scholarly journals Polishing Characteristics and Mechanism of Polishing Glass Substrate Using Suede Pad with Fine Micrometer-Sized Pores

2022 ◽  
Vol 16 (1) ◽  
pp. 52-59
Author(s):  
Michio Uneda ◽  
Nodoka Yamada ◽  
Yoshihiro Tawara ◽  
◽  
Keyword(s):  
Surface Roughness ◽  
Friction Coefficient ◽  
Chemical Mechanical Polishing ◽  
Glass Substrate ◽  
Removal Rate ◽  
Thickness Direction ◽  
Glass Substrates ◽  
Pad Conditioning ◽  
The Relationship ◽  
Effect Of Surface

Chemical mechanical polishing (CMP) using a suede polishing pad is an essential fabrication process for glass substrates that require ultra-high planarization. However, the effect of surface asperities of the suede pad on its polishing characteristics is not completely understood because the structure of the suede pad in the thickness direction is not constant, and its surface asperities can easily change during the pad conditioning or marathon polishing processes. In addition, many previous studies have discussed the polishing mechanism using a suede pad; however, these studies used suede pads with a pore size of approximately 100 μm. This paper discusses the polishing characteristics of a suede pad with fine micrometer-sized pores by clarifying the relationships between the removal rate, friction coefficient, pore parameters, and roughness as the pad surface asperities. In this study, a series of marathon polishing tests were performed with and without conditioning. It was discovered that the removal rate was affected not only by the pore parameters but also by the surface roughness of the suede pad with fine pores. The relationship between the removal rate and the friction coefficient changed owing to the influence of pad conditioning, and this change is significant when the break-in conditioning time is short.

Study on Surface Roughness Based on Dynamic Minimum Thickness of Cut

2011 ◽  
Vol 88-89 ◽  
pp. 34-37
Author(s):  
Kuai Ji Cai
Keyword(s):  
Surface Roughness ◽  
Friction Coefficient ◽  
Atomic Force Microscope ◽  
Surface Quality ◽  
Experimental Verification ◽  
Cutting Parameters ◽  
Minimum Thickness ◽  
Atomic Force ◽  
Relationship Of ◽  
The Relationship

The relationship of the friction coefficient and the MTC were discussed, and the MTC and its effects on surface roughness were a theoretical analysised and experimental verification by AFM (atomic force microscope). The results show that the theoretical MTC tends to be minimal value then before the adhering effect to reach remarkable. Appropriate adjustments cutting parameters, the cutting process can always micro-cutting phase to reach the steady-thin chip, and no plowing phenomenon. So the surface residues highly were reduced and higher surface quality was achieved.

scholarly journals Stiffness Calculation Method and Stiffness Characteristic Analysis of Bolted Connectors

2019 ◽  
Vol 2019 ◽  
pp. 1-11 ◽  
Author(s):  
Shi-kun Lu ◽  
Deng-xin Hua ◽  
Yan Li ◽  
Fang-yuan Cui ◽  
Peng-yang Li
Keyword(s):  
Surface Roughness ◽  
Bolted Joints ◽  
Joint Surface ◽  
Characteristic Analysis ◽  
Surface Stiffness ◽  
Stiffness Characteristic ◽  
Calculation Results ◽  
Bolt Connection ◽  
The Relationship ◽  
Effect Of Surface

At present, few scholars have studied the effect of surface roughness on assembly stiffness. The influence of the joint surface stiffness on the overall stiffness is neglected. In this paper, a new method for calculating the stiffness of bolted joints is presented. The effect of joint surface stiffness on the overall stiffness is considered. Firstly, the relationship between load and displacement between cylinder and cylinder (including the joint surface with certain roughness) is studied, and the stiffness characteristic expression of the joint surface is obtained; the results are compared with the traditional stiffness calculation theory, and then, the influence of bolt connection surface on bolt connection is studied and compared with the stiffness calculation results of traditional bolt connection. The results show that the theoretical model presented in this paper is more practical.

A Novel Tape and Diamond Process Developed for Polishing Hard Substrates

2015 ◽  
Vol 656-657 ◽  
pp. 416-421
Author(s):  
Rong Hwei Yeh ◽  
T.M. Chao ◽  
Cheng Kuo Lee ◽  
A.H. Tan
Keyword(s):  
Surface Roughness ◽  
Removal Rate ◽  
Lower Surface ◽  
Polished Surface ◽  
Closed Chamber ◽  
Glass Substrates ◽  
Nominal Size ◽  
Hard Glass ◽  
High Removal Rate ◽  
Diamond Abrasive

A nanoscale polish process with improved desired characteristics of low roughness and low scratch counts has been developed using a novel polish tape and diamond abrasive on hard glass substrates. For an improved polishing performance with high removal rate properties and preventing scratches, a novel tape was developed having a nanofiber level, densified surface and a flatter surface by slenderizing the fiber and dispersing ultrafine fiber using an innovative technique. Using this novel polishing tape with a fiber size of 200nm, one can produce a 17% lower surface roughness (Ra) (from 1.05A to 0.87A) and a reduced polished surface scratch count of 53 reduced to 18. The novel nanocluster diamond abrasive is synthesized from carbon atoms of explosives created by detonation in a closed chamber under an oxygen leaked atmosphere ambient. Several crystals are bonded together by layers of non-diamond carbon and other elements, forming aggregates with a nanocluster structure. Using this novel nanocluster diamond along with an ultra-fine diamond mixture with a nominal size of 15nm, one is able to produce an improvement of a 48% lower surface roughness Ra (from 0.87A to 0.45A) and a lower polishing surface scratch count reduced from 18 to 7. Overall, these results indicate that a smoother and a reduced scratch polished substrate results in a significant improvement in disk defects and related magnetic performances.

