Fabrication of high melting point joint using Sn-57Bi-1Ag low temperature lead-free solder and gold-plated electrode

2017 ◽  
Author(s):  
Yuki Maruya ◽  
Hanae Hata ◽  
Ikuo Shohji ◽  
Shinji Koyama
Keyword(s):  
Melting Point ◽  
Low Temperature ◽  
Lead Free ◽  
Lead Free Solder ◽  
High Melting ◽  
High Melting Point ◽  
Free Solder

Evaluation of Emerging High Melting Point Lead-free Solder and Hybrid Sinter Paste as Attaching Material for Clip Bond Package

2020 ◽  
Vol 2020 (1) ◽  
pp. 000235-000241
Author(s):  
Fred Fuliang Le ◽  
Rinse van der Meulen ◽  
Yoon Kheong Leong ◽  
Manoj Balakrishnan ◽  
Zunyu Guan
Keyword(s):  
Melting Point ◽  
Lead Free ◽  
Lead Free Solder ◽  
Reliability Testing ◽  
High Melting ◽  
High Melting Point ◽  
Basic Scheme ◽  
Free Solder ◽  
Lead Free Solders ◽  
High Lead

Abstract High melting point (HMP) lead-free solder, hybrid sinter and transient liquidus phase sinter (TLPS) are the emerging lead-free alternatives for the potential replacement of high-lead solder. Lead-free solder is perfectly compatible with existing high-lead soldering processes for clip bond packages. The benefit of hybrid sinter is that it has much higher thermal and electrical conductivity than lead-free or high-lead solder. In this study, ten materials (including lead-free solders, hybrid sinter paste and TLPS) were first evaluated via die shear test. With the initial material screening, two lead-free solders (solder 1 and 2), two hybrid Ag sinter pastes (sinter i and ii) and one TLPS proceeded to internal sample assembly. For the lead-free solders, a process optimization with the aid of vacuum reflow was made to reduce void rate. Due to the slow and unbalanced inter-diffusion of Ag-Cu sintering than Ag-Ag sintering, optimizations to enhance the hybrid Ag sintering include Ag finishing for the die metallization and Ag plating for the clip and bond area of the leadframe. In 0-hour package electrical test, solder 1 and sinter i passed and were sent for reliability testing while solder 2, sinter ii and TLPS failed due to intermetallic compound (IMC) cracking, material bleeding and die cracking, respectively. In the reliability testing, a basic scheme of thermal cycling (TC) 1000 cycles, intermittent operating life (IOL) 750 hrs and highly accelerated temperature and humidity stress test (HAST) 96 hrs was defined for the early feasibility study. 1 of 75 sinter i units failed by TC 1000 cycles due to separation between silver sinter structure and die bottom metallization. Solder 1 passed the basic scheme without defects, and next the material workability and clip bond strength need to be improved to the equivalent level of high-lead solders.

scholarly journals Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging

2015 ◽  
Vol 2015 ◽  
pp. 1-16 ◽  
Author(s):  
Lei Sun ◽  
Liang Zhang
Keyword(s):  
Mechanical Properties ◽  
Alloying Elements ◽  
Lead Free ◽  
Lead Free Solder ◽  
High Melting ◽  
High Melting Point ◽  
Good Reliability ◽  
Snagcu Solder ◽  
Free Solder ◽  
Lead Free Solders

SnAgCu solder alloys were considered as one of the most popular lead-free solders because of its good reliability and mechanical properties. However, there are also many problems that need to be solved for the SnAgCu solders, such as high melting point and poor wettability. In order to overcome these shortcomings, and further enhance the properties of SnAgCu solders, many researchers choose to add a series of alloying elements (In, Ti, Fe, Zn, Bi, Ni, Sb, Ga, Al, and rare earth) and nanoparticles to the SnAgCu solders. In this paper, the work of SnAgCu lead-free solders containing alloying elements and nanoparticles was reviewed, and the effects of alloying elements and nanoparticles on the melting temperature, wettability, mechanical properties, hardness properties, microstructures, intermetallic compounds, and whiskers were discussed.

Effect of aluminum content on structure, transport and mechanical properties of Sn-Zn eutectic lead free solder alloy rapidly solidified from melt.

