scholarly journals Performance improvement of an industrial control enclosure cooling system

2021 ◽  
pp. 177-177
Author(s):  
Wei-Ming Chiang ◽  
Fu-Jen Wang ◽  
K Kusnandar
Keyword(s):  
Heat Dissipation ◽  
Cfd Simulation ◽  
Cooling System ◽  
Flow Distribution ◽  
Field Measurements ◽  
Critical Issue ◽  
Industrial Control ◽  
Cooling Systems ◽  
Auxiliary Circulation ◽  
Air Vent

Following the trend of high-accuracy machining, thermal management of industrial control enclosures become a critical issue. Therefore, a well-designed enclosure cooling system is essential to manage the heat generation inside the enclosure. In this study, to improve the performance of cooling system and the air flow distribution inside the enclosure, computational fluid dynamics (CFD) simulation has been used to evaluate the application of using the auxiliary circulation fan and air baffler. Furthermore, this study also investigates the layout design for both supply air vent and return air vent arrangement by two types of commercialized cooling systems through field measurements. The simulation results show the short circulation of airflow is improved when the air baffler is installed. It also shows that the auxiliary circulation fan is suggested. Besides, air baffler is used to enhance the temperature distribution. The experimental results reveal the upper supply vent arrangement will cause the short circulation of airflow slightly. And, the auxiliary circulation fans can improve the heat dissipation of cooling systems. There is no short circulation of airflow for the lower supply vent arrangement, but the supply air cannot be distributed smoothly by the auxiliary circulation fans because the shape of the air baffler is not properly designed.

Network modelling of dry-type transformer cooling systems

2018 ◽  
Vol 37 (3) ◽  
pp. 1039-1053 ◽  
Author(s):  
Andrea Cremasco ◽  
Wei Wu ◽  
Andreas Blaszczyk ◽  
Bogdan Cranganu-Cretu
Keyword(s):  
Network Model ◽  
Thermal Model ◽  
Cfd Simulation ◽  
Cooling System ◽  
Cfd Simulations ◽  
Network Modelling ◽  
Cooling Systems ◽  
Content Type ◽  
System Configurations ◽  
Dielectric Insulation

Purpose The application of dry-type transformers is growing in the market because the technology is non-flammable, safer and environmentally friendly. However, the unit dimensions are normally larger and material costs become higher, as no oil is present for dielectric insulation or cooling. At designing stage, a transformer thermal model used for predicting temperature rise is fundamental and the modelling of cooling system is particularly important. This paper aims to describe a thermal model used to compute dry transformers with different cooling system configurations. Design/methodology/approach The paper introduces a fast-calculating thermal and pressure network model for dry-transformer cooling systems, preliminarily verified by analytical methods and advanced CFD simulations, and finally validated with experimental results. Findings This paper provides an overview of the network model of dry-transformer cooling system, describing its topology and its main variants including natural or forced ventilation, with or without cooling duct in the core, enclosure with roof and floor ventilation openings and air barriers. Finally, it presents a formulation for the new heat exchanger element. Originality/value The network approach presented in this paper allows to model efficiently the cooling system of dry-type transformers. This model is based on physical principles rather than empirical assessments that are valid only for specific transformer technologies. In comparison with CFD simulation approach, the network model runs much faster and the accuracies still fall in acceptable range; therefore, one is able to utilize this method in optimization procedures included in transformer design systems.

Review and Projections of Integrated Cooling Systems for Three-Dimensional Integrated Circuits

2014 ◽  
Vol 136 (2) ◽  
Author(s):  
Satish G. Kandlikar
Keyword(s):  
Hot Spots ◽  
Heat Dissipation ◽  
Cooling System ◽  
Mechanical Design ◽  
Heat Fluxes ◽  
Electrical Performance ◽  
Channel Height ◽  
Cooling Systems ◽  
3D Ic ◽  
Pressure Drops

In an effort to increase processor speeds, 3D IC architecture is being aggressively pursued by researchers and chip manufacturers. This architecture allows extremely high level of integration with enhanced electrical performance and expanded functionality, and facilitates realization of VLSI and ULSI technologies. However, utilizing the third dimension to provide additional device layers poses thermal challenges due to the increased heat dissipation and complex electrical interconnects among different layers. The conflicting needs of the cooling system requiring larger flow passage dimensions to limit the pressure drop, and the IC architecture necessitating short interconnect distances to reduce signal latency warrant paradigm shifts in both of their design approach. Additional considerations include the effects due to temperature nonuniformity, localized hot spots, complex fluidic connections, and mechanical design. This paper reviews the advances in 3D IC cooling in the last decade and provides a vision for codesigning 3D IC architecture and integrated cooling systems. For heat fluxes of 50–100 W/cm2 on each side of a chip in a 3D IC package, the current single-phase cooling technology is projected to provide adequate cooling, albeit with high pressure drops. For future applications with coolant surface heat fluxes from 100 to 500 W/cm2, significant changes need to be made in both electrical and cooling technologies through a new level of codesign. Effectively mitigating the high temperatures surrounding local hot spots remains a challenging issue. The codesign approach with circuit, software and thermal designers working together is seen as essential. The through silicon vias (TSVs) in the current designs place a stringent limit on the channel height in the cooling layer. It is projected that integration of wireless network on chip architecture could alleviate these height restrictions since the data bandwidth is independent of the communication lengths. Microchannels that are 200 μm or larger in depth are expected to allow dissipation of large heat fluxes with significantly lower pressure drops.