Study on Chemical Mechanical Polishing Parameters of 6H-SiC Crystal Substrate Based on Diamond Abrasive

2013 ◽  
Vol 797 ◽  
pp. 261-265 ◽  
Author(s):  
Jian Xiu Su ◽  
Zhu Qing Zhang ◽  
Jian Guo Yao ◽  
Li Jie Ma ◽  
Qi Gao Feng
Keyword(s):  
Surface Roughness ◽  
Material Removal Rate ◽  
Chemical Mechanical Polishing ◽  
Material Removal ◽  
Removal Rate ◽  
Rotational Velocity ◽  
Crystal Substrate ◽  
Polishing Pressure ◽  
Diamond Abrasive ◽  
Abrasive Size

In this paper, according to the slurry ingredients obtained by former research, the influences of the chemical mechanical polishing (CMP) process parameters, such as the rotational velocity of the platen and the carrier, the polishing pressure and the abrasive size on the material removal rate (MRR) and surface roughness Ra have been studied in CMP SiC crystal substrate (0001) C and (0001) Si surface based on the diamond abrasive. The research results show that the material removal rate changes with the change of the abrasive size, the rotational velocity of the platen and the polishing pressure significantly, but the maximum of MRR can be obtained at a certain rotational velocity of platen, abrasive size and polishing pressure. The influence of the abrasive size, the platen velocity, the carrier velocity and the polishing pressure on surface roughness is no significant. Under the same conditions, the MRR of CMP the Si surface is larger than that of the C surface. This study results will provide the reference for optimizing the process parameters and researching the material removal mechanism in CMP SiC crystal substrate.

Effects of Conditioning Parameters on Pad Performances

2008 ◽  
Vol 375-376 ◽  
pp. 293-297
Author(s):  
Xin Wei ◽  
Hui Yuan ◽  
Wei Xiong ◽  
Xiao Zhu Xie
Keyword(s):  
Surface Roughness ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Pad Conditioning

This paper studied the effects of the off-process conditioning parameters on the pad performances. The pad conditioning was evaluated based on the measurement of pad removal rate, the observation of the conditioned pad surface. The performances of conditioned pads were evaluated also by the material removal rate (MRR) and the surface roughness of polished wafers in the CMP experiments of LiTaO3 crystal wafers.

Study on the Development of Resource-Saving High Performance Slurry - Polishing/CMP for Glass Substrates in a Radical Polishing Environment, Using Manganese Oxide Slurry as an Alternative for Ceria Slurry

2010 ◽  
Vol 64 ◽  
pp. 65-70 ◽  
Author(s):  
Toshiro K. Doi ◽  
Tsutomu Yamazaki ◽  
Syuhei Kurokawa ◽  
Yoji Umezaki ◽  
Osamu Ohnishi ◽  
...  
Keyword(s):  
Manganese Oxide ◽  
Chemical Mechanical Polishing ◽  
High Performance ◽  
Removal Rate ◽  
Comparison Study ◽  
Resource Saving ◽  
Glass Substrates ◽  
Closed Type ◽  
Quality Surface ◽  
Better Than

While investigating polishing mechanism of glass substrates with ceria abrasives (CeO2), we found its oxidizing properties worked effectively for the polishing. This finding has inspired us to speculate about the possibility of the manganese oxide abrasives as an alternative for ceria as they also have oxidizing properties. Therefore, focusing on the valence of the manganese, we have experimentally manufactured MnO, MnO2, Mn2O3 and Mn3O4 abrasives, and conducted a comparison study of the characteristics obtained with ceria slurry and manganese oxide slurries. As a result, the surface roughness of below Ra 0.8nm obtained with Mn2O3 slurry was found better than that with the conventional ceria slurry, on top of which, its removal rate was as good as or equal to that of ceria. Using a novel, closed type CMP (Chemical Mechanical Polishing) machine, we conducted another glass polishing experiment with ceria and manganese oxide slurries. The inside of the CMP machine was filled with high-pressure gases such as oxygen, air and nitrogen and kept at 500kPa to make the polishing environment radical. Through this experiment, we found an effective polishing method for high-quality surface. The removal rates were several times better than that of the conventional polishing performed in an open CMP machine.

scholarly journals Two-step hybrid process of movable part inside glass substrate using ultrafast laser

2021 ◽  
Vol 9 (1) ◽  
Author(s):  
Jeongtae Kim ◽  
Sung-Il Kim ◽  
Yeun-Ho Joung ◽  
Jiyeon Choi ◽  
Chiwan Koo
Keyword(s):  
Glass Substrate ◽  
Hybrid Process ◽  
Direct Writing ◽  
Microfluidic Mixer ◽  
Glass Substrates ◽  
Potential Applications ◽  
Wet Chemical ◽  
Laser Induced Etching ◽  
Relationship Of ◽  
The Relationship

AbstractWe demonstrate a two-step hybrid process for fabricating movable parts inside glass substrate using the selective laser-induced etching (SLE) process that is consisted of laser-direct writing and wet chemical etching. To obtain an influence by the optical characteristics of a glass substrate when fabricating a 3D microstructure using the SLE, we analyzed the relationship of their dimensions between the designed and the fabricated devices. Two 3D microfluidic devices are designed and fabricated on glass substrates as the demonstrations of the hybrid process: a 3D microfluidic valve device with a movable plug and a 3D microfluidic mixer with a rotatable impeller and multilayer microchannels. The valving plug and the impeller of each device are successfully moved and rotated. The smallest structure is a pillar of the impeller device, and its size is 29 μm (diameter) × 277 μm (height). We expect this study to be extended to potential applications in 3D glass microfabrication and microfluidic systems.

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