2015 ◽  
Vol 10 (1) ◽  
pp. 2641-2648
Author(s):  
Rizk Mostafa Shalaby ◽  
Mohamed Munther ◽  
Abu-Bakr Al-Bidawi ◽  
Mustafa Kamal
Keyword(s):  
Mechanical Properties ◽  
Melting Point ◽  
Lead Free ◽  
Al Alloy ◽  
Lead Free Solder ◽  
Pronounced Increase ◽  
Mass Unit ◽  
Size Refinement ◽  
Free Solder ◽  
Lead Free Solders

The greatest advantage of Sn-Zn eutectic is its low melting point (198 oC) which is close to the melting point. of Sn-Pb eutectic solder (183 oC), as well as its low price per mass unit compared with Sn-Ag and Sn-Ag-Cu solders. In this paper, the effect of 0.0, 1.0, 2.0, 3.0, 4.0, and 5.0 wt. % Al as ternary additions on melting temperature, microstructure, microhardness and mechanical properties of the Sn-9Zn lead-free solders were investigated. It is shown that the alloying additions of Al at 4 wt. % to the Sn-Zn binary system lead to lower of the melting point to 195.72 ˚C.  From x-ray diffraction analysis, an aluminium phase, designated α-Al is detected for 4 and 5 wt. % Al compositions. The formation of an aluminium phase causes a pronounced increase in the electrical resistivity and microhardness. The ternary Sn-9Zn-2 wt.%Al exhibits micro hardness superior to Sn-9Zn binary alloy. The better Vickers hardness and melting points of the ternary alloy is attributed to solid solution effect, grain size refinement and precipitation of Al and Zn in the Sn matrix.  The Sn-9%Zn-4%Al alloy is a lead-free solder designed for possible drop-in replacement of Pb-Sn solders.  

Facile synthesis of high‐melting point spherical TiC and TiN powders at low temperature

2019 ◽  
Vol 103 (2) ◽  
pp. 889-898 ◽  
Author(s):  
Maoqiao Xiang ◽  
Miao Song ◽  
Qingshan Zhu ◽  
Chaoquan Hu ◽  
Yafeng Yang ◽  
...  
Keyword(s):  
Melting Point ◽  
Low Temperature ◽  
High Melting ◽  
High Melting Point ◽  
Facile Synthesis

Development of Toughened, Fine Grained, Recrystallized W-1.1%TiC

2021 ◽  
Vol 1024 ◽  
pp. 103-109
Author(s):  
Shunsuke Makimura ◽  
Hiroaki Kurishita ◽  
Koichi Niikura ◽  
Hun Chea Jung ◽  
Hiroyuki Ishizaki ◽  
...  
Keyword(s):  
Melting Point ◽  
Low Temperature ◽  
Fracture Strength ◽  
Room Temperature ◽  
Target Material ◽  
High Density ◽  
High Melting ◽  
High Melting Point ◽  
Irradiation Embrittlement ◽  
Fine Grained

Tungsten (W) is a principal candidate as target material because of its high density and extremely high melting point. W inherently has a critical disadvantage of its brittleness at around room temperature (low temperature brittleness), recrystallization embrittlement, and irradiation embrittlement. TFGR (Toughened, Fine Grained, Recrystallized) W-1.1%TiC has been considered as a realized solution to the embrittlement problems. We started to fabricate TFGR W-1.1%TiC in 2016 under collaboration between KEK and Metal Technology Co. LTD (MTC). The TFGR W-1.1%TiC samples were successfully fabricated in June, 2018. As a result, the specimen showed slight bend ductility and 2.6 GPa of fracture strength.

Effect of Sb additions on the creep behaviour of low temperature lead-free Sn–8Zn–3Bi solder alloy

2020 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Guang Ren ◽  
Maurice Collins
Keyword(s):  
Low Temperature ◽  
Solder Alloy ◽  
Creep Behaviour ◽  
Lead Free ◽  
Coefficient Of Determination ◽  
Secondary Creep ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Content Type ◽  
Free Solder

Purpose This paper aims to investigate the creep behaviour of the recently developed Sn–8Zn–3Bi–xSb (x = 0, 0.5, 1.0 and 1.5) low temperature lead-free solder alloys. Design/methodology/approach An in-house compressive test rig was developed to perform creep tests under stresses of 20–40 MPa and temperature range 25°C–75 °C. Dorn power law and Garofalo hyperbolic sine law were used to model the secondary creep rate. Findings High coefficient of determination R2 of 0.99 is achieved for both the models. It was found that the activation energy of Sn–8Zn–3Bi solder alloy can be significantly increased with addition of Sb, by 60% to 90 kJ/mol approximately, whereas the secondary creep exponent falls in the range 3–7. Improved creep resistance is attributed to solid solution strengthening introduced by micro-alloying. Creep mechanisms that govern the deformation of these newly developed lead-free solder alloys have also been proposed. Originality/value The findings are expected to fill the gap of knowledge on creep behaviour of these newly developed solder alloys, which are possible alternatives as lead-free interconnecting material in low temperature electronic assembly.

Cu-Cu low temperature bonding based on lead-free solder with graphene interlayer

2019 ◽  
Vol 115 (12) ◽  
pp. 122102 ◽  
Author(s):  
Wenhua Yang ◽  
Jie Zhou ◽  
Xinyuan Jiang ◽  
Ximing Ye ◽  
Xiaofeng Xuan ◽  
...  
Keyword(s):  
Low Temperature ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder ◽  
Low Temperature Bonding
Sign in / Sign up

Export Citation Format

Share Document