Analysis and Design of Liquid-Cooling Systems Using Flow Network Modeling (FNM)

2003 ◽  
Author(s):  
Kanchan M. Kelkar ◽  
Suhas V. Patankar
Keyword(s):  
Cooling System ◽  
Network Modeling ◽  
Thermal Characteristics ◽  
Flow Distribution ◽  
Computer Applications ◽  
Liquid Cooling ◽  
Cooling Systems ◽  
Flow Network ◽  
Analysis And Design ◽  
Liquid Cooling System

Liquid cooling is used for thermal management of electronics in defense, power, medical, and computer applications due to the increasing power density and the desire for compact packaging. The objectives in the design of these systems are to create a sufficient amount of total flow and to appropriately distribute the flow so as to maintain the electronic component temperatures at the desired level. The technique of Flow Network Modeling (FNM) is ideally suited for the analysis of flow distribution and heat transfer in liquid-cooling systems. The FNM technique uses overall flow and thermal characteristics to represent the behavior of individual components. Therefore, solution of conservation equations over the network enables efficient prediction of the flow rates, pressures, and temperatures in a complete liquid-cooling system. This article describes the technical basis of the FNM technique and illustrates its application in the design of a distributed-flow cold plate and of a complete water-cooled system. The study demonstrates the utility of the FNM technique for rapid and accurate evaluation of different design options and the ensuing productivity benefits in the design of liquid cooling systems.

Three Dimensional CFD Simulation of Condensation Inside Inclined Tubes

2017 ◽  
Author(s):  
Amirhosein Moonesi Shabestary ◽  
Eckhard Krepper ◽  
Dirk Lucas ◽  
Thomas Höhne
Keyword(s):  
Heat Transfer ◽  
Annular Flow ◽  
Cfd Simulation ◽  
Cooling System ◽  
Heat Removal ◽  
Normal Operation ◽  
Cooling Systems ◽  
Horizontal Pipes ◽  
Subcooled Water ◽  
Operation Conditions

The current paper comprises CFD-modelling and simulation of condensation and heat transfer inside horizontal pipes. Designs of future nuclear boiling water reactor concepts are equipped with emergency cooling systems which are passive systems for heat removal. The emergency cooling system consists of slightly inclined horizontal pipes which are immersed in a tank of subcooled water. At normal operation conditions, the pipes are filled with water and no heat transfer to the secondary side of the condenser occurs. In the case of an accident the water level in the core is decreasing, steam comes in the emergency pipes and due to the subcooled water around the pipe, this steam will condense. The emergency condenser acts as a strong heat sink which is responsible for a quick depressurization of the reactor core when any accident happens. The actual project is defined in order to model all these processes which happen in the emergency cooling systems. The most focus of the project is on detection of different morphologies such as annular flow, stratified flow, slug flow and plug flow. The first step is the investigation of condensation inside a horizontal tube by considering the direct contact condensation (DCC). Therefore, at the inlet of the pipe an annular flow is assumed. In this step, the Algebraic Interfacial Area Density (AIAD) model is used in order to simulate the interface. The second step is the extension of the model to consider wall condensation effect as well which is closer to the reality. In this step, the inlet is pure steam and due to the wall condensation, a liquid film occurs near the wall which leads to annular flow. The last step will be modelling of different morphologies which are occurring inside the tube during the condensation via using the Generalized Two-Phase Flow (GENTOP) model extended by heat and mass transfer. By using GENTOP the dispersed phase is able to be considered and simulated. Finally, the results of the simulations will be validated by experimental data which will be available in HZDR. In this paper the results of the first part has been presented.

scholarly journals Improving the cooling systems of automotive engines and methods for monitoring their condition

2021 ◽  
pp. 41-44
Author(s):  
E.P. Parlyuk ◽  
Keyword(s):  
Mathematical Model ◽  
Heat Exchanger ◽  
Heat Dissipation ◽  
Cooling System ◽  
Quantitative Relationship ◽  
Thermal Processes ◽  
Structural Diagram ◽  
Cooling Systems ◽  
Automotive Engines ◽  
Machine Operation

It has been established that the cooling system of modern tractors and trucks can include 5 to 7 independent cooling circuits. A structural diagram of a modular cooling system for automotive engines and a mathematical model of thermal processes in a heat exchanger of the modular cooling system during machine operation are proposed. It is shown that the development of an algorithm for predicting and monitoring the state of the modular cooling system is possible based on a quantitative relationship between the rate of decrease in heat dissipation capacity and the duration of machine operation.

