Validity-Study of Commercial Semiconductor with TO-18 Package for Space Application by PIND Test
Keyword(s):
X Ray
◽
Abstract In this paper, we carried out PIND (Particle Impact Noise Detection) test and X-ray inspection of a transistor in a TO-18 package for commercial and industrial applications. From our evaluation results, we explain the validity of the PIND test by comparing PIND test and X-ray inspection results. We make clear that PIND test is able to detect internal foreign material that may be transparent to X-ray inspection. In addition, we report analysis results of internal foreign materials from defective devices. This matter suggests that a problem is contamination control in the manufacturing process, most likely the sealing process.
1975 ◽
Vol 30
(6)
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pp. 285-289
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Basis-Material Decomposition X-ray Imaging Using Multi-layered Detectors for Industrial Applications
2021 ◽
Vol 45
(7)
◽
pp. 531-541
Keyword(s):
X Ray
◽
2021 ◽