of the magnetic microsensor, gates are introduced into the two MAGFETs. The sensing current of the MAGFET enhances when a bias voltage is applied to the gates. The finite element method software Sentaurus TCAD was used to analyze the MMS’s performance. Experiments show that the MMS has a sensitivity of 182 mV/T in the x-axis MF and a sensitivity of 180 mV/T in the y-axis MF. The sensitivity of the MMS is 27.8 mV/T in the z-axis MF.

A Novel Maskless Post-CMOS Bulk Micromachining Process

2003 ◽  
Author(s):  
Jing-Hung Chiou ◽  
Ching-Liang Dai ◽  
Jen-Yi Chen ◽  
Michael S.-C. Lu
Keyword(s):  
Metal Oxide ◽  
Silicon Substrate ◽  
Complementary Metal Oxide Semiconductor ◽  
Metal Oxide Semiconductor ◽  
Wet Etching ◽  
Oxide Semiconductor ◽  
Cmos Process ◽  
Deep Cavity ◽  
Deep Cavities ◽  
Tmah Solution

This work describes a new post-CMOS (Complementary Metal Oxide Semiconductor) bulk micromachining process for fabrication of various microstructures. The important feature of the post-CMOS process is the use of wet etching without an addition mask, to form various microstructures and deep cavities in the silicon substrate. The post-CMOS process starts with wet etching to remove sacrificial layers, which are stacked layers of metals and vias, to expose the silicon substrate. Then, KOH or TMAH solution is employed to etch the silicon substrate to form various deep cavities and suspended structures. Many suspended structures, which include beams, bridges and plates, are fabricated using the standard 0.35-μm SPFM (Single Polysilicon Four Metal) CMOS process and the post-CMOS process. Experimental results reveals that a plate with an area of 200×200 μm2, a bridge with a length of 300μm, and various beams with lengths from 100-μm to 400-μm suspended on a deep cavity were fabricated successfully.

An Actuator for Controlling the Area of Dielectric Layer of the Tunable Capacitor by Commercial CMOS Fabrication

2003 ◽  
Author(s):  
Jing-Hung Chiou ◽  
Ran-Jin Lin ◽  
Ching-Liang Dai ◽  
Kai-Hsiang Yen ◽  
Yu-Ching Shih ◽  
...  
Keyword(s):  
Cantilever Beam ◽  
Dielectric Layer ◽  
Electrostatic Force ◽  
Complementary Metal Oxide Semiconductor ◽  
Beam Width ◽  
Oxide Semiconductor ◽  
Cmos Process ◽  
Fixed Plate ◽  
Tunable Capacitor ◽  
Post Process

This study describes the fabrication of an actuator of controlling the area of a dielectric layer using the commercial 0.35μm Single Polysilicon Four Metals (SPFM) Complementary Metal Oxide Semiconductor (CMOS) process and a post-process. The post-process requires wet and dry etching without using a mask to etch sacrificial layers and release the structures suspended in the actuator. The actuator is composed of a top suspended plate, a bottom fixed plate, and a laterally yielding cantilever beam, and two fixed curved electrodes. One end of the cantilever beam is anchored whereas the other end is connected to the suspended plate. The fixed curved electrodes and the cantilever beam are stacked layers of metals and via layers, formed by the CMOS process. The cantilever beam is deflected over a large distance using electrostatic force and the suspended plate swings laterally to increase or decrease the area of overlap between itself and the bottom fixed plate. The dimensions of the actuator are: suspended plate diameter = 100 μm; cantilever beam width = 2 μm, height = 6 μm, and length = 300 μm. The moved end of the cantilever beam, connected to the suspended plate, is deflected by 25 μm when a dc power supply of 60V is applied to it.