Assessment of thermal behavior of a cooling system to reduce thermal fatigue cracks in aluminum injection molds

2020 ◽  
pp. 75-86
Author(s):  
Sergio Antonio Camargo ◽  
Lauro Correa Romeiro ◽  
Carlos Alberto Mendes Moraes
Keyword(s):  
Thermal Fatigue ◽  
Cooling System ◽  
Fatigue Cracks ◽  
Cooling Water ◽  
Thermal Conditions ◽  
Thermal Gradients ◽  
Ansys Software ◽  
Cooling Systems ◽  
Thermal Fatigue Cracks ◽  
Number Of Cycles

The present article aimed to test changes in cooling water temperatures of males, present in aluminum injection molds, to reduce failures due to thermal fatigue. In order to carry out this work, cooling systems were studied, including their geometries, thermal gradients and the expected theoretical durability in relation to fatigue failure. The cooling system tests were developed with the aid of simulations in the ANSYS software and with fatigue calculations, using the method of Goodman. The study of the cooling system included its geometries, flow and temperature of this fluid. The results pointed to a significant increase in fatigue life of the mold component for the thermal conditions that were proposed, with a significant increase in the number of cycles, to happen failures due to thermal fatigue.

scholarly journals Numerical Study of a Cooling System Using Phase Change of a Refrigerant in a Thermosyphon

Energies ◽  
2021 ◽  
Vol 14 (12) ◽  
pp. 3634
Author(s):  
Grzegorz Czerwiński ◽  
Jerzy Wołoszyn
Keyword(s):  
Mass Transfer ◽  
Phase Change ◽  
Heat Dissipation ◽  
Cooling System ◽  
Numerical Study ◽  
Relaxation Parameter ◽  
Phase Changes ◽  
Transfer Time ◽  
Two Phase ◽  
Time Relaxation

With the increasing trend toward the miniaturization of electronic devices, the issue of heat dissipation becomes essential. The use of phase changes in a two-phase closed thermosyphon (TPCT) enables a significant reduction in the heat generated even at high temperatures. In this paper, we propose a modification of the evaporation–condensation model implemented in ANSYS Fluent. The modification was to manipulate the value of the mass transfer time relaxation parameter for evaporation and condensation. The developed model in the form of a UDF script allowed the introduction of additional source equations, and the obtained solution is compared with the results available in the literature. The variable value of the mass transfer time relaxation parameter during condensation rc depending on the density of the liquid and vapour phase was taken into account in the calculations. However, compared to previous numerical studies, more accurate modelling of the phase change phenomenon of the medium in the thermosyphon was possible by adopting a mass transfer time relaxation parameter during evaporation re = 1. The assumption of ten-fold higher values resulted in overestimated temperature values in all sections of the thermosyphon. Hence, the coefficient re should be selected individually depending on the case under study. A too large value may cause difficulties in obtaining the convergence of solutions, which, in the case of numerical grids with many elements (especially three-dimensional), significantly increases the computation time.

Remote Heat Pipe Based Heat Exchanger Performance in Notebook Cooling

2005 ◽  
Author(s):  
Seyyed Khandani ◽  
Himanshu Pokharna ◽  
Sridhar Machiroutu ◽  
Eric DiStefano
Keyword(s):  
Heat Exchanger ◽  
Thermal Resistance ◽  
Heat Pipe ◽  
Cooling System ◽  
Temperature Drop ◽  
Operating Conditions ◽  
Cooling Systems ◽  
Temperature Variations ◽  
Non Linear ◽  
Condenser Temperature

Remote heat pipe based heat exchanger cooling systems are becoming increasingly popular in cooling of notebook computers. In such cooling systems, one or more heat pipes transfer the heat from the more populated area to a location with sufficient space allowing the use of a heat exchanger for removal of the heat from the system. In analsysis of such systems, the temperature drop in the condenser section of the heat pipe is assumed negligible due to the nature of the condensation process. However, in testing of various systems, non linear longitudinal temperature drops in the heat pipe in the range of 2 to 15 °C, for different processor power and heat exchanger airflow, have been measured. Such temperature drops could cause higher condenser thermal resistance and result in lower overall heat exchanger performance. In fact the application of the conventional method of estimating the thermal performance, which does not consider such a nonlinear temperature variations, results in inaccurate design of the cooling system and requires unnecessarily higher safety factors to compensate for this inaccuracy. To address the problem, this paper offers a new analytical approach for modeling the heat pipe based heat exchanger performance under various operating conditions. The method can be used with any arbitrary condenser temperature variations. The results of the model show significant increase in heat exchanger thermal resistance when considering a non linear condenser temperature drop. The experimental data also verifies the result of the model with sufficient accuracy and therefore validates the application of this model in estimating the performance of these systems.   This paper was also originally published as part of the Proceedings of the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems.

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