scholarly journals A comparative study of hole and electron inversion layer quantization in MOS structures

2010 ◽  
Vol 7 (2) ◽  
pp. 185-193 ◽  
Author(s):  
Amit Chaudhry ◽  
Nath Roy
Keyword(s):  
Charge Density ◽  
Marked Decrease ◽  
Inversion Layer ◽  
Metal Oxide Semiconductor ◽  
Oxide Semiconductor ◽  
Gate Capacitance ◽  
Variation Approach ◽  
Inversion Charge ◽  
Mos Structures ◽  
Good Agreement

In this paper, an analytical model has been developed to study inversion layer quantization in nanoscale Metal Oxide Semiconductor Field Effect Oxide p-(MOSFET). n-MOSFETs have been studied using the variation approach and the p-MOSFETs have been studied using the triangular well approach. The inversion charge density and gate capacitance analysis for both types of transistors has been done. There is a marked decrease in the inversion charge density and the capacitance of the p-MOSFET as compared to n-MOSFETs. The results are compared with the numerical results showing good agreement.

scholarly journals Threshold voltage modeling in (100), (110) and (111) oriented nanoscale MOSFET substrates

2011 ◽  
Vol 8 (2) ◽  
pp. 147-154
Author(s):  
Amit Chaudhry ◽  
Nath Jatindra
Keyword(s):  
Threshold Voltage ◽  
Crystal Orientation ◽  
Field Effect Transistor ◽  
Inversion Layer ◽  
Metal Oxide Semiconductor ◽  
Oxide Semiconductor ◽  
Charge Model ◽  
Inversion Charge ◽  
Effect Transistor ◽  
Good Agreement

An analytical model for the inversion layer quantization for nanoscale - Metal Oxide Semiconductor Field Effect Transistor (MOSFET) with different crystallographic substrate orientations, such as (100), (110) and (111) has been developed. The threshold voltage analysis has been studied using the quantum inversion charge model under three substrate orientations. The results indicate a significant impact of crystal orientation on the threshold voltage and the inversion charge density. The results have also been compared with the numerically reported results and show good agreement.

Simulation of Capacitance-Voltage characteristics of Ultra-thin Metal-Oxide-Semiconductor Structures with Embedded Nanocrystals

2008 ◽  
Vol 1071 ◽  
Author(s):  
Mosur Rahman ◽  
Bo Lojek ◽  
Thottam Kalkur
Keyword(s):  
Metal Oxide ◽  
Threshold Voltage ◽  
Mechanical Model ◽  
Inversion Layer ◽  
Metal Oxide Semiconductor ◽  
Oxide Semiconductor ◽  
Quantum Mechanical ◽  
Layer Width ◽  
Doping Profiles ◽  
Mos Structures

AbstractThis paper presents an approach to model quantum mechanical effects in solid-state devices such as Metal Oxide Semiconductor (MOS) capacitor with and without nanocrystal in the oxide at the device simulation level. This quantum-mechanical model is developed to understand finite inversion layer width and threshold voltage shift. It allows a consistent determination of the physical oxide thickness based on an agreement between the measured and modeled C-V curves. However, as for thinner oxides finite inversion layer width effects become more severe, quantum-mechanical model predicts higher threshold voltage than the classical model. The inversion-layer charge density and MOS capacitance in multidimensional MOS structures are simulated with various substrate doping profiles and gate bias voltages. The effectiveness of the QM correct method for modeling quantum effects in ultrathin oxide MOS structures is also investigated. The CV characteristic is used as a tool to compare results of the QM correction with that of the Schrödinger–Poisson (SP) solution and Classical solution The variation of (different parameters) for various doping profiles at different gate voltages is investigated.

scholarly journals Study of Interface Charge Densities for ZrO2and HfO2Based Metal-Oxide-Semiconductor Devices

2014 ◽  
Vol 2014 ◽  
pp. 1-6 ◽  
Author(s):  
N. P. Maity ◽  
Reshmi Maity ◽  
R. K. Thapa ◽  
S. Baishya
Keyword(s):  
Metal Oxide ◽  
Oxide Thickness ◽  
Metal Oxide Semiconductor ◽  
Oxide Semiconductor ◽  
Charge Densities ◽  
Interface Charge ◽  
Capacitance Voltage ◽  
P Type ◽  
Mos Structures ◽  
Good Agreement