Fabrication of microbridges in standard complementary metal oxide semiconductor technology

1989 ◽  
Vol 67 (4) ◽  
pp. 184-189 ◽  
Author(s):  
M. Parameswaran ◽  
Lj. Ristic ◽  
A. C. Dhaded ◽  
H. P. Baltes ◽  
W. Allegretto ◽  
...  
Keyword(s):  
Metal Oxide ◽  
Integrated Circuit ◽  
Complementary Metal Oxide Semiconductor ◽  
Cmos Technology ◽  
Layout Design ◽  
Metal Oxide Semiconductor ◽  
Oxide Semiconductor ◽  
Cmos Process ◽  
Digital Cmos ◽  
Sensor Applications

Complementary metal oxide semiconductor (CMOS) technology is one of the leading fabrication technologies of the semiconductor integrated-circuit industry. We have discovered features inherent in the standard CMOS fabrication process that lend themselves to the manufacturing of micromechanical structures for sensor applications. In this paper we present an unconventional layout design methodology that allows us to exploit the standard CMOS process for producing microbridges. Two types of microbridges, bare polysilicon microbridges and sandwiched oxide microbridges, have been manufactured by first implementing a special layout design in an industrial digital CMOS process, followed by a postprocessing etching step.

scholarly journals MPPT Circuit Using Time Exponential Rate Perturbation and Observation for Enhanced Tracking Efficiency for a Wide Resistance Range of Thermoelectric Generator

2021 ◽  
Vol 11 (10) ◽  
pp. 4650
Author(s):  
Jie Miao ◽  
Houpeng Chen ◽  
Yu Lei ◽  
Yi Lv ◽  
Weili Liu ◽  
...  
Keyword(s):  
Metal Oxide ◽  
Thermoelectric Generator ◽  
Complementary Metal Oxide Semiconductor ◽  
Metal Oxide Semiconductor ◽  
Maximum Power ◽  
Oxide Semiconductor ◽  
Cmos Process ◽  
Exponential Rate ◽  
Point Tracking ◽  
High Level

The thermoelectric generator (TEG) stands out among many energy harvesters due to its simple structure, small size, rich thermal energy, and the absence of pollution and noise. However, previous studies have rarely probed into the influence of TEG internal resistances on extracting maximum power from TEGs, and the tracking of efficiency is limited. By analyzing the relationship between the tracking efficiency and the TEG internal resistances, a time exponential rate perturbation and observation (P&O) technology is proposed to achieve maximum power point tracking (MPPT) for a wide resistance range of the TEG. Using the time exponential rate P&O, the MPPT circuit observed the power change by comparing the positive-channel metal-oxide semiconductor (PMOS) on-time and perturbs the power by adjusting the negative-channel metal-oxide semiconductor (NMOS) on-time exponentially. The MPPT circuit was implemented in a 110 nm complementary metal-oxide semiconductor (CMOS) process. The tracking efficiency maintained a high level from 98.9 to 99.5%. The applicable range of the TEG resistance was from 1 to 12 Ω, which reflects an enhancement of at least 2.2 times.

scholarly journals Improving the Performance of the ToGoFET Probe: Advances in Design, Fabrication, and Signal Processing

Micromachines ◽  
2021 ◽  
Vol 12 (11) ◽  
pp. 1303
Author(s):  
Hoontaek Lee ◽  
Junsoo Kim ◽  
Kumjae Shin ◽  
Wonkyu Moon
Keyword(s):  
Signal Processing ◽  
Metal Oxide ◽  
Field Effect ◽  
Field Effect Transistor ◽  
Complementary Metal Oxide Semiconductor ◽  
Drain Current ◽  
Metal Oxide Semiconductor ◽  
Oxide Semiconductor ◽  
Cmos Process ◽  
Effect Transistor

We report recent improvements of the tip-on-gate of field-effect-transistor (ToGoFET) probe used for capacitive measurement. Probe structure, fabrication, and signal processing were modified. The inbuilt metal-oxide-semiconductor field-effect-transistor (MOSFET) was redesigned to ensure reliable probe operation. Fabrication was based on the standard complementary metal-oxide-semiconductor (CMOS) process, and trench formation and the channel definition were modified. Demodulation of the amplitude-modulated drain current was varied, enhancing the signal-to-noise ratio. The - characteristics of the inbuilt MOSFET reflect the design and fabrication modifications, and measurement of a buried electrode revealed improved ToGoFET imaging performance. The minimum measurable value was enhanced 20-fold.

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