A thickness-dependent interfacial distribution of oxide charges for thin metal oxide semiconductor (MOS) structures using high-kmaterials ZrO2and HfO2has been methodically investigated. The interface charge densities are analyzed using capacitance-voltage (C-V) method and also conductance (G-V) method. It indicates that, by reducing the effective oxide thickness (EOT), the interface charge densities (Dit) increases linearly. For the same EOT,Dithas been found for the materials to be of the order of 1012 cm−2 eV−1and it is originated to be in good agreement with published fabrication results at p-type doping level of1×1017 cm−3. Numerical calculations and solutions are performed by MATLAB and device simulation is done by ATLAS.

scholarly journals Inversion charge density of MOS transistor with generalized logistic functions

2018 ◽  
Vol 50 (2) ◽  
pp. 225-235
Author(s):  
Tijana Kevkic ◽  
Vladica Stojanovic ◽  
Vera Petrovic ◽  
Dragan Randjelovic
Keyword(s):  
Charge Density ◽  
Inversion Layer ◽  
Oxide Thickness ◽  
Oxide Semiconductor ◽  
Smooth Transition ◽  
Smoothing Factor ◽  
Mos Transistor ◽  
Wide Range ◽  
Inversion Charge ◽  
Quantum Mechanical Effects

In this paper, the expression for the charge density in inversion layer at the surface of semiconductor has been improved. The improvement is related to the replacement of an empirical smoothing factor by new one which has generalized logistic (GL) functional form. The introduction of the GL function of the second type in the original interpolating expression leads to continual and smooth transition of the inversion charge density (ICD) between different regions of metal-oxide-semiconductor (MOS) operation. Moreover, in this way any empirical determinations are avoided. The simulated values of the ICD match closely with the numerical results of implicit charge sheet model for a wide range of dopant concentration and oxide thickness. In addition, the proposed GL fitting procedure has been also extended in the case where quantum mechanical effects play important role in inversion mode of scaled MOS devices.

Improving the accuracy of the charge-sheet model for the long-channel metal-oxide semiconductor field-effect transistor

1987 ◽  
Vol 65 (8) ◽  
pp. 995-998
Author(s):  
N. G. Tarr
Keyword(s):  
Metal Oxide ◽  
Field Effect ◽  
Field Effect Transistor ◽  
Inversion Layer ◽  
Potential Drop ◽  
Metal Oxide Semiconductor ◽  
Oxide Semiconductor ◽  
Analytic Approximation ◽  
Effect Transistor ◽  
Long Channel

It is shown that the accuracy of the charge-sheet model for the long-channel metal-oxide-semiconductor field-effect transistor can be improved by allowing for the small potential drop across the inversion layer, and by using a more accurate analytic approximation for the charge stored in the depletion region.

On the methodology of calculating volume charge density in a MIFGMOS substrate using Poisson’s equation

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Francisco Javier Plascencia Jauregui ◽  
Agustín Santiago Medina Vazquez ◽  
Edwin Christian Becerra Alvarez ◽  
José Manuel Arce Zavala ◽  
Sandra Fabiola Flores Ruiz
Keyword(s):  
Metal Oxide ◽  
Charge Density ◽  
Metal Oxide Semiconductor ◽  
Floating Gate ◽  
Poisson’S Equation ◽  
Oxide Semiconductor ◽  
Volume Charge ◽  
Poisson's Equation ◽  
Content Type ◽  
Volume Charge Density

Purpose This study aims to present a mathematical method based on Poisson’s equation to calculate the voltage and volume charge density formed in the substrate under the floating gate area of a multiple-input floating-gate metal-oxide semiconductor metal-oxide semiconductor (MOS) transistor. Design/methodology/approach Based on this method, the authors calculate electric fields and electric potentials from the charges generated when voltages are applied to the control gates (CG). This technique allows us to consider cases when the floating gate has any trapped charge generated during the manufacturing process. Moreover, the authors introduce a mathematical function to describe the potential behavior through the substrate. From the resultant electric field, the authors compute the volume charge density at different depths. Findings The authors generate some three-dimensional graphics to show the volume charge density behavior, which allows us to predict regions in which the volume charge density tends to increase. This will be determined by the voltages on terminals, which reveal the relationship between CG and volume charge density and will allow us to analyze some superior-order phenomena. Originality/value The procedure presented here and based on coordinates has not been reported before, and it is an aid to generate a model of the device and to build simulation tools in an analog design environment.

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